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<strong>Fritting</strong><br />

<strong>Experiences</strong> <strong>with</strong> non-ohmic contact<br />

resistance C RES <strong>while</strong> wafer test probing<br />

Jan Martens<br />

Philips Semiconductors Hamburg<br />

Awarded “Best Overall Presentation at SWTW-2006”


Overview<br />

• <strong>Fritting</strong> – What‘s that?<br />

• <strong>Fritting</strong> – How to measure?<br />

C RES measurements <strong>with</strong>in production<br />

environment<br />

• Definition of the <strong>Fritting</strong> ratio Φ<br />

• Why measuring <strong>Fritting</strong> and not only C RES?<br />

• Measurement results<br />

• Summary and Outlook<br />

06/12/2006 SWTW2006 – Jan Martens 2


<strong>Fritting</strong> – What‘s that?<br />

• The vertical Probe tip<br />

touches the contact pad.<br />

• Depending on the contact<br />

pressure the oxide film is<br />

broken partly and<br />

electrical bridges arise.<br />

• The number and size of<br />

the bridges is equivalent<br />

to the C RES quality<br />

Probe Tip<br />

<strong>Contact</strong> Pad<br />

06/12/2006 SWTW2006 – Jan Martens 3


<strong>Fritting</strong> – What‘s that?<br />

Probe tip<br />

Oxide film<br />

<strong>Contact</strong> pad<br />

• What happens, if bridges<br />

are only few and small?<br />

Small bridge through oxide film.<br />

Before high current flow.<br />

06/12/2006 SWTW2006 – Jan Martens 4


<strong>Fritting</strong> – What‘s that?<br />

• Current must flow through small bridge.<br />

• Bridge and neighbourhood are heated up<br />

• <strong>Contact</strong> Pad material migrates to the bridge.<br />

Probe tip<br />

Oxide film<br />

<strong>Contact</strong> pad<br />

High current flow situation:<br />

Black Lines of current flow.<br />

White Lines of equipotential surface.<br />

06/12/2006 SWTW2006 – Jan Martens 5


<strong>Fritting</strong> – What‘s that?<br />

• Bridge is widened C RES decreased<br />

• <strong>Contact</strong> pad material migrated to the bridge and tip<br />

surface<br />

Probe tip<br />

Oxide film<br />

<strong>Contact</strong> pad<br />

Wide bridge through oxide film.<br />

After high current flow.<br />

Tip surface is contaminated.<br />

06/12/2006 SWTW2006 – Jan Martens 6


<strong>Fritting</strong> – What‘s that?<br />

Probe Tip<br />

<strong>Contact</strong> Pad<br />

• <strong>Fritting</strong> is a kind of electrical breakdown at the<br />

contact surface between the probe tip and the<br />

contact pad of the IC.<br />

• It improves the electrical contact by building or<br />

stabilizing bridges through the oxide film, if the<br />

film was not mechanically broken completely.<br />

• After <strong>Fritting</strong> the probe tip is welded <strong>with</strong> the<br />

contact pad. After removing the contact<br />

residuals of the welding remain at the probe<br />

tip and will oxidize.<br />

06/12/2006 SWTW2006 – Jan Martens 7


<strong>Fritting</strong> – How to measure?<br />

Needs:<br />

• A C RES measurement is needed before and after fritting.<br />

• The change of C RES is the indicator of occurence.<br />

Implementation:<br />

• C RES Monitor is installed twice <strong>with</strong>in the production test<br />

