W orld Leader in Quality Thermal Solutions Tyco Electronics Thermal

Tyco Electronics Thermal Solutions 

World Leader in Quality Thermal Solutions 

Catalog 1309431 

Issued 5-02

2 

Need more inforation? 

Call the Techical Support Center: 

1-800-522-6752 


The Technical Support Center is staffed with specialists 

well versed in all Tyco Electronics product. The 

Center can provide you with: 

■ Engineering Support 

■ Catalogs 

■ Product Samples 

■ Technical Documents 

■ Tyco Electronics Authorized 

Distributor Locations 

■ AMPFAX Service 24 Hours a Day 

1309431-PDF only-05/02 

©2002 by Tyco Electronics. All Rights Reserved. Tyco, AMP, AMPFAX, CoolSnap, and Heatpath are trademarks. 

Athlon is a trademark of Advanced Micro Devices, Inc. 

Itanium, Pentium, Pentium III, Pentium 4 and Xeon are trademarks of Intel Corporation. 

Neotherm is a trademark of TEC. 


Issued 5-02 

Tyco Electronics Thermal Solutions 1-800-522-6752 Specifications 

www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change


Table of Contents 


Issued 5-02 

Chip Cooler Design 4 

Design and Testing Capability 5-7 

Chip Cooler Product Section 8-13 

CoolSnap ® 

Clip Installations 14-15 

Fan Data 16 

Active Thermal Solutions for the P4-478 Pentium 4 ® 

Passive Solution for Server Based Systems 20 

Passive Solution for Socketed CPU’s Intel Xeon TM Processor — Prestonia 21 

Passive Solution for Socketed CPU’s Intel Xeon TM Processor — Foster 22 

Active Solution for AMD (Athlon) Sockets - Socket 462 23 

Passive 866 MHz to 1.0 GHz (Small Pinot) 24 

Passive 866 MHz to 1.0 GHz (Large Pinot) 25 

Attachment Mechanisms for Foster, Prestonia, and P4 Heat Sinks 26 

The MPI (Metallized Particle Interconnect) 27-28 

HeatPath Solutions 

DRAM memory module heat spreader plat and thermal interface 29-30 

Thermal interface material for DRAM memory modules and Direct Rambus modules 31-32 

Thin thermal interface elastomer 33-34 

Gap filler thermal interface elastomer 35-36 

Neotherm 202 Series experimental thermal interface material 37-38 

HeatPath Thermally Conductive Material Selection Guide 39-40 


www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change 

17-19 

3

Key Features 

■ Radial style 

■ Pin Fin style 

■ Uni directional style 

■ With/without fan 

■ Easy mount 

■ Removable 

■ For BGA/LGA/PGA and nonedge 

leaded devices 

■ No epoxy requirements 

■ No spring clip 

requirements 

■ No push pin attachments 

■ No through hole screws 

The thermal conductive 

interface is a standard 

feature of the heat sink. 

It is a special blend of 

graded boron nitrite that 

is capable of continuous 

service up to 281°C with 

no breakdown or 

separation of 

components. A fan can 

also be added to the 

heat sink. 


The Assembly 


Issued 5-02 

The removable UL 94 

V-0 rated clip snaps or 

slides onto the device, 

the heat sink is screwed 

into the clip. Interrupted 

threads on the clip 

prevents heat sink 

backout. 

A variety of applications requires a variety of interface and heat sink solutions. 

Tyco Electronics provides unique cooling solutions for a variety of BGA 

semiconductor packages. The product line has expanded to accommodate the 

increasing speed and heat of today´s semiconductors. The attachment method is 

quick, clean and effective. 

4 Tyco Electronics Thermal Solutions 1-800-522-6752 Specifications 


Design and Testing 

Capability 

■ Custom Application 

Specific Solutions 

■ Optimum Thermal Design 

numerical and analytical 

approaches 

■ CFD Simulations and 

Analysis 

■ Thermal and Mechanical 

Testing: computer-control 

test system, wind tunnels, 

thermal cycling chamber, 

thermal shock chamber 

etc. 


Design and Testing Capability 

With critical parameters supplied by customers such as maximum 

chip temperature, ambient temperature, power consumed 

by chip, air flow, and (X,Y,Z) constraints, Tyco Thermal Solutions 

can create accurate models and provide optimum solutions for 

customers' applications. This technique optimizes performance 

and cuts down on time consuming design iteration. 

Modeling an airflow field, Tyco Thermal Solutions can improve air flow 

and heat sink designs to better suit a customer's application. 


Issued 5-02 



5

6 


Design and Testing Capability: 

With pressure field modeling, Tyco Thermal Solutions can minimize 

the pressure drop across a heat sink. Since the pressure drop is 

directly related to the resistance to air flow, Tyco can design heat 

sinks to give small resistance to air flow. 

With a system simulation, Tyco Thermal Solutions, can see how 

unique components react in a system environment. Suggested solutions 

based on their performance alone, may react differently in a 

system because of the neighboring component effects on temperature 

and air flow field. This analysis further optimizes the performance 

of a custom designed heat sink. 


Issued 5-02 



Folded-Fin Performance 

Folded-Fin Performance 

Thermal Image 


Design and Testing Capability 

Folded-fin mean thermal resistance = 0.251°C/W 

Standard Deviation = 0.0049°C/W 

3 σ = 0.015°C/W 

Number of samples = 180 

Typical Test Report Data Provided with Thermal Products 


Issued 5-02 



7



Issued 5-02 

SIZE 2 FIN 5W @ 200 LFM 3 FIN 5W @ 200 LFM 4 Fin 5W @ 200 LFM 

21MM 1-1542005-1 7.22 5-1542004-4 5.99 1-1542005-2 5.26 

23MM L 2-1542003-2 7.22 5-1542004-7 5.99 8-1542003-1 5.26 

25MM 1-1542007-7 5.09 1-1542007-9 5.99 9-1542006-4 3.82 

27MM 4-1542007-0 7.80 4-1542007-1 6.13 4-1542007-2 5.39 

29MM NONE 2-1542007-3 4.22 2-1542007-4 3.83 

30.5MM 5-1542005-8 7.80 4-1542007-3 6.13 4-1542007-4 5.39 

31MM 9-1542004-4 7.80 9-1542004-7 6.13 5-1542003-3 5.39 

32.5MM 8-1542005-8 6.32 9-1542005-3 5.74 9-1542005-2 4.79 

35MM 4-1542007-5 6.32 4-1542007-6 5.74 4-1542007-7 4.79 

37.5MM 4-1542007-8 6.32 4-1542007-9 5.74 5-1542007-0 4.79 

40MM 9-1542003-2 4.96 9-1542003-4 4.22 9-1542003-5 3.80 

40.5MM 5-1542007-8 5.34 9-1542006-2 4.92 5-1542007-7 3.80 

42.5MM 5-1542007-1 4.96 5-1542007-2 4.22 5-1542007-3 3.80 

45MM 5-1542006-1 4.96 5-1542006-5 4.22 5-1542006-6 3.80 

47.5MM 1542006-4 5.08 2-1542005-1 4.28 4-1542003-7 3.83 

Heat Sinks Heat Sink Heat Sink 

21mm BGA 

(Radial Heat Sinks) 

