Metallized Particle Interconnect

Metallized Particle Interconnect
Application Guide

MPI
Columns
2
What is MPI?
The MPI contact system allows the user a means of parallel
interconnection through the use of compression activated
contacts. MPI is a high temperature, flexible, conductive
polymeric interconnect solution which incorporates piercing
and indenting particles to facilitate penetration of oxides on
mating surfaces. MPI has been designed to meet the board
connection requirements of microprocessors, ASIC’s and
MCM’s used in high-end servers, mainframes, workstations,
storage, telecom and data equipment, desktop PC’s, mobile
PC applications. Other applications include mezzanine
Daughter Card-to-Motherboard, Daughter Card-to-Backplane,
Flex-to-Flex and Flex-to-Rigid interconnects.
How does MPI work?
The MPI conductive column is
molded into an insulator which
aligns the columns over the
desired I/O field that is to be
interconnected. As the two surfaces
are compressed, the metallized
particles encapsulated within
the columns link together, thus
providing the conductive path.
Daughter Card/LGA/Flex
MCM/ASIC
PCB/Backplane
Polyimide
Insulator
LGA Design
Guidelines
Why Choose LGA Packaging?
• Socketing of Microprocessor Model
– Maximum Flexibility of Motherboard Inventory to Meet
Market Demands
– “Make-to-Order” Model Achievable
• Motherboard Build Cycle
– Quick Diagnosis (FCT, ICT)
– Inexpensive Replace and Repair: Now Possible
– Highest process yield
• Package Cost
– Smaller Package (High Density)
– No Ball or Pin Attach
– Flexible design -> short time to market
• Tariffs
– Moving Motherboards with Lower Tariff Restrictions:
Now an Option
• Very Low Profile
– Less than 1 mm
• High Speed
– Short Signal Path Permits 12 GHz or Greater Processing
• Power
Speeds
– Short Signal Path Minimizes
Voltage Drop from Package
to Motherboard
– Compensation of thermal mismatch
Package Considerations
Tyco MPI LGA sockets are design to work with both
Ceramic (CLGA) and Organic (OLGA) microprocessor and
ASIC packages.
Package Design
Design should follow standard industry practices as defined
by JEDEC standards, unless otherwise specified.

Package Pad Pitch
1,00 [.039] or 1,27 [.050]
Notify Tyco if different pitch is required, even < 1,0 mm.
Package Pad Dia
Pitch mm [in]
1,00 [.039]
1,27 [.050]
Package Pad Positioning
Package Flatness
0,08 [.003] across package
Effective Pad Dia. mm [in]
±0,05 [.002]
0,70 [.028]
0,86 [.034]
Pitch Pad to Pad Pad Array
mm [in] T.P. @ MMC T.P. @ MMC
1,00 [.039] Ø 0,10 [.004] Ø 0,25 [.010]
1,27 [.050] Ø 0,15 [.006] Ø 0,25 [.010]
Package Sizing versus Array Size
Center Line of last Pad to edge of package 2,00 mm [.079]
recommended. Notify Tyco Electronics/MPI if less.
Package Pad Plating
Gold Flash 0,25µm [10µ inches] over Nickel 3,8µm [150µ inches].
Gold can be either Hard or Soft as defined by Mil-G-45204.
Either Electrolytic or Immersion plating process can be used.
PCB Design
Guidelines
Board Design Considerations
MPI columns are designed to work with all industry standard
board designs and materials (FR-4, Polyimide, etc.)
Carefull consideration with respect to the layout of the board
should be taken, as most MPI applications will require at least
4 thru-holes for compression hard-ware and 2 thru-(or blind)
holes for alignment pins.
Board Design
Design should follow standard industry practices as defined
by IPC Specification 2221, unless otherwise specified.
Board Pad Pitch
1,00 [.039] or 1,27 [.050]
Board Pad Dia
(InPad Via Design)
Pitch Pad Dia. ‘A’ Max Via Dia.
mm [in] ± 0,03 [.001] ‘B’ (After Pltg) mm [in]
1,00 [.039] 0,66 [.026] 0,20 [.008]
1,27 [.050] 0,79 [.031] 0,25 [.010]
Pitch
Pitch
ø "A"
ø 'B'
3

4
PCB Design
Guidelines
Board Pad Dia
(Solid Pad- Offset Via)
Pitch mm [in]
1,00 [.039]
1,27 [.050]
Pitch
Solder Resist (Solder Mask)
The use of solder resist coatings shall be in accordance with
the requirements of IPC-SM-840. It is recommended that only
photo-imageable resists be used as that process yields
superior thickness control.
Resist Thickness
Flush or below the pad surfaces.
Resist Clearance
0,0 – 0,13 mm [.000 – .005] typically
Board Pad Positioning
Pitch mm [in]
1,00 [.039]
1,27 [.050]
Effective Pad Dia. mm [in]
Pitch
± 0,03 [.001]
0,56 [.022]
0,69 [.027]
ø 'A'
Pad to Pad T.P. @ MMC
Ø 0,10 [.004]
Ø 0,10 [.004]
Board Flatness
Design to industry standards. The Bolster Plate used in the
assembly tends to ‘flatten’ the PCB or at least conform it to
the Bolster Plate flatness.
Alignment Hole Tolerancing &
Positioning
Socket Hardware Mounting
Hole Positioning
Ideally, mounting holes should be placed close to the array
(ie. Corners) to minimize board bow.
PWB Pad Plating
Gold Flash 0,25µm [10µ inches] over Nickel 3,8µm
[150µ inches]. Gold can be either Hard or Soft as defined by
Mil-G-45204. Either Electrolytic or Immersion plating process’
can be used.
Pitch Hole Dia. Tol. Alignment Hole
mm [in] ± mm [in] Location T.P. @ MMC w/
Note: Pad surfaces must be free of organic or anorganic con-
tamination, flux residue, resist residue etc.
Respect to Pads
1,00 [.039] 0,025 [.001] 0,20 [.008]
1,27 [.050] 0,025 [.001] 0,20 [.008]

