W orld Leader in Quality Thermal Solutions Tyco Electronics Thermal
W orld Leader in Quality Thermal Solutions Tyco Electronics Thermal
W orld Leader in Quality Thermal Solutions Tyco Electronics Thermal
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<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
W<strong>orld</strong> <strong>Leader</strong> <strong>in</strong> <strong>Quality</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Catalog 1309431<br />
Issued 5-02
2<br />
Need more <strong>in</strong>foration?<br />
Call the Techical Support Center:<br />
1-800-522-6752<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
The Technical Support Center is staffed with specialists<br />
well versed <strong>in</strong> all <strong>Tyco</strong> <strong>Electronics</strong> product. The<br />
Center can provide you with:<br />
■ Eng<strong>in</strong>eer<strong>in</strong>g Support<br />
■ Catalogs<br />
■ Product Samples<br />
■ Technical Documents<br />
■ <strong>Tyco</strong> <strong>Electronics</strong> Authorized<br />
Distributor Locations<br />
■ AMPFAX Service 24 Hours a Day<br />
1309431-PDF only-05/02<br />
©2002 by <strong>Tyco</strong> <strong>Electronics</strong>. All Rights Reserved. <strong>Tyco</strong>, AMP, AMPFAX, CoolSnap, and Heatpath are trademarks.<br />
Athlon is a trademark of Advanced Micro Devices, Inc.<br />
Itanium, Pentium, Pentium III, Pentium 4 and Xeon are trademarks of Intel Corporation.<br />
Neotherm is a trademark of TEC.<br />
Catalog 1309431<br />
Issued 5-02<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Table of Contents<br />
Catalog 1309431<br />
Issued 5-02<br />
Chip Cooler Design 4<br />
Design and Test<strong>in</strong>g Capability 5-7<br />
Chip Cooler Product Section 8-13<br />
CoolSnap ®<br />
Clip Installations 14-15<br />
Fan Data 16<br />
Active <strong>Thermal</strong> <strong>Solutions</strong> for the P4-478 Pentium 4 ®<br />
Passive Solution for Server Based Systems 20<br />
Passive Solution for Socketed CPU’s Intel Xeon TM Processor — Prestonia 21<br />
Passive Solution for Socketed CPU’s Intel Xeon TM Processor — Foster 22<br />
Active Solution for AMD (Athlon) Sockets - Socket 462 23<br />
Passive 866 MHz to 1.0 GHz (Small P<strong>in</strong>ot) 24<br />
Passive 866 MHz to 1.0 GHz (Large P<strong>in</strong>ot) 25<br />
Attachment Mechanisms for Foster, Prestonia, and P4 Heat S<strong>in</strong>ks 26<br />
The MPI (Metallized Particle Interconnect) 27-28<br />
HeatPath <strong>Solutions</strong><br />
DRAM memory module heat spreader plat and thermal <strong>in</strong>terface 29-30<br />
<strong>Thermal</strong> <strong>in</strong>terface material for DRAM memory modules and Direct Rambus modules 31-32<br />
Th<strong>in</strong> thermal <strong>in</strong>terface elastomer 33-34<br />
Gap filler thermal <strong>in</strong>terface elastomer 35-36<br />
Neotherm 202 Series experimental thermal <strong>in</strong>terface material 37-38<br />
HeatPath <strong>Thermal</strong>ly Conductive Material Selection Guide 39-40<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
17-19<br />
3
Key Features<br />
■ Radial style<br />
■ P<strong>in</strong> F<strong>in</strong> style<br />
■ Uni directional style<br />
■ With/without fan<br />
■ Easy mount<br />
■ Removable<br />
■ For BGA/LGA/PGA and nonedge<br />
leaded devices<br />
■ No epoxy requirements<br />
■ No spr<strong>in</strong>g clip<br />
requirements<br />
■ No push p<strong>in</strong> attachments<br />
