2000-01-0017 Implementation of Lead-Free Solder for ... - Delphi
2000-01-0017 Implementation of Lead-Free Solder for ... - Delphi
2000-01-0017 Implementation of Lead-Free Solder for ... - Delphi
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SAE TECHNICAL<br />
PAPER SERIES <strong>2000</strong>-<strong>01</strong>-0<strong>01</strong>7<br />
<strong>Implementation</strong> <strong>of</strong> <strong>Lead</strong>-<strong>Free</strong> <strong>Solder</strong><br />
<strong>for</strong> Automotive Electronics<br />
Brenda B. Baney, Pascal Bezier, Michael S. Campbell, Richard D. Parker,<br />
Pamela A. Sneller, Delbert R. Walls, Matthew R. Walsh,<br />
Richard L. Whiteside and Gordon C. Whitten<br />
<strong>Delphi</strong> Automotive Systems<br />
Reprinted From: Environmental Concepts <strong>for</strong> the Automotive Industry<br />
(SP–1542)<br />
SAE <strong>2000</strong> World Congress<br />
Detroit, Michigan<br />
March 6-9, <strong>2000</strong><br />
400 Commonwealth Drive, Warrendale, PA 15096-00<strong>01</strong> U.S.A. Tel: (724) 776-4841 Fax: (724) 776-5760
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1<br />
<strong>2000</strong>-<strong>01</strong>-0<strong>01</strong>7<br />
<strong>Implementation</strong> <strong>of</strong> <strong>Lead</strong>-<strong>Free</strong> <strong>Solder</strong> <strong>for</strong> Automotive Electronics<br />
Copyright © <strong>2000</strong> Society <strong>of</strong> Automotive Engineers, Inc.<br />
ABSTRACT<br />
<strong>Lead</strong>-free solders <strong>for</strong> electronics have been actively pursued<br />
since the early 1990’s here and abroad <strong>for</strong> environmental,<br />
legislative, and competitive reasons. The<br />
National Center <strong>for</strong> Manufacturing Sciences (NCMS-<br />
US) 1 , the International Tin Research Institute (ITRI-UK) 2 ,<br />
Swedish Institute <strong>of</strong> Production Engineering Research<br />
(IVF-Sweden) 3 , Japan Institute <strong>of</strong> Electronics Packaging<br />
(JIEP Japan) 4 , Improved Design Life and Environmentally<br />
Aware Manufacture <strong>of</strong> Electronics Assemblies by<br />
<strong>Lead</strong>-free <strong>Solder</strong>ing (IDEALS-Europe) 5 , and, more<br />
recently, the National Electronics Manufacturing Initiative<br />
(NEMI-US) 6 have been aggressively seeking lead-free<br />
solutions<br />
The automotive industry has some unique requirements<br />
that demand extensive testing <strong>of</strong> new materials and processes<br />
prior to implementation. The specific steps taken<br />
at <strong>Delphi</strong> Automotive Systems with lead-free solder will<br />
be described along with the lessons learned along the<br />
way. This includes the alloy down-selection which lead to<br />
several interesting alloys. Product emulator builds will be<br />
described beginning with hand-assembled units which<br />
were used to demonstrate product viability on to production<br />
line builds which were used to assess manufacturing<br />
challenges. Finally, any remaining roadblocks to full<br />
implementation will be described along with the plans to<br />
eliminate them.<br />
1<br />
Project 04<strong>01</strong>RE96, National Center <strong>for</strong> Manufacturing Sciences,<br />
3025 Boardwalk, Ann Arbor, Michigan 48108-<br />
3266, www.ncms.org<br />
2 ITRI Ltd, Kingston Lane, Uxbridge, Middlesex, UB8 3PJ,<br />
UK.. www.itri.co.uk/index.htm<br />
