PDF | 2.8 MB - Wacker Chemie
PDF | 2.8 MB - Wacker Chemie
PDF | 2.8 MB - Wacker Chemie
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MULTIpLE BENEfITS fOR<br />
A BROAd ARRAY Of AppLICATIONS<br />
VINNAPAS ® Product Benefits<br />
VINNAPAS ® Standard<br />
Paper and Packaging<br />
VAE Technology<br />
• Broad adhesion and heat<br />
resistance spectrum<br />
• Bonding on a wide range of<br />
different substrates<br />
• High setting speed<br />
• Reliable, clean machinability<br />
• Broad formulation latitude<br />
• Compliant with food contact regulations<br />
VINNAPAS ® Plus<br />
Paper and Packaging<br />
VAE Technology<br />
+ Excellent adhesion<br />
on low energy substrates<br />
like PET or PS<br />
+ Very high setting speed<br />
+ Excellent adhesion promotion<br />
+ Outstanding nozzle compatibility<br />
Please note: The benefits stated above are a summary of<br />
those possible. Not every individual product can fulfill all the<br />
benefits stated.<br />
Applications<br />
• Paper and cardboard packaging<br />
• Case and carton packaging<br />
• Film to board lamination<br />
• Tube winding and honeycomb<br />
• Envelopes<br />
• Bags<br />
• Folded boxes<br />
• Bookbinding<br />
• Cigarette manufacturing<br />
Your Product Benefits<br />
in Paper and Packaging<br />
15
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