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Presentation - HFSS™ Simulation of a Test Board to Improve ...

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Measurements<br />

� Matched, open, and short load at package interface<br />

� 50 ohm chip resis<strong>to</strong>r contacting the RF input and a<br />

ground connection with pressure applied by a pencil<br />

eraser<br />

� Open air isolation<br />

� Short circuit with a thin gauge wire<br />

� Input return loss measured at SMA<br />

Slide 16

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