Thermal Resistance (°C\W) Assembly 

Type Diameter Height 

Power 

Part Number 

0 LFM 200 LFM 400 LFM 600 LFM 

5 14.41 8.95 6.47 5.00 

1 Fin Radial 1.375[34.92] 0.255[6.47] 10 12.71 8.86 6.79 4.94 X-154200X-X 

15 11.58 8.77 6.76 4.85 

5 12.88 6.97 4.95 3.95 

Pin Fin (1) 1.376[34.95] 0.500[12.70] 10 11.24 6.66 4.82 3.88 X-154200X-X 

15 10.27 6.53 4.6 3.82 

Fin Radial 

style 

Heat Sink 

Power in watts 

used in thermal 

test 

Pin fin 

style 


Package 

size 

Air velocity 

LFM (Linear Feet per 

Minute) 



8


21mm BGA (Radial Heat Sinks) 


Issued 5-02 

21mm BGA 



Type 


Diameter 

Inch[mm] 


Height 

Inch[mm] 

Power 

(W) 

Thermal Resistance (°C/W) Part Number 


5 14.41 8.95 6.47 5.00 

1 Fin Radial 1.375 [34.92] 0.255 [6.47] 10 12.71 8.86 6.79 4.94 1-1542005-0 

15 11.58 8.77 6.76 4.85 

5 13.43 7.22 4.85 4.05 


15 11.26 7.24 4.70 3.92 

5 13.23 5.99 4.05 3.45 


15 10.46 6.04 3.72 3.28 

5 12.34 5.26 3.51 2.91 


15 10.21 5.14 3.52 2.84 

5 11.90 4.75 3.50 2.50 


15 9.74 4.46 3.22 2.41 

5 10.67 4.10 3.31 2.25 


15 8.94 3.93 2.97 2.14 

5 10.56 3.80 3.25 2.20 


15 8.79 3.75 2.97 2.06 

Data is from tests conducted in 

Tyco Electronics thermal lab. 



9

10 




Issued 5-02 

25mm BGA 



Type 


Diameter 

Inch[mm] 


Height 

Inch[mm] 

Power 

(W) 



5 14.41 8.95 6.47 5.00 


15 11.58 8.77 6.76 4.85 

5 13.43 7.22 4.85 4.05 


15 11.26 7.24 4.70 3.92 

5 13.23 5.99 4.05 3.45 


15 10.46 6.04 3.72 3.28 

5 12.34 5.26 3.51 2.91 


15 10.21 5.14 3.52 2.84 

5 11.90 4.75 3.50 2.50 


15 9.74 4.46 3.22 2.41 

5 10.67 4.10 3.31 2.25 


15 8.94 3.93 2.97 2.14 

5 10.56 3.80 3.25 2.20 


15 8.79 3.75 2.97 2.06 






25mm BGA (Pin Fin/Unidirectional Heat Sinks) 


Issued 5-02 

25mm BGA 

(Pin Fin/Unidirectional Heat Sinks) 


Type 


Diameter 

Inch[mm] 


Height 

Inch[mm] 

Power 

(W) 


0 LFM 200 LFM 400 LFM 600 LFM *With Fan 

Pin Fin 

[PF(1)] 

1.376 [34.95] 0.500 [12.70] 

5 

10 

15 

12.88 

11.24 

10.27 

6.97 

6.66 

6.53 

4.95 

4.82 

4.60 

3.95 

4.94 

3.82 

3.79 

4.06 

3.94 

1542007-9 


[PF(2)] 

1.376 [34.95] 0.750 [19.05] 

5 

10 

15 

11.21 

9.66 

8.82 

5.54 

5.41 

5.21 

3.60 

3.51 

3.31 

3.05 

2.94 

2.88 

4.18 

4.02 

3.88 

3-1542004-6 


[PF(3)] 

1.355 [34.41] 1.100 [27.94] 

5 

10 

15 

9.09 

8.26 

7.93 

3.90 

3.91 

3.80 

3.10 

2.89 

2.92 

2.60 

2.52 

2.49 

N/A 

N/A 

N/A 

3-1542005-6 


[PF(4)] 

2.000 [50.80] 0.500 [12.70] 

5 

10 

15 

10.13 

9.03 

8.30 

6.14 

5.82 

5.82 

4.40 

4.30 

4.34 

3.45 

3.36 

3.31 

3.47 

3.22 

3.16 

6-1542001-1 


[PF(5)] 

2.000 [50.80] 0750 [19.05] 

5 

10 

15 

8.85 

7.97 

7.41 

4.55 

5.42 

4.57 

3.45 

3.39 

3.34 

2.55 

2.45 

2.42 

2.07 

2.00 

1.97 

5-1542001-4 


[PF(6)] 

2.000 [50.80] 1.100 [27.94] 

5 

10 

15 

7.28 

6.37 

6.00 

3.35 

3.22 

3.18 

2.55 

2.42 

2.38 

2.25 

2.13 

2.09 

1.63 

1.66 

1.65 

2-1542001-9 

Unidirectional 

1.985 [50.41] 

[Uni(1)] 

0.297 [7.54] 

5 

10 

15 

11.06 

9.86 

9.10 

6.24 

6.04 

5.94 

4.30 

4.15 

4.28 

3.15 

3.04 

3.00 

3.15 

3.14 

3.17 

6-1542006-5 

Unidirectional 

1.375 [34.92] 

[Uni(2)] 

0.342 [8.68] 

5 

10 

15 

14.16 

12.78 

11.74 

8.65 

8.49 

8.35 

5.94 

5.61 

5.72 

4.55 

4.52 

4.54 

5.24 

4.99 

4.85 

7-1542001-2* 

*12V Double Ball Bearing fan used in testing 





11


30.5mm BGA (Radial Heat Sinks) 


Issued 5-02 

30.5mm BGA 



Type 


Diameter 

Inch[mm] 


Height 

Inch[mm] 

Power 

(W) 



5 14.09 8.72 6.13 5.27 


15 11.68 8.23 5.76 4.82 

5 13.40 7.80 4.88 4.28 


15 10.97 7.23 4.58 4.04 

5 13.25 6.13 4.35 3.14 


15 10.75 5.89 3.96 2.99 

5 12.59 5.39 3.28 2.80 


15 10.17 5.32 3.26 2.61 

5 11.38 4.46 3.33 2.52 


15 9.59 4.42 2.93 2.22 

5 10.83 4.32 2.89 2.89 


15 9.08 4.25 2.74 2.12 

5 10.54 3.76 2.70 1.79 


15 8.79 3.73 2.36 1.93 








Issued 5-02 

40mm BGA 



Type 


Diameter 

Inch[mm] 


Height 

Inch[mm] 

Power 

(W) 



5 8.97 5.36 3.76 3.25 


15 7.92 5.36 3.77 3.21 

5 8.91 4.96 3.37 2.72 


15 7.54 4.99 3.19 2.61 

5 8.78 4.22 2.75 2.16 


15 7.62 4.26 2.60 2.03 

5 8.75 3.80 2.30 2.13 


15 7.37 3.69 2.19 1.88 

5 8.73 3.30 1.84 1.95 


15 7.13 3.21 1.96 1.71 

5 7.76 2.80 2.06 1.53 


15 6.77 2.79 1.77 1.46 

5 6.82 2.75 1.87 1.68 


15 6.17 2.63 1.64 1.45 





13

Step 1 


CoolSnap ® Clip Installations 

Ensure that the heat sink is partially threaded (no more than one 

complete turn) into the mounting clip, forming the assembly. 