■ No through hole screws<br />
The thermal conductive<br />
<strong>in</strong>terface is a standard<br />
feature of the heat s<strong>in</strong>k.<br />
It is a special blend of<br />
graded boron nitrite that<br />
is capable of cont<strong>in</strong>uous<br />
service up to 281°C with<br />
no breakdown or<br />
separation of<br />
components. A fan can<br />
also be added to the<br />
heat s<strong>in</strong>k.<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
The Assembly<br />
Catalog 1309431<br />
Issued 5-02<br />
The removable UL 94<br />
V-0 rated clip snaps or<br />
slides onto the device,<br />
the heat s<strong>in</strong>k is screwed<br />
<strong>in</strong>to the clip. Interrupted<br />
threads on the clip<br />
prevents heat s<strong>in</strong>k<br />
backout.<br />
A variety of applications requires a variety of <strong>in</strong>terface and heat s<strong>in</strong>k solutions.<br />
<strong>Tyco</strong> <strong>Electronics</strong> provides unique cool<strong>in</strong>g solutions for a variety of BGA<br />
semiconductor packages. The product l<strong>in</strong>e has expanded to accommodate the<br />
<strong>in</strong>creas<strong>in</strong>g speed and heat of today´s semiconductors. The attachment method is<br />
quick, clean and effective.<br />
4 <strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change
Design and Test<strong>in</strong>g<br />
Capability<br />
■ Custom Application<br />
Specific <strong>Solutions</strong><br />
■ Optimum <strong>Thermal</strong> Design<br />
numerical and analytical<br />
approaches<br />
■ CFD Simulations and<br />
Analysis<br />
■ <strong>Thermal</strong> and Mechanical<br />
Test<strong>in</strong>g: computer-control<br />
test system, w<strong>in</strong>d tunnels,<br />
thermal cycl<strong>in</strong>g chamber,<br />
thermal shock chamber<br />
etc.<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Design and Test<strong>in</strong>g Capability<br />
With critical parameters supplied by customers such as maximum<br />
chip temperature, ambient temperature, power consumed<br />
by chip, air flow, and (X,Y,Z) constra<strong>in</strong>ts, <strong>Tyco</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
can create accurate models and provide optimum solutions for<br />
customers' applications. This technique optimizes performance<br />
and cuts down on time consum<strong>in</strong>g design iteration.<br />
Model<strong>in</strong>g an airflow field, <strong>Tyco</strong> <strong>Thermal</strong> <strong>Solutions</strong> can improve air flow<br />
and heat s<strong>in</strong>k designs to better suit a customer's application.<br />
Catalog 1309431<br />
Issued 5-02<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
5
6<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Design and Test<strong>in</strong>g Capability:<br />
With pressure field model<strong>in</strong>g, <strong>Tyco</strong> <strong>Thermal</strong> <strong>Solutions</strong> can m<strong>in</strong>imize<br />
the pressure drop across a heat s<strong>in</strong>k. S<strong>in</strong>ce the pressure drop is<br />
directly related to the resistance to air flow, <strong>Tyco</strong> can design heat<br />
s<strong>in</strong>ks to give small resistance to air flow.<br />
With a system simulation, <strong>Tyco</strong> <strong>Thermal</strong> <strong>Solutions</strong>, can see how<br />
unique components react <strong>in</strong> a system environment. Suggested solutions<br />
