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Presentation - HFSS™ Simulation of a Test Board to Improve ...

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Overview<br />

� HFSS Versatility<br />

– Basic HFSS geometry can be used <strong>to</strong> evaluate alternative<br />

socket and socket materials<br />

� <strong>Simulation</strong>s <strong>of</strong> a “direct attach” <strong>of</strong> the module <strong>to</strong> the<br />

PCB using BGA solder balls also completed<br />

– Cus<strong>to</strong>mers will evaluate the Ditrans’ receiver directly<br />

attached <strong>to</strong> a reference board<br />

– Ditrans can account for the impacts <strong>of</strong> the reference board<br />

on measurements with HFSS board simulations<br />

– HFSS simulations can account for performance variations<br />

with and without epoxy underfill beneath the module<br />

Slide 4

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