ESSDERC 2007 - TUM

CONFERENCE VENUE
The conference will be held at the Technical University Munich (TUM) in the heart of Munich
close to sites such as the Old Town with its shopping facilities, art galleries, recreational parks
and the world‘s largest scientific-technical museum. Further attractions include sports and
music events, the famous architecture of the Olympic stadium and the well-known Bavarian
beer garden culture. Visitors who choose to stay over the weekend can enjoy the scenery of
the Alps which are a short train ride away. The “Weltstadt mit Herz“ (Cosmopolitan City with
Heart) welcomes you!
Englischer Garten
The “Englischer Garten” or English Garden is a large urban public park that stretches from
the city center to the northeastern city limits of Munich, Germany. It was founded in 1789 by
Benjamin Thompson, who is also known as Count of Rumford. With an area covering 3.7 km²
the “Englischer Garten” is one of the world‘s largest urban public parks.
With 7,000 seats, the Chinesischer Turm‘s beer garden is the second largest beer garden in
Munich. It is located inside the “Englischer Garten”.
Deutsches Museum
With its 28.000 square meters of exposition area with objects of over 50 scopes in natural
sciences, the “Deutsches Museum“ (German Museum) is the biggest scientific-technical museum
in the world. 1.5 million visitors per year document a great interest in the big variety of
original exhibits. History of science and its influence on society is also a major focus of the
German Museum.
Pinakothek der Moderne
The “Pinakothek der Moderne” is a modern art museum, situated in the city centre of Munich.
Together with the “Alte Pinakothek” and the “Neue Pinakothek” it is part of Munich‘s “Kunstareal“
(the “art area“).
All three museums are within 5 min walking distance of the conference site.
Feldherrenhalle and Theatinerkirche at Odeonsplatz
Conference Secretariat
Institute for Technical Electronics
Technical University Munich
Theresienstrasse 90
D-80290 Munich
Germany
Fax: +49 89 289 22938
info@essderc2007.org
CONTACT INFORMATION
ORGANIZATION COMMITTEE
Conference Chair Doris Schmitt-Landsiedel TUM
ESSDERC TPC Chair Roland Thewes Qimonda
ESSCIRC TPC Chair Tobias Noll RWTH Aachen
University
Tutorials Chairs
ESSDERC Ralf Brederlow Texas Instruments
ESSCIRC Rudolf Koch Infineon
Local Co-Chairs Gerhard Wachutka TUM
Philip Teichmann TUM
Florian Chouard TUM
Conference Secretariat Susanne Prucker TUM
Lydia Thalau TUM
KEY DATES
Local Organization
Congress & Seminar Management
Industriestr. 35
D-82194 Gröbenzell
Germany
Fax: +49 8142 54735
info@csm-congress.de
SCHEDULE AT A GLANCE
Monday, Sept. 10 th , 2007 Tutorials
Tuesday, Sept. 11 th , 2007 Conference Opening
Technical Sessions
Welcome Reception
Wednesday, Sept. 12 th , 2007 Technical Sessions
Conference Dinner
Thursday, Sept. 13 th , 2007 Technical Sessions
Friday, Sept. 14 th , 2007 Workshops
Submission deadline April 7 th , 2007
Notification of acceptance May 25 th , 2007
Early registration deadline July 20 th , 2007
Final Call for Papers
ESSDERC 2007
37 th European
Solid-State Device Research
Conference
11-13 September 2007
Munich, Germany
Paper submission deadline: April 7 th , 2007
Electronic submission
Organization committee at:
Technical co-sponsorship:
www.essderc2007.org

GENERAL SCOPE OF THE CONFERENCE JOINT PLENARY TALKS
PAPER SUBMISSION
The aim of the ESSDERC conference is to provide an annual European forum for the presentation
and discussion of recent advances in solid-state devices and technologies.
ESSDERC and its sister conference ESSCIRC, which deals with solid-state circuits, are governed
by a single Steering Committee. The increasing level of integration for system-on-chip design
made available by advances in silicon technology is stimulating more than ever before the need
for deeper interaction among technologists, device experts, and circuit and system designers.
While keeping separate Technical Program Committees, ESSDERC and ESSCIRC will share
Plenary Keynote Presentations and Joint Sessions bridging both communities. Attendees registered
for either conference are encouraged to attend any of the scheduled parallel sessions.
The main themes for original contributions to be submitted to ESSDERC 2007 include, but are
not limited to the following:
Advanced Devices
CMOS scaling; high performance, low power, and low voltage devices; SOI, SGOI, and SiON
devices; SiGe, Ge, and strained devices; nano devices and related device physics; double and
multi gate transistors; high mobility and ballistic devices.
Processing & Integration
Advances in integration for ULSI; SOI, SGOI, and SiON processing; 3D integration; new materials
for CMOS; ICs patterning techniques; gate dielectrics; high k; gate stack and junction
technology; silicidation; interconnects; low k dielectrics; damascene processing; cleaning and
surface preparation.
Telecommunication & Power Devices
RF CMOS; passives; antennas; filters; resonators; inductors; RF MEMS/switches; SAW, BAW,
and FBAR; oscillators, HBT; HEMT; bipolar devices; BiCMOS; high voltage and high power devices;
SiC; high temperature operation; CMOS compatible power devices.