based on their performance alone, may react differently <strong>in</strong> a<br />
system because of the neighbor<strong>in</strong>g component effects on temperature<br />
and air flow field. This analysis further optimizes the performance<br />
of a custom designed heat s<strong>in</strong>k.<br />
Catalog 1309431<br />
Issued 5-02<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change
Folded-F<strong>in</strong> Performance<br />
Folded-F<strong>in</strong> Performance<br />
<strong>Thermal</strong> Image<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Design and Test<strong>in</strong>g Capability<br />
Folded-f<strong>in</strong> mean thermal resistance = 0.251°C/W<br />
Standard Deviation = 0.0049°C/W<br />
3 σ = 0.015°C/W<br />
Number of samples = 180<br />
Typical Test Report Data Provided with <strong>Thermal</strong> Products<br />
Catalog 1309431<br />
Issued 5-02<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
7
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Catalog 1309431<br />
Issued 5-02<br />
SIZE 2 FIN 5W @ 200 LFM 3 FIN 5W @ 200 LFM 4 F<strong>in</strong> 5W @ 200 LFM<br />
21MM 1-1542005-1 7.22 5-1542004-4 5.99 1-1542005-2 5.26<br />
23MM L 2-1542003-2 7.22 5-1542004-7 5.99 8-1542003-1 5.26<br />
25MM 1-1542007-7 5.09 1-1542007-9 5.99 9-1542006-4 3.82<br />
27MM 4-1542007-0 7.80 4-1542007-1 6.13 4-1542007-2 5.39<br />
29MM NONE 2-1542007-3 4.22 2-1542007-4 3.83<br />
30.5MM 5-1542005-8 7.80 4-1542007-3 6.13 4-1542007-4 5.39<br />
31MM 9-1542004-4 7.80 9-1542004-7 6.13 5-1542003-3 5.39<br />
32.5MM 8-1542005-8 6.32 9-1542005-3 5.74 9-1542005-2 4.79<br />
35MM 4-1542007-5 6.32 4-1542007-6 5.74 4-1542007-7 4.79<br />
37.5MM 4-1542007-8 6.32 4-1542007-9 5.74 5-1542007-0 4.79<br />
40MM 9-1542003-2 4.96 9-1542003-4 4.22 9-1542003-5 3.80<br />
40.5MM 5-1542007-8 5.34 9-1542006-2 4.92 5-1542007-7 3.80<br />
42.5MM 5-1542007-1 4.96 5-1542007-2 4.22 5-1542007-3 3.80<br />
45MM 5-1542006-1 4.96 5-1542006-5 4.22 5-1542006-6 3.80<br />
47.5MM 1542006-4 5.08 2-1542005-1 4.28 4-1542003-7 3.83<br />
Heat S<strong>in</strong>ks Heat S<strong>in</strong>k Heat S<strong>in</strong>k<br />
21mm BGA<br />
(Radial Heat S<strong>in</strong>ks)<br />
<strong>Thermal</strong> Resistance (°C\W) Assembly<br />
Type Diameter Height<br />
Power<br />
Part Number<br />
0 LFM 200 LFM 400 LFM 600 LFM<br />
5 14.41 8.95 6.47 5.00<br />
1 F<strong>in</strong> Radial 1.375[34.92] 0.255[6.47] 10 12.71 8.86 6.79 4.94 X-154200X-X<br />
15 11.58 8.77 6.76 4.85<br />
5 12.88 6.97 4.95 3.95<br />
P<strong>in</strong> F<strong>in</strong> (1) 1.376[34.95] 0.500[12.70] 10 11.24 6.66 4.82 3.88 X-154200X-X<br />
15 10.27 6.53 4.6 3.82<br />
F<strong>in</strong> Radial<br />
style<br />
Heat S<strong>in</strong>k<br />
Power <strong>in</strong> watts<br />
used <strong>in</strong> thermal<br />
test<br />
P<strong>in</strong> f<strong>in</strong><br />
style<br />
Heat S<strong>in</strong>k<br />
Package<br />
size<br />
Air velocity<br />
LFM (L<strong>in</strong>ear Feet per<br />
M<strong>in</strong>ute)<br />
8 <strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
8
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
21mm BGA (Radial Heat S<strong>in</strong>ks)<br />
Catalog 1309431<br />
Issued 5-02<br />
21mm BGA<br />
(Radial Heat S<strong>in</strong>ks)<br />
Heat S<strong>in</strong>k<br />
Type<br />
Heat S<strong>in</strong>k<br />
Diameter<br />
Inch[mm]<br />
Heat S<strong>in</strong>k<br />
Height<br />
Inch[mm]<br />
Power<br />