Bolster Plate & Hardware Design
Bolster Plate
The MPI contact system is a solderless Z-axis connection
system and therefore requires mechanical hardware to create
the required compression force and at the same time hold
the connector in place.
The mechanical design typically incorporates the Thermal
Management Solution (i.e. Heat Sink or Heat Spreader Plate)
as the device that applies the top load. In applications where
no Thermal Management Solution is used, a Top Loading
Plate must be used.
To insure an even distribution of loading over the MPI
column array, a secondary device called the Bolster Plate is
typically used on the bottom side of the PCB.
Depending on application, the bolster plate material can be
aluminum, die cast aluminum, steel or St.steel. The thickness
of the Bolster Plate will vary depending on the load (i.e. I/O
count x required load per column) and the material choice of
the Bolster Plate. The plate must be designed to support the
required load, i.e. under load, the Plate must not have a
deflection or bow exceeding 0,025 mm [.001].
In most applications a thin insulating film (Mylar) is placed
between the bolster plate and the PWB to provide electrical
isolation between the Bolster Plate and the PWB.
Bolster Plate Flatness
Ideally, the design of the Bolster Plate should be as flat as
possible. Producing a ‘perfectly’ flat plate is not always possible.
It is easier to actually specify a bow, but in the proper direction.
Threaded
Stand-off
Mounting Hardware
Due to broad range of stack-up tolerances present in a
micro-processor – PWB assembly (package & PWB thickness
tolerances, as well as, Thermal Interface choice) and the uni-
que nature of ‘Elastomeric’ contact design, it is recommended
that the hardware be of such a design as to provided
‘constant (spring) loading’, as opposed to ‘fixed deflection’.
It is recommended that the hardware be located uniformly
with respect to the MPI column array.
The spring deflection should be controlled by mechanical
features (i.e. stops) within the hardware design.
A dry lubricant on the threaded hardware is recommended
so as to maintain a uniform threading torque, as well as
minimizing guallng.
Tyco Electronics/MPI can design and supply the Compression
Hardware and the Bolster Plate combination to meet your
custom application needs.
Bottom
of PWB
[.000 - .003]
after Stand-off
Assembly
5

6
Typical MPI LGA Socket for Workstation/Servers
Showing Thermal Management Hardware & Bolster Plate
Column Size
Column Location
0,25 mm [.01] True Postion with respect to the alignment pins
at MMC.
Socket Design Considerations
Pitch mm [in]
1,00 [.039]
1,27 [.050]
Column Dia. (At Mating Face)
mm [in] (REF)
0,46 [.018]
0,66 [.026]
Hardware
Heat Sink
LGA IC Package
MPI LGA Socket
PWB
Bolster Plate
Column Loading
Each MPI column requires 40 to 80 grams loading for 1,27 mm
[.050] pitch or 35 to 75 grams for 1,00 mm [.039] pitch
designs for maximum performance and reliability. Though
MPI may work in various mounting configurations, it is
recommended that the loading be uniform with respect
to the socket. See Mounting hardware.
Typical Column Deflection
The deflection range is limited by hard stops which are
designed into every socket. The stops prevent overstressing
of the MPI columns.
PWB Real-Estate Requirements
Typcial ‘Framed’ designs require a clear-ance zone of 6,80 mm
[.268] larger than the package size. For example; a
42,5 mm [1.673] sq. package would typically require
sq. clearance zone of 49,30 mm [1.94].
Frameless socket designs (which dispence the plastic frame)
can be designed to occupy no more real-estate than the
package.
Pitch mm [in]
1,00 [.039]
1,27 [.050]
Note: ‘Frameless’ designs are typically designed for ‘Organic’
packaging only.
Maximum Deflection Range
0,20 [.008]
0,25 [.010]

Inspection
All MPI sockets/sockets are 100% electrically inspected for
presence of contacts, dielectric withstanding voltage (500
VAC), and true position. Therefore, Tyco Electronics/MPI
does not believe added inspection at the user adds value.
If inspection at the user is desired, please use
Tyco Electronics/MPI Specification MPI-506.
Installation
Handle the sockets/connectors by the frame/housing only.
Do not touch the MPI columns.
All sockets and connectors are supplied in Static Free vacuum
molded plastic trays. Keep MPI sockets/connectors in trays
until ready for use.
As each MPI design tends to be customer specific in
mounting configuration and mounting hardware, please
follow Design specific Assembly/Disassembly instructions.
Board Cleanliness
Prior to installation, the pads must be clean and dry with
no solder flux, solder residue, oils, adhesive film, organic or
anorganic residues present.
If cleaning is required, use a simple alcohol wipe.
Board Rework
Prior to any board rework involving Heat and/or cleaning
removal of the MPI socket is required. The board must be clean
and dry prior to re-installation of existing or new socket.
Removal
As each MPI design tends to be customer specific in
mounting configuration and mounting hardware, please
follow Design specific Assembly/Disassembly instructions.
7

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