Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ...
Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ...
Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ...
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- Polish clean: used the optimized polishing media and grinding condition to gently<br />
polish off the material. The polishing approaches and parameters are listed in Table<br />
3.6. The combination of microcloth, alumina suspension, and manual polishing was<br />
found to be the best polishing method. However, the polishing uni<strong>for</strong>mity <strong>for</strong> the<br />
whole wafer as well as the limited material removal was a serious challenge and<br />
obstacle to prevent its practical implementation (see Figure 3.21).<br />
Table 3.6 Polishing Parameters<br />
Polishing Abrasive Polishing Suspension Polishing Method<br />
Tissue Paper Isopropanol Vibratory Polishing<br />
Rubber sheet with<br />
different hardness<br />
Microcloth<br />
PGMEA Auto Polishing<br />
Buehler Alumina<br />
Polishing Suspension<br />
71<br />
Manual Polishing