Brenda B. Baney, Pascal Bezier, Michael S. Campbell, Richard D. Parker,<br />
Pamela A. Sneller, Delbert R. Walls, Matthew R. Walsh,<br />
Richard L. Whiteside and Gordon C. Whitten<br />
<strong>Delphi</strong> Automotive Systems<br />
INTRODUCTION<br />
3<br />
Institutet för Verkstadsteknisk Forskning, Argongatan 30,<br />
SE-431 53 Mölndal, Sweden, www.ivf.se<br />
4 Japan Institute <strong>of</strong> Electronic Packaging, 3-12-2 NIshiogikita,<br />
Suginami-ku, Tokyo 167-0042, Japan, www.jiep.or.jp<br />
5 Brite/EuRam III, Project number BE95-1994, D M Jacobson<br />
& M R Harrison, GEC J Research, 14(2), 1997,<br />
www.cordis.lu/brite-euram/src/1994.htm<br />
6 National Electronics Manufacturing Initiative, 2214 Rock<br />
Hill Road, Suite 110, Herndon, VA 2<strong>01</strong>70-4214,<br />
www.nemi.org 7 See www.lead-free.org<br />
Based on the $10 million spent on the NCMS project during<br />
the period 1992-1996; the electronics companies are<br />
very interested in achieving lead-free products. The goal<br />
<strong>of</strong> that project was to develop lead-free alternatives <strong>for</strong><br />
electronic interconnection. A drop-in replacement <strong>for</strong> the<br />
eutectic SnPb solder was not identified, however, many<br />
alloy alternatives have since been investigated by electronics<br />
companies worldwide.<br />
In late 1997, there was renewed interest in lead-free electronics<br />
because <strong>of</strong> European Union draft directives on<br />
End-<strong>of</strong>-Life Vehicles (ELV) and Waste From Electric and<br />
Electronic Equipment (WEEE) 7 . These draft directives<br />
have specific material bans aimed at the use <strong>of</strong> lead in<br />
both transportation and electronics. While the ELV directive<br />
has an exemption <strong>for</strong> lead used in solder <strong>for</strong> electronics,<br />
the pending WEEE directive proposes to ban lead<br />
metal in electronics beginning in January 2004. Although<br />
this deadline may be postponed, many electronics manufacturers<br />
are pursuing lead-free manufacturing solutions.<br />
There are numerous announcements from major<br />
Japanese electronics manufacturers concerning the<br />
reduction or elimination <strong>of</strong> lead from solder in the 20<strong>01</strong><br />
timeframe.<br />
A recent ef<strong>for</strong>t has been the <strong>for</strong>mation <strong>of</strong> a <strong>Lead</strong> <strong>Free</strong><br />
Task Group within the NEMI organization with a goal to<br />
provide a lead-free solution by 20<strong>01</strong>. The tasks were<br />
divided into five subgroups: Industry Awareness, Components,<br />
<strong>Solder</strong> Alloy Selection, <strong>Solder</strong> Reliability, and Environmental<br />
Legislation Monitor. The output <strong>of</strong> the solder<br />
alloy selection group <strong>for</strong> recommended solder replacements<br />
will drive the component groups recommendation<br />
to suppliers with regard to higher processing temperature<br />
needs <strong>for</strong> electronic components. The combination <strong>of</strong><br />
these two groups ef<strong>for</strong>ts will be assessed in the reliability<br />
subgroup including test parameters approximating automotive<br />
environments. Preliminary results are expected<br />
from this Task Group in the last quarter <strong>of</strong> <strong>2000</strong>.