Step 2 (Option1) 

4 leg clips have 2 legs for centrally locating the assembly. Slide 

one lip leg under package at an angle insuring that the location 

legs are aligned with the package. Make sure that lip is completely 

inserted into the gap between the package and the board. 

Carefully press downward until the opposite lip leg snaps onto 

the opposite side of the package. 

Step 2 (Option 2) 

On 2 or 3 legs clip only. Slide the open side on to the package 

and centrally position it on the package. 

Step 3 

Screw the heat sink into place until contact is made with the 

package. Torque to the required force. 

* Torque values are application specific 


Issued 5-02 




CoolSnap ® 

Clip Removal Instructions 


Issued 5-02 



15

When ordering please specify: 


Fan Data 

No fan, or type of fan (sleeve bearing, ball/sleeve bearing, or double ball bearing) 

Note: Fan Height + Heat Sink Height = Heat Sink Assembly Overall Height 


Issued 5-02 



Part Number: 1-1542007-1 

2.0 GHz - AL/AL 

Product Features 

■ Direct Aluminum Fin to 

Aluminum Base Brazed 

part, enclosed in an 

Aluminum Shroud directly 

bonded to the base 

adding the additional 

thermal benefits. 

■ Equipped with our 

Standard Delta Fan which 

can be replaced with a 

60 x 60 x 15 mm Nidec 

Fan to impove thermal 

preformance. 

TYCO and AMP FAX are trademarks. 

Pentium 4 is a registered trademarks of Intel Corporation. 

1309XXX—AMP-CC&CE— PDF file only 04/02 


Active Thermal Solution 

P4-478 Pentium 4 ® 


Issued 5-02 

Description: 

This Active Solution is intended for use on the Northwood Pentium 

4® and will preform up to 2.0 GHz 

Mechanical Specifications 

Dimensions (Including Fan): 

82.7 x 70.0 x 55.9 mm 

[3.3′′ x 2.8′′ x 2.2′′] 

Total Weight: 365.0 grams 

Thermal Performance: 

Theta ca = 0.41° C/W 

Flow Rate = 9.6 CFM@0.05 inch H2O 

Thermal testing conducted using a Grease TIM with an 

average thermal resistance of 0.06°C/W 

Fan Specifications: 

Type: Delta EFB0612MA-F00 

Dimensions: 60 x 60 x 10 mm 

Operating Voltage: 7.0 - 13.8 VDC 

Fan Speed: 3600 RPM 

MTBF: 70,000 hours @ 40°C 

Leads: Standard 3 pin Connections 

Noise Level: 29 dB (33 Max) 

Shock & Vibration: 

Product was tested and approved to a 40G shock and a 

166 in/sec velocity change. Test results available upon request. 

Thermal Interface Material: 

This unit can be supplied with Grease, Phase Change, or 

Customer specified Thermal Interface Material. 

Attachment Mechanism: 

Clip Attachment: Two Piece Metal 

Clip Engagement Force: 25 lbs 

Load Force: 60 lbs 

Clip engagement and load force can be customized to suit individual 

requirements. This unit can be supplied with Tyco Electronics 

approved clip or Customer specified clip. 

Frame ordered separated. See page 26 



17

18 


2.5 GHz - AL/AL 









■ Equipped with our 

Standard Delta Fan which 

can be replaced with a 

60 x 60 x 15 mm Nidec 

Fan to impove thermal 

preformance. 


Pentium 4 is a registered trademarks of Intel Corporation. 



Active Thermal Solution 

P4-478 Pentium 4 ® 


Issued 5-02 

Description: 

This solution is an Aluminum Folded Fin metallurgically bonded to 

an Aluminum Base, encased in an Aluminum Shroud. 


Dimensions (Including Fan): 

83.0 x 70.0 x 63.9 mm 

[3.3′′ x 2.8′′ x 2.5′′] 

Total Weight: 340 grams 


Theta ca = 0.36° C/W 

Flow Rate = 20.3 CFM@0.10 inch H2O 




Dimensions: 70 x 70 x 15 mm 

Operating Voltage: 3.5 - 13.8 VDC 

Fan Speed: 4600 RPM ± 300RPM 

MTBF: 70,000 hours @ 40°C 

Leads: Standard 3 pin Connections 








Clip Attachment: Single Lever Cam Actuated Plastic Clip 

Clip Engagement Force: 15 lbs 

Load Force: 85lbs 

Creep Rate: Average 15% total Creep from ambient up to 45° 

Frame ordered separately, see page 36 




Nickel Plated 


■ Features a copper base, 

copper fins and an 

aluminum shrould all 

Solder bonded for added 

strength and preformmance. 

Product comes 

nickel plated. 

■ Part can be easily configured 

to meet individual 

customer needs and 

design requirements. 


Itanium is a registered trademarks of Intel Corporation. 



Passive Solution for Server Based Systems 

For the ItaniumIA64 ** — M c Kinley 


Issued 5-02 

0.15 

0.05 

1 2 3 4 5 



Rs-a (deg. C/W) 

0.3 

0.27 

0.24 

0.21 

0.18 

Air Flow (m/s) 

Description: 

This Passive Solution is intended for use on the Itanium IA64 

Processor code named McKinley 


Dimensions: 

71.0 x 100.0 x 44.1 mm 

[2.8′′ x 3.9′′ x 1.7′′] 



Theta sa at 2 m/s = 0.25° C/W 

Pressure Drop at 2 m/s = 0.09 in H2O Theta sa at 4 m/s = 0.21° C/W 

Pressure Drop at 4 m/s = 0.25 in H2O Thermal Interface Material: 


Product was tested and approved at a 40G shock and a 


Available to Customer Specifications. 


An Optional Die Cast Stiff Plate with all required attaching 

hardware for ease of assembly to the Retention Frame can be 

added to the Base Heat sink upon customer request. 

Customer Options: 

Nickel Plating on Base Plate, Folded Fin or Shroud available 

upon request. Stiff Plate and attaching hardware for assembly 

to RM available upon request. Custom modifications to fit 

system configuration available upon request. 

y 

0.3 

0.25 

0.2 

0.15 

0.1 

Pressure Drop (inH2O) 

19

20 


Without Nickel Plating 


■ Features a copper base, 

copper fins and an 

aluminum shrould all 

Solder bonded for added 

strength and preformmance. 

Product components 

come without 

Nickel Plating. 

■ Part can be easily configured 

to meet individual 

customer needs and 

design requirements. 


Itanium is a registered trademarks of Intel Corporation. 


Passive Solution for Server Based Systems 

For the ItaniumIA64 ** — M c Kinley 


Issued 5-02 

0.15 

0.05 

1 2 3 4 5 




0.3 

0.27 

0.24 

0.21 

0.18 


Description: 

This Passive Solution is intended for use on the Itanium IA64 

Processor code named McKinley 


Dimensions: 

71.0 x 100.0 x 44.1 mm 

[2.8′′ x 3.9′′ x 1.7′′] 




Pressure Drop at 2 m/s @ 0.09 in H2O Thermal testing conducted using a Grease TIM with an 



Available to Customer Specifications. 


An Optional Die Cast Stiff Plate with all required attaching 

hardware for ease of assembly to the Retention Frame can be 

added to the Base Heat sink upon customer request. 

Customer Options: 

Nickel Plating on Base Plate, Folded Fin or Shroud available 

upon request. Stiff Plate and attaching hardware for assembly to 

RM available upon request. Custom modifications to fit system configuration 

available upon request. 

y 

0.3 

0.25 

0.2 

0.15 

0.1 

Pressure Drop (inH2O)


AL/AL Passive 





Aluminum Shroud Directly 



Thermal Benefits. 


