Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ...
Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ... Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ...
simulation results correlate to the air-to-air thermal cycling reliability test results as described in Chapter 4 (see Figure 5.10). (a) (b) Figure 5.9 Von Mises stress (MPa) distribution in the solder joint for (a) Solderbrace-coated model and (b) Reference (non-coating) model (a) (b) Figure 5.10 Air-to-air thermal cycling reliability test results 116
5.2.7 Thermal Fatigue Life Prediction of Solderbrace-coated Solder Joints According to the literature review of prediction models given in the previous section, Darveaux prediction model was used in this research for Solderbrace-coated Solder Joints due to the ease in its implementation. The governing equations and parameters are listed in Table 5.4. Category Energy-based life prediction model Table 5.4 Prediction model and parameters used in this study Failure Parameter ∆Wave ( psi) N CW 0 1 C2 ave d dN C W C4 a 3 ave a Na N 0 d dN C1= 22400, C2= -1.52 C3= 2.76E-7, C4= 0.98 a 117 Equations Reference a= 0.0118(inch), ∆Wave= 79.75 (psi) Darveaux [114] Simulation results were compared to the air-to-air thermal cycling reliability test results as described in Chapter 4. Table 5.5 summarizes the characteristic life from the exterimental test results and the model prediction results. The Darveaux model produced a close correlation but
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simulation results correlate to the air-to-air thermal cycling reliability test results as described in<br />
Chapter 4 (see Figure 5.10).<br />
(a) (b)<br />
Figure 5.9 Von Mises stress (MPa) distribution in the solder joint <strong>for</strong> (a) Solderbrace-coated<br />
model and (b) Reference (non-coating) model<br />
(a) (b)<br />
Figure 5.10 Air-to-air thermal cycling reliability test results<br />
116
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