HISTORY<br />
<strong>Delphi</strong> Delco Electronics Systems has been quietly pursuing<br />
lead-free electronics since our first <strong>for</strong>ay into the<br />
field in the early 90s. We have completed a down selection<br />
process and per<strong>for</strong>med numerous manufacturing trials<br />
with a proposed lead-free alternative. The major<br />
obstacles to lead-free soldering; modifying current circuit<br />
board, component, and process materials to tolerate<br />
higher temperature exposure, along with new characterization<br />
<strong>of</strong> manufacturing and product reliability are currently<br />
being addressed.<br />
In the early 1990’s, <strong>Delphi</strong> Delco Electronics began working<br />
with lead-free solder. Initial alloy development has<br />
been described previously. 8 During the NCMS alloy<br />
selection activities, a hand-assembled Electric Vehicle<br />
Power Control Module was produced which was fully<br />
functional. In the late 1990’s, a serious ef<strong>for</strong>t was<br />
focussed on a lead-free radio receiver board which has<br />
also been described previously.<br />
Figure 1. <strong>Lead</strong>-free Automotive Radio Receiver Board<br />
The lead-free radio receiver boards passed all <strong>of</strong> our<br />
product validation testing. In fact, the thermal shock testing<br />
led to some surprising results. Thermal shock tests<br />
which are normally applied to electronic components are<br />
very difficult <strong>for</strong> an electronic module to survive. The differing<br />
CTE’s <strong>of</strong> the organic laminate material and the solder/lead<br />
<strong>of</strong>ten results in solder joint cracking as shown in<br />
Figure 2. The surprise is shown in Figure 3. In this case<br />
the <strong>Lead</strong>-free alloy showed no cracking though they both<br />
experienced the same thermal shock. This success led<br />
to further work in a full manufacturing environment.<br />
8 <strong>Lead</strong> <strong>Free</strong> <strong>Solder</strong> <strong>for</strong> Automotive Electronics, G Whitten,<br />
Design and Manufacture <strong>for</strong> the Environment (SP-1342),<br />
SAE, 400 Commonwealth Drive, Warrendale, PA 15096-<br />
00<strong>01</strong>, USA<br />
2<br />
Figure 2. Normal Eutectic SnPb Joint Following<br />
Thermal Shock<br />
Figure 3. <strong>Lead</strong>-free <strong>Solder</strong> Joint Without Cracks<br />
In 1998, a joint ef<strong>for</strong>t was initiated with <strong>Delphi</strong>’s Texton<br />
operation in Brittany, France. In this case, a current production<br />
keyfob (Figure 4) was used as a test vehicle to<br />
learn if there would be any surprises in a full manufacturing<br />
process.<br />
Figure 4. <strong>Lead</strong>-free Keyfob<br />
In this case, the keyfob was manufactured on a normal<br />
manufacturing line. The PWB surface finish was<br />
changed, the alloy was changed, and the thermal pr<strong>of</strong>ile<br />
<strong>for</strong> the reflow oven was changed. Otherwise normal production<br />
techniques were used.
The keyfob again easily passed the customers product<br />
validation tests.<br />
In the process <strong>of</strong> optimizing the reflow pr<strong>of</strong>ile <strong>for</strong> the keyfob,<br />
the pr<strong>of</strong>ile was altered based upon study <strong>of</strong> the joints<br />
resulting from the initial keyfob builds. Earlier work on the<br />
NCMS <strong>Lead</strong>-free project may have been reflowed with a<br />
pr<strong>of</strong>ile that was too cool as suggested in the cross-section<br />
photographs shown in Figure 5.<br />
Figure 5. SOIC Joint With Cool Reflow Pr<strong>of</strong>ile 9<br />
The good news is that the reliability data from the NCMS<br />
report may be overly pessimistic. Higher temperature<br />
reflow pr<strong>of</strong>iles result in more uni<strong>for</strong>m joints with less voiding<br />
as shown in Figure 3.<br />
COMPONENT THERMAL REQUIREMENT<br />
As a result <strong>of</strong> this work, the need <strong>for</strong> higher temperature<br />
qualified components has been highlighted. The melting<br />
point <strong>of</strong> eutectic Sn 37Pb solder is 183C. The melting<br />
point <strong>of</strong> the ternary eutectic, Sn 3.8Ag 0.7Cu alloy, which<br />
has been selected by the NEMI members is 217C, an<br />
increase <strong>of</strong> 34C. Component moisture sensitivity is<br />
already a constraint with current manufacturing processes.<br />
Higher temperatures, particularly <strong>for</strong> wave soldering<br />