program flow of a smart card measuring C RES on the<br />

power supply pin for every IC.<br />

• First monitor at test program start, last monitor at the end.<br />

• Hardware used is Teradyne J750, Accretech (TSK)<br />

prober UF200A and 32-multisite vertical probe card<br />

Viprobe from Feinmetall.<br />

• Data of first and last C RES per touchdown is collected and<br />

analyzed.<br />

06/12/2006 SWTW2006 – Jan Martens 8


<strong>Fritting</strong> – How to measure?<br />

Last CRES CRES / Ω<br />

10<br />

8<br />

6<br />

4<br />

2<br />

0<br />

First C RES = Last C RES<br />

Stable contact!<br />

CRES CRES Scatter Plot<br />

First C RES > Last C RES<br />

<strong>Fritting</strong> contact!<br />

0 2 4 6 8 10<br />

First CRES CRES / Ω<br />

06/12/2006 SWTW2006 – Jan Martens 9


<strong>Fritting</strong> – First data review<br />

Number of TDs<br />

5000 5000<br />

4000 4000<br />

3000<br />

2000<br />

1000<br />

0<br />

CRES CRES Distribution<br />

Distribution<br />

C RES Improvement<br />

0 22 44 66 8 10 10<br />

CRES CRES / / Ω<br />

First Cres<br />

First Cres<br />

Last Cres<br />

06/12/2006 SWTW2006 – Jan Martens 10


Definition of <strong>Fritting</strong> ratio Φ<br />

Number of TDs<br />

5000<br />

4000<br />

3000<br />

2000<br />

1000<br />

0<br />

CRES CRES CRES Distribution<br />

<strong>Fritting</strong> Ratio Φ<br />

=<br />

0 2 4 666 8 10<br />

CRES CRES CRES / Ω<br />

NFrit<br />

+ N<br />

First Cres<br />

First Cres<br />

First First Cres Cres / Stable<br />

First Cres / Stable<br />

First Cres / <strong>Fritting</strong><br />

06/12/2006 SWTW2006 – Jan Martens 11<br />

N<br />

Frit<br />

Stab


<strong>Fritting</strong> ratio Φ. Typical examples<br />

<strong>Fritting</strong> ratio Φ<br />

100%<br />

90%<br />

80%<br />

70%<br />

60%<br />

50%<br />

40%<br />

30%<br />

20%<br />

10%<br />

0%<br />

Change of <strong>Fritting</strong> ratio Φ per time<br />

Within 2k TDs<br />

Φ80%<br />

example 1<br />

example 2<br />

0 500 1000 1500 2000 2500<br />

Touchdowns<br />

06/12/2006 SWTW2006 – Jan Martens 12


Why measuring <strong>Fritting</strong> and not only C RES ?<br />

• C RES measurement only indicates a problem in<br />

the signal path but doesn‘t answer where.<br />

<strong>Fritting</strong> measurement verifies a probe tip<br />

contamination.<br />

• In cases where an absolut C RES measurement is<br />

impossible, a relative C RES decrease can still be<br />

measured.<br />

• The fritting analysis is more convenient and<br />

simpler to analyze.<br />

06/12/2006 SWTW2006 – Jan Martens 13


How influencing the fritting ratio?<br />

• Changing overdrive<br />

• Probing on gold bumps instead of<br />

aluminum<br />

• Using refurbishment methods<br />

– Probe Polish (online cleaning)<br />

– T.I.P.S. (offline cleaning)<br />

06/12/2006 SWTW2006 – Jan Martens 14


Changing overdrive<br />

<strong>Fritting</strong> ratio Φ<br />

100%<br />

90%<br />

80%<br />

70%<br />

60%<br />

50%<br />

40%<br />

30%<br />

20%<br />

10%<br />

0%<br />

<strong>Fritting</strong> ratio Φ<br />

Overdrive improves Φ<br />

(nonlinear probing force only small improvement)<br />

2 Mil 3 Mil 4 Mil 5 Mil<br />

Overdrive<br />

06/12/2006 SWTW2006 – Jan Martens 15


Probing on gold bumps (instead of aluminum)<br />

• Searched in many production lots<br />

• <strong>Fritting</strong> ratio always Φ=0%<br />

Gold is not oxidized.<br />

No <strong>Fritting</strong>!<br />

06/12/2006 SWTW2006 – Jan Martens 16


Probe tip refurbishment – How does it work?<br />

Probe Tip<br />

Highly cross-linked polymeric<br />