Intel Xeon is a registered trademarks of Intel Corporation. 



Passive Solution for Socketed CPU’s 

Intel Xeon Processor — Foster 



Issued 5-02 

0.245 

0.080 

1.50 2.00 2.50 3.00 3.50 4.00 4.50 



0.300 

0.295 

0.290 

0.285 

0.280 

0.275 

0.270 

0.265 

0.260 

0.255 

0.250 

Foster 

Air Flow Rate (m/s) 

0.240 

0.220 

0.200 

0.180 

0.160 

0.140 

0.120 

0.100 

Description: 

This Passive Solution is intended for use on the Intel Xeon 

Processor Code name Foster 


Dimensions: 

88.9 x 63.5 x 50.8 mm 

[3.5′′ x 2.5′′ x 2′′] 






Chomerics T454 (46.7 x 41.27) or as per customer requirements 


Ordered separately, see page 26 for options. 

Pressure Drop (in.H2O) 

21


AL/CU Passive 



Copper Base Soldered 






TYCO and AMP FAX are registarted trademarks. 

Intel Xeon is a registered trademarks of Intel Corporation. 



Passive Solution 

Intel Xeon Processor — Prestonia 



Issued 5-02 



0.270 

0.265 

0.260 

0.255 

0.250 

0.245 

0.240 

0.235 

0.230 

0.225 

1.50 2.00 2.50 3.00 3.50 4.00 4.50 

Air Flow Rate (m/s) 

Description: 

This Passive Solution is intended for use on the Intel Xeon 

Processor Code name Prestonia. 


Dimensions: 

88.9 x 63.5 x 50.4 mm 

[3.5′′ x 2.5′′ x 1.9′′] 






As per customer requirements 


Ordered separately, see page 26 for options. 

0.170 

0.160 

0.150 

0.140 

0.130 

0.120 

0.110 

0.100 

0.090 

0.080 

Pressure Drop (in.H2O)


AL/Active 


■ Aluminum Folded Fin 

metallurgically bonding 

to an Aluminum base 

encased in an Aluminum 

Shroud. 


AMD (Athlon) Sockets - Socket 462 


Issued 5-02 

Description: 

App roved Thermal Solution for the AMD Athlon XP TM 

socket 462. 


Dimensions: 60 x 60 x 10mm 

Operating Voltage: 7.0-13.8VDC max 

Fan Speed: 4600 RPM ± 300 RPM 

Leads: Standard 3 pin Connector 


80.0 x 61.6 x 58.3 mm 

Dimensions: 

(3.1” x 2.4” x 2.3”) 



Theta ja = 0.67° C/W 

Flow Rate = 13 CFM @ 0.09 inch H2O 





166in/sec velocity change. Test results available upon request. 




Clip Attachment: 

Single Piece Stainless Clip 

Engagement Force: 5 to 8 lbs 

Load Force: 12 to 25 lbs 

Clip engagement and load force can be customized to suit 

individual requirements. This unit can be supplied with the 

Tyco Electronics approved clip or Customer specified clip. 



23


AL/CU Passive 


■ Approved Thermal 

Solution for the 

Pentium III ® 

Socket 370. 

This solution is an 

Aluminum Folded Fin 

metallurgically bonded 

to a Copper Base. 

Note: Dimensions (Small Pinot) 


Passive 866 MHz to 1.0 GHz Thermal Solution (Small Pinot) 

Thermal Performance Chart 

Description: 


Dimensions: 

64.5 x 55.9 x 26.8 mm 

(2.5” x 2.2” x 1.1”) 



Theta sa = 0.60° C/W 

Pressure Drop = 2m/s @ 0.13 inch H2O 


Issued 5-02 

0.3 

0.00 

0 1 2 3 4 5 6 







This unit comes with standard interface material but can be 

supplied with Grease, Phase Change, or Customer specified 

Thermal Interface Material. 


Standard Attachment Mechanism available upon request. 




1.0 

0.9 

0.8 

0.7 

0.6 

0.5 

0.4 


0.35 

0.30 

0.25 

0.20 

0.15 

0.10 

0.05


AL/CU Passive 


■ Approved Thermal 

Solution for the 

Pentium III ® 

Socket 370. 

This solution is an 

Aluminum Folded Fin 

metallurgically bonded 

to a Copper Base. 

Note: Dimensions (Large Pinot) 


Passive 866 MHz to 1.0 GHz Thermal Solution (Large Pinot) 


Issued 5-02 




Thermal Performance Chart 

0. 70 

0. 65 

0. 60 

0. 55 

0. 50 

0. 45 

0. 40 

0. 35 

1 2 3 4 5 6 

Ai r Fl ow (m /s) 

Description: 


Dimensions: 

86.1 x 64.2 x 26.8 mm 

(3.4′′ x 2.5′′ x 1.1′′) 



Theta sa = 0.40° C/W 

Pressure Drop = 2m/s @ 0.10 inch H2O 







This unit comes with standard interface material but can be 

supplied with Grease, Phase Change, or Customer specified 

Thermal Interface Material. 


Standard Attachment Mechanism available upon request. 

0. 4 

0. 35 

0. 3 

0. 25 

0. 2 

0. 15 

0. 1 

0. 05 

Pressure Drop (in H O) 

2 

25

Attachment Mechanism for P4 

Heat Sinks 


Passive Solution 

Attachment Mechanism for Foster and Prestonia Heat Sinks 

Attachment Options: 

Part Number Description 

1542625-1 Metal Clip without quick release* 

1542626-1 Plastic Retention Module with push pins* 

1542627-1 Metal Clip with quick release 

1542628-1 Plastic Retention Module with out push pins 

Note: Attachment mechanisms are not part of assemblies - must be ordered 

separately in pairs. 

* Recommended version 


Issued 5-02 

Attachment Options: 

Part Number Description 

1470197-1 Plastic Retention Module with push pins 

Note: Attachment mechanisms are not part of assemblies - must be ordered separately. 



TYCO ELECTRONICS INTRODUCES 

MPI Metallized Particle Interconnect 


Issued 5-02 

The MPI Material System: MPI is a material system designed to address high 

density socket and connector requirements. Today's microprocessors and ASICs 

continue to increase in both pin count and density. The MPI product line produces 

sizes from 24 to 5000+ I/O on 1mm and 1,27 mm grid spacing. 

The patented MPI (Metalized Particle Interconnect) material system provides a 

highly conductive interconnect. This proprietary material consists of a high temperature 

polymer compound that has been embedded with metalized particles. The 

material is formed into micro-columns just 0.635mm in diameter and 1mm high. 

The columns are held in a grid pattern by a thin polyimide substrate. This carrier 

registers the columns to the pads on the silicon package to the pads on the PC 

board. 

MPI Column 

When mechanically compressed, the columns' electrical characteristics are optimized. 

Due to its short compressed length of .70mm, it is virtually transparent at 

gigahertz speeds. A signal running at 10 gigahertz does not encounter any disturbance 

when passing through an MPI column. 