in which an organic laminate board must make<br />
contact with a solder wave whose temperature may be as<br />
high as 275C, is the single most important change.<br />
ICS AND PASSIVE COMPONENTS – Most packaged<br />
IC’s have a moisture absorption rate designation. This<br />
designation specifies a moisture absorption rate, under<br />
specific temperature and humidity conditions, <strong>for</strong> an IC<br />
package style. The moisture absorbed by the IC package<br />
encapsulant material has become critical as the<br />
package size decreases and die size increases. The<br />
moisture trapped in the package becomes an explosive<br />
as the solder reflow temperature quickly increases during<br />
a reflow process thereby turning the moisture into superheated<br />
steam. This, in turn, leads to delamination<br />
9 NCMS <strong>Lead</strong>-<strong>Free</strong> <strong>Solder</strong> Project Final Report, 04<strong>01</strong>RE96,<br />
August 1997<br />
3<br />
between the die surface and the overmold encapsulant.<br />
This is aggravated further <strong>for</strong> a lead-free solder reflow<br />
process when the reflow temperature is typically 25 – 30 0<br />
C higher than that <strong>of</strong> a eutectic SnPb reflow process.<br />
Several IC package styles (PLCC, SOIC, QFP) were<br />
tested under the higher temperature conditions. Inspection<br />
methodology <strong>for</strong> delamination between the die surface<br />
and the encapsulant was per<strong>for</strong>med per JEDEC<br />
standard J-STD-20, using a C-mode Scanning Acoustical<br />
Microscope (CSAM) 10 . Results revealed the QFP and<br />
SOIC package styles survived with no delamination<br />
between the die surface and encapsulant, and minimal<br />
delamination between the die paddle surface and encapsulant.<br />
The PLCC package style showed major delamination<br />
under the die, between the bottom die surface and<br />
the die attach epoxy as shown in cross-section in Figures<br />
6 and 7.<br />
Figure 6. IC Cross-Section<br />
Figure 7. Delaminated Die to Paddle Joint<br />
While the delamination shown in Figures 6 and 7 will not<br />
necessarily cause an electrical failure, it certainly<br />
increases the reliability risk, particularly in an environment<br />
with a lot <strong>of</strong> vibration.<br />
10 See IPC/JEDEC J-STD-035 <strong>for</strong> a description <strong>of</strong> the scanning<br />
acoustical microscope process.
CAPACITORS AND HYBRIDS – Capacitors <strong>of</strong>ten contain<br />
lead in the high dielectric constant materials. In addition,<br />
dielectric materials in capacitors and hybrid circuits<br />
<strong>of</strong>ten use lead-glass which is characterized by a low melting<br />
point.<br />
Alternative materials are available, however, so this<br />
should not be a barrier in the long run.<br />
INDUCTORS AND CHOKES – Many inductors, chokes,<br />
and trans<strong>for</strong>mers, used in electronic modules contain ferrite.<br />
Un<strong>for</strong>tunately, the higher reflow temperatures can<br />
push the materials above their Curie temperature where<br />
the ferromagnetic properties <strong>of</strong> the materials change dramatically.<br />
This can effect the inductance <strong>of</strong> these components<br />
thereby altering the resonant frequency <strong>of</strong> the<br />
circuits. This is a recognized problem in the telecommunications<br />
industry and will likely effect multimedia applications<br />
in the automotive industry. This is a relatively<br />
new problem so work must be done to adequately<br />
address the issue.<br />
ORGANIC LAMINATE PRINTED WIRING BOARDS –<br />
As indicated earlier, the glass transition temperature, T g,<br />
and the coefficient <strong>of</strong> thermal expansion, CTE, particularly<br />
in the Z-Axis <strong>for</strong> through-hole components are two <strong>of</strong><br />
the most important parameters <strong>for</strong> an organic laminate. 11<br />
Fortunately, there has been significant progress in the<br />
last few years towards the development <strong>of</strong> good board<br />
materials. There is a looming requirement, however, in<br />
Europe <strong>for</strong> the elimination <strong>of</strong> the Bromine based fire<br />
retardents that are present in today’s FR4 materials. This<br />
means that additional work is required to qualify new<br />
materials which do not contain the prohibited substances.<br />
That work is in the early stages though materials are<br />
available.<br />
COMPONENT SURFACE FINISH<br />
A second major hindrance to full implementation <strong>of</strong> <strong>Lead</strong>free<br />
