Metallized Particle Interconnect
Metallized Particle Interconnect
Metallized Particle Interconnect
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<strong>Metallized</strong> <strong>Particle</strong> <strong>Interconnect</strong><br />
Application Guide
MPI<br />
Columns<br />
2<br />
What is MPI?<br />
The MPI contact system allows the user a means of parallel<br />
interconnection through the use of compression activated<br />
contacts. MPI is a high temperature, flexible, conductive<br />
polymeric interconnect solution which incorporates piercing<br />
and indenting particles to facilitate penetration of oxides on<br />
mating surfaces. MPI has been designed to meet the board<br />
connection requirements of microprocessors, ASIC’s and<br />
MCM’s used in high-end servers, mainframes, workstations,<br />
storage, telecom and data equipment, desktop PC’s, mobile<br />
PC applications. Other applications include mezzanine<br />
Daughter Card-to-Motherboard, Daughter Card-to-Backplane,<br />
Flex-to-Flex and Flex-to-Rigid interconnects.<br />
How does MPI work?<br />
The MPI conductive column is<br />
molded into an insulator which<br />
aligns the columns over the<br />
desired I/O field that is to be<br />
interconnected. As the two surfaces<br />
are compressed, the metallized<br />
particles encapsulated within<br />
the columns link together, thus<br />
providing the conductive path.<br />
Daughter Card/LGA/Flex<br />
MCM/ASIC<br />
PCB/Backplane<br />
Polyimide<br />
Insulator<br />
LGA Design<br />
Guidelines<br />
Why Choose LGA Packaging?<br />
• Socketing of Microprocessor Model<br />
– Maximum Flexibility of Motherboard Inventory to Meet<br />
Market Demands<br />
– “Make-to-Order” Model Achievable<br />
• Motherboard Build Cycle<br />
– Quick Diagnosis (FCT, ICT)<br />
– Inexpensive Replace and Repair: Now Possible<br />
– Highest process yield<br />
• Package Cost<br />
– Smaller Package (High Density)<br />
– No Ball or Pin Attach<br />
– Flexible design -> short time to market<br />
• Tariffs<br />
– Moving Motherboards with Lower Tariff Restrictions:<br />
Now an Option<br />
• Very Low Profile<br />
– Less than 1 mm<br />
• High Speed<br />
– Short Signal Path Permits 12 GHz or Greater Processing<br />
• Power<br />
Speeds<br />
– Short Signal Path Minimizes<br />
Voltage Drop from Package<br />
to Motherboard<br />
– Compensation of thermal mismatch<br />
Package Considerations<br />
Tyco MPI LGA sockets are design to work with both<br />
Ceramic (CLGA) and Organic (OLGA) microprocessor and<br />
ASIC packages.<br />
Package Design<br />
Design should follow standard industry practices as defined<br />
by JEDEC standards, unless otherwise specified.
Package Pad Pitch<br />
1,00 [.039] or 1,27 [.050]<br />
Notify Tyco if different pitch is required, even < 1,0 mm.<br />
Package Pad Dia<br />
Pitch mm [in]<br />
1,00 [.039]<br />
1,27 [.050]<br />
Package Pad Positioning<br />
Package Flatness<br />
0,08 [.003] across package<br />
Effective Pad Dia. mm [in]<br />
±0,05 [.002]<br />
0,70 [.028]<br />
0,86 [.034]<br />
Pitch Pad to Pad Pad Array<br />
mm [in] T.P. @ MMC T.P. @ MMC<br />
1,00 [.039] Ø 0,10 [.004] Ø 0,25 [.010]<br />
1,27 [.050] Ø 0,15 [.006] Ø 0,25 [.010]<br />
Package Sizing versus Array Size<br />
Center Line of last Pad to edge of package 2,00 mm [.079]<br />
recommended. Notify Tyco Electronics/MPI if less.<br />
Package Pad Plating<br />
Gold Flash 0,25µm [10µ inches] over Nickel 3,8µm [150µ inches].<br />
Gold can be either Hard or Soft as defined by Mil-G-45204.<br />
Either Electrolytic or Immersion plating process can be used.<br />
PCB Design<br />
Guidelines<br />
Board Design Considerations<br />
MPI columns are designed to work with all industry standard<br />
board designs and materials (FR-4, Polyimide, etc.)<br />
Carefull consideration with respect to the layout of the board<br />
should be taken, as most MPI applications will require at least<br />
4 thru-holes for compression hard-ware and 2 thru-(or blind)<br />
holes for alignment pins.<br />
Board Design<br />
Design should follow standard industry practices as defined<br />
