Technical Product Specification for Canoe Pass - Preminary - Intel

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Intel® Server Board S2600CP Functional Architecture Intel ® Server Board S2600CP and Server System P4000CP TPS Ranks Per DIMM & Data Width 32 Supported and Validated Supported but not Validate Table 5. RDIMM Support Guidelines (Preliminary. Subject to Change) Memory Capacity Per DIMM1 Speed (MT/s) and Voltage Validated by Slot per Channel (SPC) and DIMM Per Channel (DPC)2 1 Slot per Channel 2 Slots per Channel 1DPC 1DPC 2DPC 1.35V 1.5V 1.35V 1.5V 1.35V 1.5V SRx8 1GB 2GB 4GB 1066, 1333 1066, 1333, 1600 1066, 1333 1066, 1333, 1600 1066 1066, 1333, 1600 DRx8 2GB 4GB 8GB 1066, 1333 1066, 1333, 1600 1066, 1333 1066, 1333, 1600 1066 1066, 1333, 1600 SRx4 2GB 4GB 8GB 1066, 1333 1066, 1333, 1600 1066, 1333 1066, 1333, 1600 1066 1066, 1333, 1600 DRx4 4GB 8GB 16GB 1066, 1333 1066, 1333, 1600 1066, 1333 1066, 1333, 1600 1066 1066, 1333, 1600 QRx4 8GB 16GB 32GB QRx8 800 1066 800 1066 800 800 4GB 8GB 16GB 800 1066 800 1066 800 800 Notes: 1. Supported DRAM Densities are 1Gb, 2Gb, and 4Gb. Only 2Gb and 4Gb are validated by Intel ® . 2. Command Address Timing is 1N Supported and Validated Supported but not Validate TBD Intel Confidential Revision 0.8 Intel order number G26942-003
Intel ® Server Board S2600CP and Server System P4000CP TPS Intel® Server Board S2600CP Functional Architecture Ranks Per DIMM & Data Width1 QRx4 (DDP) 6 Table 6. LRDIMM Support Guidelines (Preliminary. Subject to Change) Memory Capacity Per DIMM2 Speed (MT/s) and Voltage Validated by Slot per Channel (SPC) and DIMM Per Channel (DPC)3,4,5 1 Slot per Channel 2 Slots per Channel 1DPC 1DPC and 2DPC 1.35V 1.5V 1.35V 1.5V 16GB 32GB 1066, 1333 1066, 1333 1066 1066, 1333 QRx8 (P) 6 Notes: 8GB 16GB 1066, 1333 1066, 1333 1066 1066, 1333 1. Physical Rank is used to calculate DIMM Capacity 2. Supported and calidated DRAM Densities are 2Gb and 4Gb 3. Command address timing is 1N 4. The speeds are estimated targets and will be verified through simulation 5. For 3SPC/3DPC – Rank Multiplication (RM) >=2 6. DDP – Dual Die Package DRAM stacking. P – Planar monolithic DRAM Dies. Supported and Validated 4.2.2.2 Memory Population Rules Each processor provides four banks of memory, each capable of supporting up to 2 DIMMs. DIMMs are organized into physical slots on DDR3 memory channels that belong to processor sockets. The memory channels from processor socket 1 are identified as Channel A, B, C and D. The memory channels from processor socket 2 are identified as Channel E, F, G, and H. The silk screened DIMM slot identifiers on the board provide information about the channel, and therefore the processor to which they belong. For example, DIMM_A1 is the first slot on Channel A on processor 1; DIMM_E1 is the first DIMM socket on Channel E on processor 2. The memory slots associated with a given processor are unavailable if the corresponding processor socket is not populated. A processor may be installed without populating the associated memory slots provided and a second processor is installed with associated memory. In this case, the memory is shared by the processors. However, the platform suffers performance degradation and latency due to the remote memory. Processor sockets are self-contained and autonomous. However, all memory subsystem support (such as Memory RAS, Error Management,) in the BIOS setup are applied commonly across processor sockets. On the Intel ® Server Board S2600CP a total of 16 DIMM slots are provided (2 CPUs – 4 Channels/CPU, 2 DIMMs /Channel). The nomenclature for DIMM sockets is detailed in the following table: Revision 0.8 Intel Confidential Intel order number G26942-003 33
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Technical Product Specification for Canoe Pass - Preminary - Intel

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