Modeling and Simulation
Compact, numerical, and physical modeling; device simulation; behavior models; quantum
mechanical and non-stationary transport phenomena; ballistic transport; scattering models;
process dispersions, parameter fluctuations, variability; TCAD; mixed electrical-thermal modeling
and simulation.
Characterization and Reliability
Characterization techniques; parameter extraction; advanced test structures and methods;
noise; gate dielectric, device, and interconnect reliability; CHE effects; NBTI; SILC; memory
retention; process-induced damages, ESD, EMI; defect monitoring and control; metrology.
Memory, SoC & SiP
Embedded and stand-alone memories; DRAM, FeRAM, MRAM, PCRAM, CBRAM, Flash, SONOS;
nanocrystal memories; single and few electron memories; 3D IC stacks; integrated MEMS and
NEMS; integration of detectors, sensors, and actuators; CCDs and CMOS imagers; optical onchip
communication, optical links; display technologies; TFTs; IC cooling techniques; SoC and
SiP packaging; microsystem packaging.
Emerging Technologies, Sensors & Actuators
Nanotubes; single-electron, molecular and quantum devices; spintronics; self-assembling
structures and emerging materials; photonic devices; light emission, APDs, single photon detectors;
polymer transistors, sensors, light-emitting diodes and optoelectronic devices; flexible
displays; biochemical sensors and actuators; microfluidic devices; micromachining; MEMS and
NEMS.
Joint ESSDERC/ESSCIRC Sessions on:
Sensors and Imagers
Technology; mixed signal design; algorithms.
Yield and Reliability
Yield and reliability related technology development, characterization, and modeling; design
for manufacturability.
ESSDERC and ESSCIRC will share Plenary Sessions where distinguished invited speakers will
discuss issues of interest for the attendees of both conferences.
A. DeHon (University of Pennsylvania)
Nanoelectronic Architectures
P. Fromherz (MPI for Biochemistry)
Joining Microelectronics with Microionics: Nerve Cells and Brain Tissue on
Semiconductor Chips
K. Ishimaru (Toshiba)
45/32 nm CMOS
S. Nassif (IBM)
Holistic Coupling of Manufacturing and Design
A. Theuwissen (DALSA)
CMOS Imagers – Status, Trends, and Future Perspectives
W. Ziebart (Infineon Technologies)
Technical and Economical Trends in Microelectronics
ESSDERC PLENARY TALKS
In addition, there will be renowned ESSDERC invited speakers who will address issues more focussed
on solid-state devices of specific interest for the integrated circuit design community.
K. Kim (Samsung)
Advanced Memory Technologies
D. de Leeuw (Philips Research)
Molecular Devices: From Ideas to Experimental Evidence
E. Sangiorgi (University of Bologna)
Modeling Transport in Decananometer MOSFETs
TUTORIALS AND WORKSHOPS
A Tutorial Day will be organized on Monday, September 10 th , 2007, while a Workshop Day will
take place on Friday, September 14 th , 2007.
BEST PAPER AWARDS
Papers presented at the conference will be considered for the Best Paper Award and for the
best „Young Scientist“ Paper Award. The selection will be based on the results of the paper
selection process and the judgment of the conference participants. The award delivery will take
place at ESSDERC 2008.
The 2007 ESSDERC conference will allow only electronic submission of papers in PDF
format. Prospective authors must submit their paper(s) via the conference website.
Papers must be submitted in the final format to be published in the proceedings. They must
not exceed four A4 pages with all illustrations and references included. The size of the PDF
files submitted must not exceed 2 MBytes. Manuscript guidelines as well as instructions on
how to submit electronically will be available on the conference website.
Conference Website
http://www.essderc2007.org
All paper submissions must be received by April 7 th , 2007.
After selection of papers, the authors will be informed about the decision of the Technical
Program Committee by e-mail at the end of May 2007. At the same time, the complete
program will be published on the conference website.
The working language of the conference is English, which must also be used for all presentations
and printed material.
REVIEW PROCESS
Papers submitted for review must clearly state:
• The purpose of the work
• How and to what extent it advances the state-of-the-art
• Specific results and their impact
The degree to which the paper deals with the above issues is fundamental to a successful
review and selection of the paper. The most frequent cause of rejections of submitted
papers is a lack of new results. Only work that has not been previously published at the time
of the conference will be considered. Submission of a paper for review and subsequent acceptance
is considered by the committee as a commitment that the work will not be placed
in the public domain prior to the conference.
ESSDERC / ESSCIRC STEERING COMMITTEE
Giorgio Baccarani (Chair) University of Bologna
Reinout Woltjer (Vice-Chair) NXP
Ralf Brederlow Texas Instruments
Cor Claeys (permanent secretary) IMEC
Peter Ashburn University of Southampton
Sorin Cristoloveanu ENSERG-IMEP
Franz Dielacher Infineon
Christian Enz CSEM
Hervé Mingam ST Microelectronics
Ernesto Perea ST Microelectronics
Hans-Jörg Pfleiderer University of Ulm
William Redman-White Philips Semiconductor
Hannu Tenhunen KTH Stockholm