Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ...
Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ...
Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ...
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Table 3.1 Test Die used <strong>for</strong> Reliability Testing<br />
Die A Die B<br />
Format Daisy Chain Daisy Chain<br />
Die size 6mm x 6mm 6mm x 6mm<br />
Bump Pitch 800μm 800μm<br />
Bump<br />
Diameter<br />
UBM Ti/Ni/Cu/Au by E-beam<br />
<strong>Passivation</strong><br />
<strong>Layer</strong><br />
300μm 300μm<br />
Polymide<br />
37<br />
Al IC pad, Ni/Pd/Au<br />
by Electroless Plating<br />
Low Temperature<br />
PECVD Si Oxide<br />
Figure 3.2 <strong>Wafer</strong> of WLCSPs without SolderBrace coating and WLCSP close-up view