by IPC Specification 2221, unless otherwise specified.<br />
Board Pad Pitch<br />
1,00 [.039] or 1,27 [.050]<br />
Board Pad Dia<br />
(InPad Via Design)<br />
Pitch Pad Dia. ‘A’ Max Via Dia.<br />
mm [in] ± 0,03 [.001] ‘B’ (After Pltg) mm [in]<br />
1,00 [.039] 0,66 [.026] 0,20 [.008]<br />
1,27 [.050] 0,79 [.031] 0,25 [.010]<br />
Pitch<br />
Pitch<br />
ø "A"<br />
ø 'B'<br />
3
4<br />
PCB Design<br />
Guidelines<br />
Board Pad Dia<br />
(Solid Pad- Offset Via)<br />
Pitch mm [in]<br />
1,00 [.039]<br />
1,27 [.050]<br />
Pitch<br />
Solder Resist (Solder Mask)<br />
The use of solder resist coatings shall be in accordance with<br />
the requirements of IPC-SM-840. It is recommended that only<br />
photo-imageable resists be used as that process yields<br />
superior thickness control.<br />
Resist Thickness<br />
Flush or below the pad surfaces.<br />
Resist Clearance<br />
0,0 – 0,13 mm [.000 – .005] typically<br />
Board Pad Positioning<br />
Pitch mm [in]<br />
1,00 [.039]<br />
1,27 [.050]<br />
Effective Pad Dia. mm [in]<br />
Pitch<br />
± 0,03 [.001]<br />
0,56 [.022]<br />
0,69 [.027]<br />
ø 'A'<br />
Pad to Pad T.P. @ MMC<br />
Ø 0,10 [.004]<br />
Ø 0,10 [.004]<br />
Board Flatness<br />
Design to industry standards. The Bolster Plate used in the<br />
assembly tends to ‘flatten’ the PCB or at least conform it to<br />
the Bolster Plate flatness.<br />
Alignment Hole Tolerancing &<br />
Positioning<br />
Socket Hardware Mounting<br />
Hole Positioning<br />
Ideally, mounting holes should be placed close to the array<br />
(ie. Corners) to minimize board bow.<br />
PWB Pad Plating<br />
Gold Flash 0,25µm [10µ inches] over Nickel 3,8µm<br />
[150µ inches]. Gold can be either Hard or Soft as defined by<br />
Mil-G-45204. Either Electrolytic or Immersion plating process’<br />
can be used.<br />
Pitch Hole Dia. Tol. Alignment Hole<br />
mm [in] ± mm [in] Location T.P. @ MMC w/<br />
Note: Pad surfaces must be free of organic or anorganic con-<br />
tamination, flux residue, resist residue etc.<br />
Respect to Pads<br />
1,00 [.039] 0,025 [.001] 0,20 [.008]<br />
1,27 [.050] 0,025 [.001] 0,20 [.008]
Bolster Plate & Hardware Design<br />
Bolster Plate<br />
The MPI contact system is a solderless Z-axis connection<br />
system and therefore requires mechanical hardware to create<br />
the required compression force and at the same time hold<br />
the connector in place.<br />
The mechanical design typically incorporates the Thermal<br />
Management Solution (i.e. Heat Sink or Heat Spreader Plate)<br />
as the device that applies the top load. In applications where<br />
no Thermal Management Solution is used, a Top Loading<br />
Plate must be used.<br />
To insure an even distribution of loading over the MPI<br />
column array, a secondary device called the Bolster Plate is<br />
typically used on the bottom side of the PCB.<br />
Depending on application, the bolster plate material can be<br />
aluminum, die cast aluminum, steel or St.steel. The thickness<br />
of the Bolster Plate will vary depending on the load (i.e. I/O<br />
count x required load per column) and the material choice of<br />
the Bolster Plate. The plate must be designed to support the<br />
required load, i.e. under load, the Plate must not have a<br />
deflection or bow exceeding 0,025 mm [.001].<br />
In most applications a thin insulating film (Mylar) is placed<br />
between the bolster plate and the PWB to provide electrical<br />
isolation between the Bolster Plate and the PWB.<br />
Bolster Plate Flatness<br />
Ideally, the design of the Bolster Plate should be as flat as<br />
possible. Producing a ‘perfectly’ flat plate is not always possible.<br />
It is easier to actually specify a bow, but in the proper direction.<br />
Threaded<br />
Stand-off<br />
Mounting Hardware<br />
Due to broad range of stack-up tolerances present in a<br />
micro-processor – PWB assembly (package & PWB thickness<br />
tolerances, as well as, Thermal Interface choice) and the uni-<br />
que nature of ‘Elastomeric’ contact design, it is recommended<br />
that the hardware be of such a design as to provided<br />
