Presentation - HFSS™ Simulation of a Test Board to Improve ...

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Model Components � Socket – Simplified socket model – Design includes an RF input trace surrounded by GND BGA pads – HFSS consistent with manufacturer's model based on measured results – HFSS representation closely fits our socket application unlike the manufacturer’s generalized model Slide 14
Model Components � Socket (cont’d) – Lumped gap source port between RF input pad and a single GND pad sufficient – Socket ground pads grounded <strong>to</strong> background through PCB ground – consistent with grounding scheme in test (with board ground tied <strong>to</strong> earth ground) – Ground bounce and other issues should be considered in design Simple lumped gap source between BGA pads works! Slide 15
Page 1 and 2: Design of a Custom Printed Circuit
Page 3 and 4: Overview � Mass production effort
Page 5 and 6: SiP Return Loss at Test Board Input
Page 7 and 8: Test Board with Socket Attached Are
Page 9 and 10: Test Board and Socket HFSS Model Sl
Page 11 and 12: Model Components � SMA - No shell
Page 13: Model Components � PCB with micro
Page 17 and 18: Return Loss for Matched Load - Meas
Page 19 and 20: Return Loss for Open Circuit Load -
Page 21 and 22: Return Loss for Short Circuit Load
Page 23 and 24: Issues � Board impedance in desig
Page 25 and 26: Conclusion � Model of test board

Presentation - HFSS™ Simulation of a Test Board to Improve ...

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