Presentation - HFSS™ Simulation of a Test Board to Improve ...

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Overview � HFSS Versatility – Basic HFSS geometry can be used to evaluate alternative socket and socket materials � Simulations of a “direct attach” of the module to the PCB using BGA solder balls also completed – Customers will evaluate the Ditrans’ receiver directly attached to a reference board – Ditrans can account for the impacts of the reference board on measurements with HFSS board simulations – HFSS simulations can account for performance variations with and without epoxy underfill beneath the module Slide 4
SiP Return Loss at Test Board Input HFSS board & socket simulation provides the best agreement Slide 5
Page 1 and 2: Design of a Custom Printed Circuit
Page 3: Overview � Mass production effort
Page 7 and 8: Test Board with Socket Attached Are
Page 9 and 10: Test Board and Socket HFSS Model Sl
Page 11 and 12: Model Components � SMA - No shell
Page 13 and 14: Model Components � PCB with micro
Page 15 and 16: Model Components � Socket (cont
Page 17 and 18: Return Loss for Matched Load - Meas
Page 19 and 20: Return Loss for Open Circuit Load -
Page 21 and 22: Return Loss for Short Circuit Load
Page 23 and 24: Issues � Board impedance in desig
Page 25 and 26: Conclusion � Model of test board

Presentation - HFSS™ Simulation of a Test Board to Improve ...

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