Chip-to-Board MPI/LGA Socket Board-to-Board 

MPIConnectorSocket 

Polyimide Substrate 

Flex-to-Board MPI Socket 

Optical Module Interconnect Compression Hardware MPI>SI - Side Interface 

Daughter Card to Backplane 

Interconnect Socket 



27

28 

Typical Application: 

Tyco Electronics MPI system solves the challenge of 

connecting high I/O microprocessors and ASICs to 

PC boards. MPI LGA Sockets utilize solderless, compression 

mount technology. Force must be applied to 

each column for it to achieve its superior electrical 

performance. Threaded hardware connects to the 

studs of the bolster plate which pass through the PC 

board, socket and heatsink. Tightening the hardware 

creates a load on the heatsink, which is generated by 

the springs. This causes the LGA package to compress 

the MPI conductive columns to the board. The 

bolster plate provides support behind the PC board as 

the columns are compressed. 

MPI>SI Backplane Interconnect: 

TYCO ELECTRONICS INTRODUCES 

MPI Metallized Particle Interconnect 

In years past, low frequency transmissions could 

absorb the difference between the connector parameters 

and the PCB. As data transfers and rise times 

push into the gigabit range, signal ringing, jitter and 

edge rate profiles break down the signal quality to 

unacceptable levels. MPI>SI refers to a revolutionary 

PCB technology. SI allows the inner layers to exit 

through the actual side of the PCB (represented by 

the thickness dimension). This provides a flat mating 

surface for the MPI contact. The advantage of this 

technology is that you keep the signal within the PCB 

for greater period of time. By staying within the 

“Controlled Impedance Environment” longer, there is 

less disturbance to the signal. This short interconnect 

distance eliminates the large electrical interruption 

one would see in traditional two piece connectors. 

Threaded 

Hardware 

Land Grid 

Array Package 

PC Board 


Issued 5-02 


MPI LGA 

Socket 

Bolster 

Plate 




■ Alumina-filled reinforced 

thermal gel 

■ Soft and compressible 

■ Low thermal resistance 

■ Excellent surface wetting 

■ Accommodates wide 

tolerance range 


HeatPath GTQ-HS Series 

DRAM memory module heat spreader plate and 

thermal interface material assembly 

Assembly combines 

HeatPath thermal interface 

material pre-applied to the 

DRAM module heat spreader 

plate, to provide a costeffective 

solution for DRAM 

heat dissipation. 

The heat spreader plate 

meets Intel requirements 

and is available in a variety 

of standard colors in an 

anodized finish. Five standard 

pedestal heights as 

well as custom heights are 

available. 

HeatPath thermal interface 

material consists of an alumina 

filled silicone gel to 

provide for excellent heat 

transfer at a cost effective 

price. Combining softness 

and compressibility with 

excellent surface wetting, 

the HeatPath material 

accommodates a wide 

range of gaps, tolerances, 

and uneven surfaces to provide 

for low thermal resis- 

tance at low compression, 

maximizing heat flow to the 

DRAM module heat spreader 

plate. 

Versatility and Variety 

HeatPath GTQ-HS series 

materials have a high thermal 

conductivity and are 

available in two different 

versions to meet the most 

demanding applications: 

•GTQ-HS-R100, pad-onplate, 

for general applications. 

The HeatPath pad is 

reinforced with a fiberglass 

carrier for mproved 

handling and tear resistance. 

The HeatPath pad 

is available preattached in 

five standard thicknesses 

and in pad sizes customized 

to DRAM chip 

layout. 

•GTQ-HS-R200, dispenseon-plate, 

for low compression 

applications. By 

dispensing and curing the 


Issued 5-02 

HeatPath in place prior 

to module assembly, the 

thermal interface material 

is four times as compressible 

as the standard GTQ- 

R100. With the enhanced 

softness and compressibility, 

GTQ-R200 can 

accommodate a wider 

range of gaps, tolerances, 

and uneven surfaces. 

Assemblies are supplies in 

trays of 50 pieces each. 



29

HeatPath GTQ-R100 

Typical product properties 

127.00 ±0.25 

(5.000 ±.010) 

HeatPath GTQ-HS Series 

DRAM memory module heat spreader plate and 

thermal interface material assembly 

26.54 

(1.045) 


Issued 5-02 

Test condition Unit R100 R200 Test method 

Thermal conductivity W/m°K 1.1 1.0 ASTM E 1530 

Thermal resistance (T0.50 mm) at 20 psi °C–in 2 /w 0.70 0.55 Analysis Tech-Tip 31 Device 

Compression deflection (T0.50 mm) at 20 psi % 8 30 Analysis Tech-Tip 31 Device 

Specific gravity g/cm 3 2.0 2.0 ASTM D 792 

Use temperature °C –40 to 150 –40 to 150 

Volume resistivity ohm-cm 1 X 10 12 1 X 10 12 ASTM D 257 

Dielectric breakdown voltage T0.25 mm V kVac 2 2 ASTM D 149 

T0.50 mm V kVac 6 6 

Coefficient of linear thermal expansion /°C 5.5 X 10 -4 5.5 X 10 -4 ASTM E 831 

Flammability HB* HB* UL 94 

Color Gray Gray 

*UL 94 VO available. 

Part numbering system 

GTQ-HSX-X YY Z-RXXX-TX.X-XXX 

Product drawing number (for R-100 only) 

Drawing Number HeatPath width (mm) HeatPath length (mm) CL1 CL2 

-078 11 100 58.86 9.45 

-080 11.36 104 58.86 9.45 

-098 12 109 58.86 9.45 

-102 12 108.25 58.86 9.45 

-132 11 55 58.86 9.45 

For R-100 

T.50 = .500 ± 0.10 mm (.020 in) 


T1.0 = 1.00 ± 0.2 mm (.040 in) 

For R-200 


HeatPath material 

R100 = GTQ-R100 fiberglass reinforced thermal material 

R200 = GTQ-R200 non reinforced thermal material 

Plating 

1 = Anodize 12.7-20 µm thick per ISO 8079 

Plating Color 

00 = Black 14 = Gold 

11 = Clear 16 = Blue 

12 = Red 24 = Light Gold 

Pedestal height 

1 = 1.17 ± 0.05 mm (.046 in) 







Module size 

2 = 1.250 in DRAM module 

3 = 1.375 in DRAM module 




■ Alumina-filled reinforced 

thermal gels 

■ Soft and compressible 

■ Low thermal resistance 

■ Excellent surface wetting 

■ High surface tack 


HeatPath GTQ R100 Series 

Thermal interface material for DRAM memory modules and 

Direct Rambus modules 

HeatPath thermal interface material 

is designed 

to cost-effectively maximize heat 

transfer from DRAM modules to the 

heat spreader plate. Combining 

softness and compressibility with 

excellent surface wetting, the 

HeatPath material accommodates a 

wide range of gaps, tolerances, and 

uneven surfaces to provide for low 

thermal resistance at low compression, 

maximizing heat flow to the 

DRAM heat spreader plate. 

HeatPath GTQ R100 products consist 

of an alumina-filled silicone gel to 

provide for excellent heat transfer at 

a cost-effective price. It incorporates 

a fiberglass carrier, which provides 

physical reinforcement for improved 

handling and tear resistance. 

Variety 

HeatPath GTQ R100 series material 

have a high thermal conductivity 

and are available in two 

different versions to meet the most 


•GTQ R100 for general applications 

Proven performance 

Extensive physical testing, including 

tensile and compression tests, 

demonstrates that HeatPath thermal 

interface material is stable and does 

not become brittle over time. Testing 

also shows that the HeatPath material 

remains stable after accelerated 

aging. 

