Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ...
Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ...
Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ...
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In-Situ Bumped <strong>Wafer</strong>s Placed Pre<strong>for</strong>med Balls<br />
<strong>Wafer</strong> Taping<br />
<strong>Wafer</strong> Grinding<br />
<strong>Wafer</strong> Detaping<br />
<strong>Wafer</strong> laser making<br />
<strong>Wafer</strong> map conversion<br />
<strong>Wafer</strong> probe test<br />
<strong>Wafer</strong> map merge<br />
<strong>Wafer</strong> 3D bump AOI<br />
<strong>Wafer</strong> mount<br />
<strong>Wafer</strong> saw/clean<br />
<strong>Wafer</strong> bump side AOI<br />
<strong>Wafer</strong> Pick&Place/Insp<br />
Pack<br />
Figure 2.5 Bumping Backend Process Flow [37]<br />
21<br />
<strong>Wafer</strong> Taping<br />
<strong>Wafer</strong> Grinding<br />
<strong>Wafer</strong> Detaping<br />
<strong>Wafer</strong> laser making<br />
<strong>Wafer</strong> fluxing<br />
<strong>Wafer</strong> ball placement<br />
<strong>Wafer</strong> solder ball<br />
reflow<br />
<strong>Wafer</strong> solder ball<br />
clean