solder is the lack <strong>of</strong> <strong>Lead</strong>-free component finishes.<br />
While several component manufacturers have provided<br />
<strong>Lead</strong>-free finish <strong>for</strong> some time, notably Nickel-Paladium,<br />
not all components are currently available with a leadfree<br />
coating. Eutectic SnPb has been used <strong>for</strong> some time<br />
because it is inexpensive and solderable. Many <strong>of</strong> the<br />
fine pitch components are electroplated in order to avoid<br />
the non-uni<strong>for</strong>m coating characteristic <strong>of</strong> dipped parts.<br />
Electroplating new finishes is a non-trivial process development.<br />
Plated NiPd gives good uni<strong>for</strong>m plating, and has been<br />
used <strong>for</strong> many years. Un<strong>for</strong>tunately, the volatility and<br />
high price <strong>of</strong> Palladium makes many component manufacturers<br />
reluctant to initiate a program with Palladium.<br />
Thankfully, there are a number <strong>of</strong> new coating materials<br />
including immersion tin, immersion silver, electrolytic tin,<br />
11 Whitten, OpCitation<br />
4<br />
organo-silver, and organo-tin, that are being developed<br />
which should remedy this problem.<br />
PWBs use several types <strong>of</strong> finish today. For low density<br />
circuit boards, Hot Air <strong>Solder</strong> Level or HASL boards are<br />
common. With this technique, the organic laminate<br />
boards are dipped into a molten solder bath briefly, with<br />
the excess solder blown <strong>of</strong>f with an air or nitrogen knife.<br />
For higher density boards, the copper leads are either<br />
electroplated with SnPb or an organic solder preservative,OSP,<br />
is used to prevent oxidation <strong>of</strong> the copper lands.<br />
<strong>Lead</strong>-free HASL is available and will probably be used by<br />
low density applications. OSP can also be used, but the<br />
higher reflow temperatures makes double pass soldering<br />
<strong>for</strong> dual side circuit board component mounting more difficult.<br />
Fortunately, there are other solutions developing<br />
which may solve this problem. There has been significant<br />
progress with very thin organo-silver layers which<br />
protect the copper, but then become part <strong>of</strong> the solder<br />
joint after reflow.. Pure tin is also being considered as an<br />
alternative finish. Since both Tin and Silver are expected<br />
to be in the alloy <strong>of</strong> choice, and since the amount <strong>of</strong><br />
material in the surface finish is very small, the use <strong>of</strong><br />
either Tin or Silver will have minimal impact on the alloy<br />
composition.<br />
CONCLUSION<br />
The NEMI <strong>Lead</strong>-free Task Group has identified the qualification<br />
<strong>of</strong> high temperature components as a major hinderance<br />
to <strong>Lead</strong>-free solder implementation. At the<br />
current time extensive testing and materials development<br />
is underway in order to provide components with proper<br />
moisture and temperature capability. <strong>Delphi</strong> Delco Electronics<br />
began sending requests to component providers<br />
several years ago requesting in<strong>for</strong>mation on their <strong>Lead</strong>free<br />
programs. These requests along with the increased<br />
pressure from other electronics manufacturers are beginning<br />
to have an impact on the supply base. <strong>Lead</strong>-free<br />
components are already available in some quarters and<br />
we expect the entire industry to move to lead-free components<br />
over the next few years.<br />
Almost certainly, a partnership with automotive manufacturers<br />
will be required in the early stages <strong>of</strong> lead-free solder<br />
implementation. We are proceeding systematically<br />
towards the goal <strong>of</strong> lead-free products. We expect passenger<br />
compartment solutions to be first. Engine compartment,<br />
Transmission, and ABS applications, however,<br />
have much to gain from the higher melting point <strong>of</strong> the<br />
lead-free solder.<br />
While regulatory pressure is a current driver, market<br />
pressure may soon bypass it as the principal driver. A<br />
recent experience by a Japanese supplier illustrates this<br />
well. Market share in Europe <strong>for</strong> an audio CD player<br />
jumped from 4% to 19% almost immediately after the CD<br />
player was converted to lead-free solder.