Easy installation 

HeatPath is inherently very tacky, 

staying in position during assembly 

without the need for adhesives, and 

can be easily removed and repositioned. 

Prestamped pieces are quickly 

installed by hand or with vacuum 

pick and place installation equipment. 


Issued 5-02 

Versatility 

HeatPath GTQ R100 products are 

available in prestamped shapes on 

continuous rolls or in sheets, with 

release film on both sides. 

Prestamped shapes are available to 

meet each manufacturer’s specific 

dimensions, in thicknesses of .25, 

.375, .50, .75, and 1.0 millimeter 

(.010, .015, .020, .030, and .040 

inch). 



31



GTQ-R100-TX.XX-XXX-XX 


HeatPath GTQ R100 Series 

Thermal interface material for DRAM memory modules and 

Direct Rambus modules 

Top Cover Material (for R100 only) 

UP = Ustamped Poly film 

SP = Stamped Poly film 

Product drawing number 

0XXX = Stamped on sheets 

1XXX = Stamped on rolls 

Product thickness (mm) 

0.25 mm ±.05 (.010 in ± .002) 





Material type 

R100 = Fiberglass-reinforced thermal material 


Issued 5-02 

Test condition Unit R100 Test method 

Thermal conductivity W/m°K 1.1 ASTM E 1530 

Thermal resistance (T0.50 mm) at 20 psi °C–in 2 /w 0.70 Analysis Tech-Tip 31 Device 

Compression deflection (T0.50 mm) at 20 psi % 8 Analysis Tech-Tip 31 Device 

Specific gravity g/cm 3 2.0 ASTM D 792 

Use temperature °C –40 to 150 

Volume resistivity ohm-cm 1 X 10 12 ASTM D 257 

Dielectric breakdown voltage T0.25 mm kVac 2 ASTM D 149 

T0.50 mm kVac 6 

Coefficient of linear thermal expansion /°C 5.5 X 10 –4 ASTM E 831 

Flammability HB* UL 94 

Color Gray 

*UL 94 VO available. 

Stamped shapes on rolls (preferred package) 

T0.25 mm 150 ft/roll 





Stamped sheets (4 x 10 inch sheet) 

T0.25 mm 200 sheets/box 








■ Silicone elastomer 

■ High thermal conductivity 

■ UL 94 V0 

■ K = 0.9 W/m-K to 

2.9 W/m-K 


HeatPath GTQ 1200 Series 

Thin thermal interface elastomer 

The HeatPath GTQ 1200 series of 

thin interface materials consists of 

advanced silicone elastomer compounds 

with high thermal conductivity 

and superior flame-retardancy. 

These materials are designed to 

cost-effectively transfer heat from 

power transistors and integrated circuits 

to a heat plate or heat sink. 

They are usable over a wide temperature 

range and provide excellent 

electrical insulating properties. 

HeatPath GTQ 1200 series materials 


and are also available with a fiberglass 

reinforcement for improved 

material handling and poke-through 

resistance. The 

fiberglass-reinforced material is 

also available with a pressure-sensitive 

adhesive (PSA) 

backing for easy and quick installation. 

Variety 

HeatPath GTQ 1200 series material 


and are available in three 

different versions to meet the most 


•GTQ 1202 and 1212 with fiberglass 

reinforcements to minimize 

stretching 

•GTQ 1232 and 1242 for general 

applications 

•GTQ 1252 and 1262 for high 

thermal conductivity requirement 

applications 

•GTQ 1272 with Boron Nitride for 

very high performance 











Issued 5-02 



is cold-applied and requires no heat 

or curing. The material can be 

removed easily and cleanly, with no 

special tools, for access and rework. 

Versatility 

HeatPath GTQ 1200 products are 

available in unstamped rolls and as 

individual stamped 

shapes in a variety of standard 

thicknesses. The PSA-backed material 

is available either unstamped on 

rolls or in stamped shapes on rolls 

or sheets, with a carrier film. The 

operating use temperature is –60°C 

to 180°C (–45°C to 150°C for the 

PSA-backed material). 



33

34 




Thin thermal interface elastomer 


Issued 5-02 

Test condition Unit 1202 1212 1232 1242 1252 1262 1272 Test method 

Color Green Brown Black Green Brown Gray White 

Reinforcement material Fiberglass Fiberglass Fiberglass 

Thermal conductivity W/m°K 0.9 1.4 1.1 1.2 1.7 2.6 2.9 ASTM E 1530 

Thermal resistance (T0.30) °C-in 2 /W 1.13 1.03 0.87 0.87 0.71 0.54 0.70 Analysis Tech 

Elongation % 2 2 250 100 60 110 2 ASTM D 412 

Specific gravity g/cm 3 2.2 2.4 2.2 2.3 2.4 2.5 1.7 ASTM D 792 

Hardness (Shore A) 92 92 55 75 85 79 85 ASTM D 2240 

Tear strength (45°) lb/in (kg/cm) 73 (13) 50 (9) 73 (13) 50 (9) 39 (7) 45 (8) 73 (13) ASTM D 624, 

C-Die 

Volume resistivity ohm-cm 10 15 10 15 10 14 10 15 10 15 10 14 10 15 ASTM D 257 

Dielectric constant at 1 KHz 3.5 3.9 4.1 4.4 4.9 5.3 3.0 ASTM D 150 

Loss factor at 1 KHz 0.003 0.003 0.003 0.002 0.004 0.001 0.001 ASTM D 150 

Dielectric breakdown voltage kVac 8.0 9.0 11.0 10.0 9.0 9.0 10.0 ASTM D 149 

Flammability V0 V0 V0 V0 V0 V0 V0 UL94 

Electrical insulant standard 150% 

Note: Values reflect nominal performance of T0.30-mm sample. Complete specifications are available from Raychem. 

Ordering Information 


GTQ-12XX-T0.XX-XXXX-XX 

AD = Adhesive option for 1202, 1212 and 1272 only 

Product drawing number 

0XXX = Stamped on sheets 

1XXX = Stamped on rolls 

2XXX = Unstamped sheets 

3XXX = Individual stamped pieces 

5XXX = Unstamped rolls 

Product thickness 

1232, 1242, 1252, 1262: 1202, 1212: 

t0.30 = 0.3 + 0.1/-0 t0.15 = 0.15 + 0.02/-0.04 

t0.45 = 0.45 +/- 0.05 t0.20 = 0.20 + 0.02/-0.04 

t0.85 = 0.85 +/- 0.05 t0.30 = 0.30 +0.10 /-0 

Material type 

1202 = Fiberglass-reinforced silicone elastomer, K = 0.9 W/m°K 


1232 = Silicone elastomer, K = 1.1 W/m°K 





Standard packaging 

Unstamped rolls 

50-meter length for T0.45 and thicker 

100-meter length for T0.30 and thinner 

Individual stamped pieces 

500 pieces per bag 

Stamped shapes on rolls 

(1202, 1212 and 1272 with adhesive) 

100-meter length 

1272: 

t0.20 = 0.20+/- 0.05 

t0.30 = 0.30 +0.1/-0 

t0.45 = 0.45+/- 0.05 

t0.85 = 0.85+/- 0.05 




■ Silicone elastomer 

■ Soft and conformable 

■ Low silicone volatiles 

■ UL 94 V0 

■ -40°C to +150°C 



Gap filler thermal interface elastomer 

The HeatPath GTQ 2200 series of 

thick gap filler pads are advanced 

silicone elastomer compounds that 

are highly conformable, with high 

thermal conductivity and superior 

flame-retardancy. They are designed 

to fill in rough, uneven, or out-ofparallel 

surfaces, easily accommodating 

tolerance stack-up between 

CPU or semiconductors and their 

heat sink or heat spreader. GTQ 

2200 products have low silicone 

volatiles and are suitable for silicone-volatile-sensitive 

applications. 

