Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ...
Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ... Enhanced Polymer Passivation Layer for Wafer Level Chip Scale ...
was created at the same time when the volumes were created using the “VSWEEP” command in ANSYS. This command guarantees a coincident node and mesh at the interfaces of different volumes. Figure 5.7 is a close-up view of the meshed model, specially the fine mesh at the solder joint due to the interest of the solder joint fatigue study. Figure 5.7 Finished mesh for the solderbrace-coated WLCSP package 5.2.4 Boundary Conditions The use of a slice model involves a choice on the part of the analyst on the boundary constraints to be applied at the slice plane. The plane is neither a free surface nor a true symmetry plane. The reasonable compromise of coupling the y-displacements of the nodes on the slice plane was chosen. This has the effect that the slice plane is free to move in the y- 112
direction, but that the surface is required to remain planar. Boundary constraints applied in this study are shown in Figure 5.8. Figure 5.8 Boundary Conditions applied to a typical slice model 113
- Page 73 and 74: Figure 3.12 Solder Ball Placement M
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- Page 79 and 80: Figure 3.17 SAC305 Reflow profile -
- Page 81 and 82: foaming and high performance cleane
- Page 83 and 84: - Polish clean: used the optimized
- Page 85 and 86: Figure 3.22 SolderBrace printed waf
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- Page 89 and 90: cutting speed was set at a low valu
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- Page 107 and 108: 5.1.1 Modeling Approaches Due to th
- Page 109 and 110: are shown in Figure 5.2. However, t
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direction, but that the surface is required to remain planar. Boundary constraints applied in this<br />
study are shown in Figure 5.8.<br />
Figure 5.8 Boundary Conditions applied to a typical slice model<br />
113
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