ACKNOWLEDGMENTS<br />
The authors gratefully acknowledge contributions from<br />
many <strong>of</strong> the supporting staff at <strong>Delphi</strong> Delco Electronics.<br />
Their assistance was essential to the work described<br />
here.<br />
REFERENCES<br />
1. “<strong>Lead</strong> <strong>Free</strong> <strong>Solder</strong> Project Final Report," NCMS<br />
Report 04<strong>01</strong>RE96, 1997, National Center <strong>for</strong> Manufacturing<br />
Sciences, 3025 Boardwalk, Ann Arbor<br />
Michigan 48108-3266<br />
2. R. J. Klein and Wassink,” <strong>Solder</strong>ing in Electronics," II,<br />
Electrochemical Publications LTD, Asahi House, 10<br />
Church Road, Port Erin, Isle <strong>of</strong> Man, British Isles,<br />
1994, ISBN 0 9<strong>01</strong>150 24 X<br />
3. BP Richards et al, “<strong>Lead</strong>-free <strong>Solder</strong>ing”, Department<br />
<strong>of</strong> Trade and Industry, UK<br />
4. www.leadfree.org, a site maintained by IPC<br />
5. www.lead-free.org, a site supporting the ITRI<br />
work(UK)<br />
CONTACT<br />
Gordon Whitten is currently in Advanced Engineering at<br />
<strong>Delphi</strong> Delco Electronics Systems. He has 15+ years<br />
experience in electronic packaging including semiconductor,<br />
thin film magnetic R/W head, and multi-chip module<br />
development. He is the Reliability Chairman <strong>of</strong> the<br />
NEMI <strong>Lead</strong> <strong>Free</strong> Task group. His career has included<br />
teaching in Physics and Engineering at Olivet Nazarene<br />
University. Dr Whitten has B.S(Engineering Physics with<br />
Electrical Engineering Minor), M.S and PhD(Physics)<br />
degrees awarded by the University <strong>of</strong> Maine at Orono.<br />
He can be reached at gordon.c.whitten@delphiauto.com<br />
DEFINITIONS, ACRONYMS, ABBREVIATIONS<br />
ABS: Anti-lock Brake System<br />
Ag: Chemical symbol <strong>for</strong> Silver<br />
Al 2 O 3 : Chemical symbol <strong>for</strong> Aluminum Oxide or Alumina,<br />
a commonly used substrate material <strong>for</strong> resistors.<br />
BaTiO 3: Chemical symbol <strong>for</strong> Barium Titanate, a commonly<br />
used substrate material <strong>for</strong> capacitors.<br />
BGA: Ball Grid Array package<br />
CD: Compact Disc<br />
5<br />
CSP: Chip Scale Package<br />
CTE: Coefficient <strong>of</strong> Thermal Expansion, DL/L o C<br />
Cu: Chemical symbol <strong>for</strong> Copper<br />
EIA: Electronic Industries Association<br />
ELV: End <strong>of</strong> Life Vehicle directive. European regulation<br />
requiring vehicle manufacturers to accept vehicles at end<br />
<strong>of</strong> life without charge.<br />
Eutectic: Alloy which has a single liquidus to solidus<br />
melting point, that is, no pasty range<br />
FC: Flip Chip method <strong>of</strong> IC attachment which eliminates<br />
the IC package. Die is attached directly to the circuit<br />
board<br />
FR4: Fire Retardant #4, a common composite printed<br />
wiring board material<br />
In: Chemical symbol <strong>for</strong> Indium<br />
ITRI: International Tin Research Institute (UK)<br />
IVF: Swedish Institute <strong>for</strong> Production Engineering<br />
Research<br />
JEDEC: Joint Electron Device Engineering Council(EIA)<br />
JIEP: Japanese Institute <strong>of</strong> Electronic Packaging<br />
LCCC: <strong>Lead</strong>less Ceramic Chip Carrier<br />
Mp: <strong>Solder</strong> Alloy Melting Point<br />
Pb: Chemical symbol <strong>for</strong> <strong>Lead</strong><br />
PLCC: Plastic <strong>Lead</strong>ed Chip Carrier<br />
PWB: Printed Wiring Board. A typically planar structure<br />
used to hold electronic components physically while connecting<br />
them electrically with photo imaged wiring.<br />
QFP: Quad Flat Pak, a chip package.<br />
NCMS: National Center <strong>for</strong> Manufacturing Sciences<br />
NEMI: National Electronics Manufacturing Intiative<br />
Sb: Chemical symbol <strong>for</strong> Antimony<br />
Sn: Chemical symbol <strong>for</strong> Tin<br />
Sn3.8Ag0.7Cu: Ternary eutectic composition recommended<br />
<strong>for</strong> SnPb replacement by NEMI<br />
SnPb: Tin <strong>Lead</strong> <strong>Solder</strong>, usually eutectic<br />
SOIC: Small Outline Integrated Circuit Package<br />
Tg: Glass transition temperature. The temperature at<br />
which an organic material transitions from solid-like<br />
behavior to viscous liquid-like behavior.<br />
TSOP: Thin Small Outline Package: IC Package<br />
WEEE: Waste from Electric and Electronic Equipment<br />
directive from the European Union which requires recycling<br />
<strong>of</strong> equipment in order to minimize landfill expansion<br />
1206: A resistor or capacitor package which is 120 x 60<br />
mils or 3 x 1.5 mm