They are usable over a wide temperature 

range, provide excellent electrical 

insulating properties, and are 

easily compressed, providing excellent 

cushioning of components. 

Variety 

HeatPath GTQ 2200 series materials 


and are available in four different 

versions to meet the most demanding 

applications: 

• GTQ 2212 gap filler material for 

general applications. 

• GTQ 2222 gap filler material with 

one side tacky for improved handling. 


nylon mesh to minimize stretching. 


nylon mesh and one side tacky 

for improved handling where 

stretching is a concern. 


Issued 5-02 












is cold-applied and requires no heat 

or curing. The material can be 

removed easily and cleanly, with no 

special tools, for access and rework. 

Versatility 

HeatPath GTQ 2200 products are 

available as individual cut pieces, as 

sheets of prestamped pieces, or as 

unstamped sheets. 



35




Gap filler thermal interface elastomer 


Issued 5-02 

Test condition Unit 2212 2222 2232 2242 Test method 

Color Dark gray Dark gray Dark gray Dark gray Visual 

Thermal conductivity W/m°K 1.50 1.50 1.50 1.50 ASTM D 5470 

Thermal resistance (T3.0 mm) at 20 psi °C-in 2 /W 3 3 3 3 ASTM 1530 

Compression at 10 psi % 10 7 20 16 

at 20 psi % 20 17 51 44 

Hardness Shore 00 < 70 < 70 < 70 < 70 ASTM D 2240 

Elongation % 100 80 80 60 ASTM D 412 

Tensile strength Kg/cm 2 3.0 5.0 5.0 7.0 

Specific gravity g/cm 3 2.6 2.6 2.6 2.6 ASTM D 792 

Temperature range °C -40 to 150 -40 to 150 -40 to 150 -40 to 150 

Volume resistivity ohm-cm 1.0 x 10 13 1.0 x 10 13 1.0 x 10 13 1.0 x 10 13 ASTM D 257 

Dielectric breakdown voltage kVac > 20 > 20 > 20 > 20 ASTM D 149 

Silicone volatiles D4-D20 wt%


Neotherm 202 Series 

Experimental thermal interface material 

Product Description 

Tyco Electronics is developing a new class of thermal interface 

materials that offer the thermal performance benefits of 

thermal greases and phase change materials with the handling 

and stability benefits of elastomeric materials. 

Basic Uses 

The "Neotherm" 202 Series of thermal interface materials 

are designed for use in any application where thermal 

greases, phase change materials or thin elastomeric pads 

are currently used. These materials have been specifically 

designed for CPU and memory application, but they may 

also be used for telecom applications and power supplies. 

Packaging 

Available as continuous films or pre-cut decals on waterslide 

decal paper or coated plastic film. Film thickness range from 

0.05 mm up to 0.5 mm. 


Issued 5-02 

Installation 

The "Neotherm" 202 Series materials are applied to heat 

sinks and heat spreaders by decal transfer. For continuous 

films, the material should be cut to the desired dimensions 

before removing the protective cover sheet to avoid deformation 

of the edges. After removing the protective cover 

sheet, apply the tacky side of the material to the substrate. 

For waterslide decal paper, apply water to the paper backing 

with a sponge or eye-dropper. Wait at least one minute for 

the water to activate the release paper. Remove the paper 

backing by sliding the paper along the surface of the substrate. 

Remove any excess water from the substrate with a 

clean, lint free cloth. The material is now ready for final 

assembly. No high temperature reflow or removal of excess 

material is necessary. 

Properties 

Neotherm 202-1 202-3 

Applications CPU’s, memory Memory, Power 

Cone Penetration 

ASTM 217 

200-300 300-500 

Volume Resistivity 

1x10 12 

ohm-cm 1x10 12 

ASTM D 257 

ohm-cm 

Initial Thickness 8 mil (0.20mm) 6 mil (0.15mm) 

Thickness @ 80 psi 3.5 mil (0.09) 1 mil (0.04mm) 

Thermal Resistance @ 80 psi 

Analysis Tech 

Thermal Resistance @ 30 psi 

ASTM D 5470 

0.02°C-in 2 

/W 0.10°C-in 2 

/W 

0.06°C-in 2 

/W 0.10°C-in 2 

/W 



37

Testing and Evaluation 


Neotherm 202 Series 

Experimental thermal interface material 

"Neotherm" 202-1 has been tested by several techniques 

against thermal grease and phase change thermal interface 

materials to illustrate the benefits of this new material. A 

modified ASTM D 5470 test apparatus was used to determine 

the thermal resistance of thermal interface materials 

as a function of pressure (Figure 1). At an applied pressure 

of 30 psi, "Neotherm" 202-1 shows similar performance with 

grease and phase change (the phase change material 

requires an elevated temperature reflow process before 

testing). 

Tr (C-in 2/W) 

0.13 

0.12 

0.11 

0.1 

0.09 

0.08 

0.07 

0.06 

0.05 

"Neotherm" 202-1 

phase change 

grease 

0.04 

10 15 20 25 30 

applied pressure (psi) 

Figure 1. Modified ASTM D 5470 data 

Similar results for thermal resistance versus pressure were 

performed using an Analysis Tech Thermal Analyzer (Figure 

2). The Analysis Tech data also shows that phase change 

materials require an elevated temperature reflow process to 

obtain optimal thermal performance. 


Issued 5-02 



Tr (C-in 2/W) 

0.5 

0.4 

0.3 

0.2 

0.1 

0 

"Neotherm" 202-1 

phase change (initial) 

phase change (65 C reflow) 

0 20 40 60 80 100 

applied pressure (psi) 

Figure 2. Analysis Tech Thermal Analyzer data 

An Intel Pentium III based desktop computer was configured 

with CPU temperature monitoring software to evaluate the 

CPU operating temperature with different thermal interface 

materials (Figure 3). "Neotherm" 202-1 performs as well or 

better than other common interface materials. 