‘constant (spring) loading’, as opposed to ‘fixed deflection’.<br />
It is recommended that the hardware be located uniformly<br />
with respect to the MPI column array.<br />
The spring deflection should be controlled by mechanical<br />
features (i.e. stops) within the hardware design.<br />
A dry lubricant on the threaded hardware is recommended<br />
so as to maintain a uniform threading torque, as well as<br />
minimizing guallng.<br />
Tyco Electronics/MPI can design and supply the Compression<br />
Hardware and the Bolster Plate combination to meet your<br />
custom application needs.<br />
Bottom<br />
of PWB<br />
[.000 - .003]<br />
after Stand-off<br />
Assembly<br />
5
6<br />
Typical MPI LGA Socket for Workstation/Servers<br />
Showing Thermal Management Hardware & Bolster Plate<br />
Column Size<br />
Column Location<br />
0,25 mm [.01] True Postion with respect to the alignment pins<br />
at MMC.<br />
Socket Design Considerations<br />
Pitch mm [in]<br />
1,00 [.039]<br />
1,27 [.050]<br />
Column Dia. (At Mating Face)<br />
mm [in] (REF)<br />
0,46 [.018]<br />
0,66 [.026]<br />
Hardware<br />
Heat Sink<br />
LGA IC Package<br />
MPI LGA Socket<br />
PWB<br />
Bolster Plate<br />
Column Loading<br />
Each MPI column requires 40 to 80 grams loading for 1,27 mm<br />
[.050] pitch or 35 to 75 grams for 1,00 mm [.039] pitch<br />
designs for maximum performance and reliability. Though<br />
MPI may work in various mounting configurations, it is<br />
recommended that the loading be uniform with respect<br />
to the socket. See Mounting hardware.<br />
Typical Column Deflection<br />
The deflection range is limited by hard stops which are<br />
designed into every socket. The stops prevent overstressing<br />
of the MPI columns.<br />
PWB Real-Estate Requirements<br />
Typcial ‘Framed’ designs require a clear-ance zone of 6,80 mm<br />
[.268] larger than the package size. For example; a<br />
42,5 mm [1.673] sq. package would typically require<br />
sq. clearance zone of 49,30 mm [1.94].<br />
Frameless socket designs (which dispence the plastic frame)<br />
can be designed to occupy no more real-estate than the<br />
package.<br />
Pitch mm [in]<br />
1,00 [.039]<br />
1,27 [.050]<br />
Note: ‘Frameless’ designs are typically designed for ‘Organic’<br />
packaging only.<br />
Maximum Deflection Range<br />
0,20 [.008]<br />
0,25 [.010]
Inspection<br />
All MPI sockets/sockets are 100% electrically inspected for<br />
presence of contacts, dielectric withstanding voltage (500<br />
VAC), and true position. Therefore, Tyco Electronics/MPI<br />
does not believe added inspection at the user adds value.<br />
If inspection at the user is desired, please use<br />
Tyco Electronics/MPI Specification MPI-506.<br />
Installation<br />
Handle the sockets/connectors by the frame/housing only.<br />
Do not touch the MPI columns.<br />
All sockets and connectors are supplied in Static Free vacuum<br />
molded plastic trays. Keep MPI sockets/connectors in trays<br />
until ready for use.<br />
As each MPI design tends to be customer specific in<br />
mounting configuration and mounting hardware, please<br />
follow Design specific Assembly/Disassembly instructions.<br />
Board Cleanliness<br />
Prior to installation, the pads must be clean and dry with<br />
no solder flux, solder residue, oils, adhesive film, organic or<br />
anorganic residues present.<br />
If cleaning is required, use a simple alcohol wipe.<br />
Board Rework<br />
Prior to any board rework involving Heat and/or cleaning<br />
removal of the MPI socket is required. The board must be clean<br />
and dry prior to re-installation of existing or new socket.<br />
Removal<br />
As each MPI design tends to be customer specific in<br />
mounting configuration and mounting hardware, please<br />
follow Design specific Assembly/Disassembly instructions.<br />
7
Tyco Electronics-AMP Worldwide<br />
Americas<br />
United States<br />
Tyco Electronics MPI -<br />
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Phone: +1-508-699-7646<br />
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