material <strong>with</strong> spatially distributed<br />

abrasive particles. (Probe Polish)<br />

Flattened tip<br />

Semiround tip<br />

06/12/2006 SWTW2006 – Jan Martens 17<br />

Pictures from T.I.P.S. Messtechnik GmbH


Online cleaning method: Probe Polish (ITS)<br />

<strong>Fritting</strong> ratio Φ<br />

90%<br />

80%<br />

70%<br />

60%<br />

50%<br />

40%<br />

30%<br />

20%<br />

10%<br />

0%<br />

<strong>Fritting</strong> ratio Φ<br />

Online using<br />

Probe Polish<br />

(1000 touchdowns)<br />

<br />

Probe tip<br />

Refurbishment<br />

<br />

<strong>Fritting</strong> prevention and<br />

Yield win 1%<br />

0 200 400 600 800 1000 1200<br />

Touchdowns<br />

06/12/2006 SWTW2006 – Jan Martens 18


<strong>Fritting</strong> measurement and Probe Polish<br />

Number of TDs<br />

3000<br />

2500<br />

2000<br />

1500<br />

1000<br />

500<br />

0<br />

CRES CRES Distribution<br />

First Cres / before cleaning <strong>with</strong> Probe Polish<br />

First Cres / before cleaning <strong>with</strong> Probe Polish<br />

Last Cres / before cleaning <strong>with</strong> Probe Polish<br />

First Cres / after cleaning <strong>with</strong> Probe Polish<br />

Last Cres / before cleaning <strong>with</strong> Probe Polish<br />

Last Cres / after cleaning <strong>with</strong> Probe Polish<br />

<strong>Fritting</strong> prevention<br />

<strong>with</strong> Probe Polish<br />

0 2 4 6 8 10 10<br />

CRES CRES / ΩΩ<br />

06/12/2006 SWTW2006 – Jan Martens 19


Offline cleaning method: T.I.P.S.<br />

<strong>Fritting</strong> ratio Φ<br />

100%<br />

90%<br />

80%<br />

70%<br />

60%<br />

50%<br />

40%<br />

30%<br />

20%<br />

10%<br />

0%<br />

<strong>Fritting</strong> ratio Φ<br />

Offline using<br />

T.I.P.S.<br />

(24k touchdowns)<br />

<br />

Probe tip<br />

Refurbishment<br />

<br />

<strong>Fritting</strong> prevention and<br />

Yield win 3%<br />

0 500 1000 1500 2000<br />

Touchdowns<br />

06/12/2006 SWTW2006 – Jan Martens 20


<strong>Fritting</strong> measurement <strong>with</strong> T.I.P.S.<br />

Number of TDs<br />

5000<br />

4000<br />

3000<br />

2000<br />

1000<br />

0<br />

CRES CRES Distribution<br />

0 2 4 6 8 10<br />

CRES CRES / Ω<br />

First Cres w/o T.I.P.S.<br />

First Cres w/o T.I.P.S.<br />

Last Cres w/o T.I.P.S.<br />

First Cres w/ T.I.P.S.<br />

Last Cres w/o T.I.P.S.<br />

Last Cres w/ T.I.P.S.<br />

<strong>Fritting</strong> prevention<br />

<strong>with</strong> T.I.P.S.<br />

06/12/2006 SWTW2006 – Jan Martens 21


Summary<br />

• <strong>Fritting</strong> was detected by comparing C RES values<br />

during one touchdown.<br />

• <strong>Fritting</strong> ratio Φ was defined and used as C RES<br />

quality indicator.<br />

• <strong>Fritting</strong> contaminates probe tips.<br />

• <strong>Fritting</strong> was prevented and yield was increased by<br />

using probe tip refurbishment techniques:<br />

Probe Polish www.inttest.net<br />

T.I.P.S. www.tips.co.at<br />

06/12/2006 SWTW2006 – Jan Martens 22


Outlook<br />

• <strong>Fritting</strong> ratio Φ can indicate preventive<br />

maintenance of probe cards.<br />

• <strong>Fritting</strong> ratio Φ can help to optimize<br />

cleaning setups.<br />

• <strong>Fritting</strong> can help to identify and engineer<br />

(too) high current tests.<br />

• <strong>Fritting</strong> could be an explanation for a fast<br />

abrasion of probe tip material.<br />

06/12/2006 SWTW2006 – Jan Martens 23


Thank You!<br />

Questions?<br />

06/12/2006 SWTW2006 – Jan Martens 24

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