CPU delta T (C) 

70 initial 

60 

59 

50 

after 65 C 

reflow 

40 

30 

20 

10 

0 

w/o TIM 

13 

Neotherm 202-1 

34 

Phase Change 

18 

13 

Grease 

Figure 3. Desktop CPU data 

(delta T = CPU temp - motherboard temp)

39 


HeatPath Thermally Conductive Material 

Selection Guide 

Product Line 2100 2101 2160 2212 2222 2232 2242 

Color Gray Gray Gray Gray Gray Gray Gray 

Thickness (mm) 2.2 +/- 0.40 2.2 +/- 0.40 2.2 +/- 0.40 0.5 +/- 0.1 0.5 +/- 0.1 0.5 +/- 0.1 0.5 +/- 0.1 

3+/- 0.50 3+/- 0.50 3+/- 0.50 1.0 +/- 0.2 1.0 +/- 0.2 1.0 +/- 0.2 1.0 +/- 0.2 

3.8 +/- 0.71 3.8 +/- 0.71 3.8 +/- 0.71 1.5 +/- 0.2 1.5 +/- 0.2 1.5 +/- 0.2 1.5 +/- 0.2 

4.6 +/- 0.71 4.6 +/- 0.71 4.6 +/- 0.71 2.0 +/- 0.3 2.0 +/- 0.3 2.0 +/- 0.3 2.0 +/- 0.3 

2.5 +/-0.3 2.5 +/-0.3 2.5 +/-0.3 2.5 +/-0.3 

3.0 +/-0.3 3.0 +/-0.3 3.0 +/-0.3 3.0 +/-0.3 

3.5 +/- 0.3 3.5 +/- 0.3 3.5 +/- 0.3 3.5 +/- 0.3 

4.0 +/- 0.4 4.0 +/- 0.4 4.0 +/- 0.4 4.0 +/- 0.4 

Thermal Resistance, 

5.0 +/- 0.5 5.0 +/- 0.5 5.0 +/- 0.5 5.0 +/-0.5 

ºC-in◊/W 

Thermal Conductivity, 

4.5 4.5 4.7 3 3 3 3 

W/mº-K nominal 

Voltage Breakdown - 

0.7 0.7 0.7 1.5 1.5 1.5 1.5 

(T3.0 mm) >20 >20 >20 >20 >20 >20 >20 

Continuous Use Temp.ºC -40C to 150C -40C to 150C -40C to 150C -40C to 150C -40C to 150C -40C to 150C -40C to 150C 

Flammability (UL 94) HB V1 HB VO V0 VO V0 

Construction Unsupported Unsupported Unsupported Unsupported Unsupported Fabric reinforced Fabric rei 

forced One side tacky One side tacky One side tacky 

Matrix Silicone gel Silicone gel Silicone gel Silicone rubber Silicone rubber Silicone rubber Silicone rubber 

Filler 

Note: 

Alumina Alumina Alumina Alumina Alumina Alumina Alumina 

GTQ-1200 series: Values reflect nominal performance of T0.30 mm sample 

GTQ-1500 series: Thermal resistance: Values reflect nominal performance of T0.25 mm sample 

Voltage Breakdown: Values reflect nominal performance of T1.0 mm sample 

GTQ-4000 series:Values reflect nominal performance of T0.127 mm sample 

GTQ-2100, 2500, and 2200 series: Values reflect nominal performance of T3.0 mm sample 

GTQ-2400 series: Values reflect nominal performance of T2.5 mm sample 


Issued 5-02 

GTQ Product Line 1202 1212 1232 1242 1252 1262 1272 1500 1502 1560 4103 4213 4223 4233 4323 

Color Green Brown Black Green Brown Gray White Gray Gray Gray White Pink Pink Pink Gray 

Thickness (mm) 0.15 +0.02/-0.04 0.15 +0.02/-0.04 0.30 +0.1/-0 0.30 +0.1/-0 0.30 +0.1/-0 0.30 +0.1/-0 0.20 +/-0.05 0.25 +/- 0.05 0.25 +/- 0.05 0.25 +/- 0.05 0.127 0.051 0.076 0.102 0.076 

0.20 +0.02/-0.04 0.20 +0.02/-0.04 0.45 +/-0.05 0.45 +/-0.05 0.45 +/-0.05 0.45 +/-0.05 0.30 +0.1/-0 0.5 +/- 0.05 0.5 +/- 0.05 0.5 +/- 0.05 

0.30 +0.10/-0 0.30 +0.10/-0 0.85 +/-0.05 0.85 +/-0.05 0.85 +/-0.05 0.85 +/-0.05 0.45 +/-0.05 0.75 +/- 0.15 0.75 +/- 0.15 0.75 +/- 0.15 

0.85 +/-0.05 1 +/- 0.20 1 +/- 0.20 1 +/- 0.20 

1.5 +/- 0.02 1.5 +/- 0.02 1.5 +/- 0.02 

Thermal Resistance, 

ºC-in◊/W 

1.13 1.03 0.87 0.87 0.71 0.54 0.7 

0.45 0.6 0.75 0.03 0.16 0.27 0.35 0.05 

Thermal Conductivity, 

W/mº-K nominal 

0.9 1.4 1.1 1.2 1.7 2.6 2.9 

1.1 0.9 1.1 

Voltage Breakdown (kVac) 8 9 11 10 9 9 10 

8 8 8 

Continuous Use 

Temperature ºC 

-60 to 180 -60 to 180 -60 to 180 -60 to 180 -60 to 180 -60 to 180 -60 to 180 

-40 to 150 -40 to 150 -40 to 150 Max 200 Max 200 Max 200 Max 200 Max 200 

Continuous Use Temp. 

ºC - PSA backed 

Flammability (UL 94) 

-45 to 150 

V0 

-45 to 150 

V0 

N/A 

V0 

N/A 

V0 

N/A 

V0 

N/A 

V0 

-45 to 150 

V0 

N/A 

HB 

N/A 

V0 

N/A 

HB 

N/A N/A 

V0 

N/A 

V0 

N/A 

V0 

N/A 

Construction Fiberglass Fiberglass Unsupported Unsupported Unsupported Unsupported Fiberglass Fiberglass Fiberglass Fiberglass None Polyimide Polyimide Polyimide Aluminum 

Matrix Silicone rubber Silicone rubber Silicone rubber Silicone rubber Silicone rubber Silicone rubber Silicone rubber Silicone gel Silicone gel Silicone gel Parrafin wax Parrafin wax Parrafin wax Parrafin wax Parrafin wax 

Filler Alumina Alumina Alumina Alumina Alumina Alumina Boron nitride Alumina Alumina Alumina ZnO ZnO ZnO ZnO ZnO 



2412 2422 2432 2442 2500 

Gray Gray Gray Gray Blue 

0.5 +/- 0.1 0.5 +/- 0.1 0.5 +/- 0.1 0.5 +/- 0.1 2.2 +/- 0.40 

1.0 +/- 0.2 1.0 +/- 0.2 1.0 +/- 0.2 1.0 +/- 0.2 3+/- 0.50 

1.5 +/- 0.2 1.5 +/- 0.2 1.5 +/- 0.2 1.5 +/- 0.2 

2.0 +/- 0.3 2.0 +/- 0.3 2.0 +/- 0.3 2.0 +/- 0.3 

2.5 +/-0.3 2.5 +/-0.3 2.5 +/-0.3 2.5 +/-0.3 

3.0 +/-0.3 3.0 +/-0.3 3.0 +/-0.3 3.0 +/-0.3 

3.5 +/- 0.3 3.5 +/- 0.3 3.5 +/- 0.3 3.5 +/- 0.3 

4.0 +/- 0.4 4.0 +/- 0.4 4.0 +/- 0.4 4.0 +/- 0.4 

5.0 +/- 0.5 5.0 +/- 0.5 5.0 +/- 0.5 5.0 +/- 0.5 

1.4 1.6 1.6 1.6 3.8 

2 2 2 2 0.9 

>20 >20 >20 >20 >20 

-40C to 150C -40C to 150C -40C to 150C -40C to 150C -40C to 150C 

V0 V0 V1 V1 HB 

Unsupported Unsupported Fabric reinforced Fabric reinforced Unsupported 

One side tacky One side tacky 

Silicone rubber Silicone rubber Silicone rubber Silicone rubber Silicone gel 

Boron nitride Boron nitride Boron nitride Boron nitride Alumina

W orld Leader in Quality Thermal Solutions Tyco Electronics Thermal

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