(W)<br />
<strong>Thermal</strong> Resistance (°C/W) Part Number<br />
0 LFM 200 LFM 400 LFM 600 LFM<br />
5 14.41 8.95 6.47 5.00<br />
1 F<strong>in</strong> Radial 1.375 [34.92] 0.255 [6.47] 10 12.71 8.86 6.79 4.94 1-1542005-0<br />
15 11.58 8.77 6.76 4.85<br />
5 13.43 7.22 4.85 4.05<br />
2 F<strong>in</strong> Radial 1.375 [34.92] 0.357 [9.06] 10 12.23 7.08 4.67 3.96 1-1542005-1<br />
15 11.26 7.24 4.70 3.92<br />
5 13.23 5.99 4.05 3.45<br />
3 F<strong>in</strong> Radial 1.375 [34.92] 0.467 [11.86] 10 11.44 6.03 3.84 3.31 5-1542004-4<br />
15 10.46 6.04 3.72 3.28<br />
5 12.34 5.26 3.51 2.91<br />
4 F<strong>in</strong> Radial 1.375 [34.92] 0.571 [14.50] 10 11.12 5.16 3.52 2.81 1-1542005-2<br />
15 10.21 5.14 3.52 2.84<br />
5 11.90 4.75 3.50 2.50<br />
5 F<strong>in</strong> Radial 1.375 [34.92] 0.678 [17.22] 10 10.61 4.64 3.26 2.42 1-1542005-3<br />
15 9.74 4.46 3.22 2.41<br />
5 10.67 4.10 3.31 2.25<br />
6 F<strong>in</strong> Radial 1.375 [34.92] 0.797 [20.24] 10 9.85 4.19 3.03 2.16 0-1542005-9<br />
15 8.94 3.93 2.97 2.14<br />
5 10.56 3.80 3.25 2.20<br />
7 F<strong>in</strong> Radial 1.375 [34.92] 0.894 [22.70] 10 9.56 3.77 2.97 2.13 7-1542003-9<br />
15 8.79 3.75 2.97 2.06<br />
Data is from tests conducted <strong>in</strong><br />
<strong>Tyco</strong> <strong>Electronics</strong> thermal lab.<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
9
10<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
25mm BGA (Radial Heat S<strong>in</strong>ks)<br />
Catalog 1309431<br />
Issued 5-02<br />
25mm BGA<br />
(Radial Heat S<strong>in</strong>ks)<br />
Heat S<strong>in</strong>k<br />
Type<br />
Heat S<strong>in</strong>k<br />
Diameter<br />
Inch[mm]<br />
Heat S<strong>in</strong>k<br />
Height<br />
Inch[mm]<br />
Power<br />
(W)<br />
<strong>Thermal</strong> Resistance (°C/W) Part Number<br />
0 LFM 200 LFM 400 LFM 600 LFM<br />
5 14.41 8.95 6.47 5.00<br />
1 F<strong>in</strong> Radial 1.375 [34.92] 0.255 [6.47] 10 12.71 8.86 6.79 4.94 3-1542005-7<br />
15 11.58 8.77 6.76 4.85<br />
5 13.43 7.22 4.85 4.05<br />
2 F<strong>in</strong> Radial 1.375 [34.92] 0.357 [9.06] 10 12.23 7.08 4.67 3.96 1-1542007-7<br />
15 11.26 7.24 4.70 3.92<br />
5 13.23 5.99 4.05 3.45<br />
3 F<strong>in</strong> Radial 1.375 [34.92] 0.467 [11.86] 10 11.44 6.03 3.84 3.31 5-1542004-8<br />
15 10.46 6.04 3.72 3.28<br />
5 12.34 5.26 3.51 2.91<br />
4 F<strong>in</strong> Radial 1.375 [34.92] 0.571 [14.50] 10 11.12 5.16 3.52 2.81 5-1542003-0<br />
15 10.21 5.14 3.52 2.84<br />
5 11.90 4.75 3.50 2.50<br />
5 F<strong>in</strong> Radial 1.375 [34.92] 0.678 [17.22] 10 10.61 4.64 3.26 2.42 3-1542005-9<br />
15 9.74 4.46 3.22 2.41<br />
5 10.67 4.10 3.31 2.25<br />
6 F<strong>in</strong> Radial 1.375 [34.92] 0.797 [20.24] 10 9.85 4.19 3.03 2.16 5-1542003-1<br />
15 8.94 3.93 2.97 2.14<br />
5 10.56 3.80 3.25 2.20<br />
7 F<strong>in</strong> Radial 1.375 [34.92] 0.894 [22.70] 10 9.56 3.77 2.97 2.13 4-1542005-0<br />
15 8.79 3.75 2.97 2.06<br />
Data is from tests conducted <strong>in</strong><br />
<strong>Tyco</strong> <strong>Electronics</strong> thermal lab.<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
25mm BGA (P<strong>in</strong> F<strong>in</strong>/Unidirectional Heat S<strong>in</strong>ks)<br />
Catalog 1309431<br />
Issued 5-02<br />
25mm BGA<br />
(P<strong>in</strong> F<strong>in</strong>/Unidirectional Heat S<strong>in</strong>ks)<br />
Heat S<strong>in</strong>k<br />
Type<br />
Heat S<strong>in</strong>k<br />
Diameter<br />
Inch[mm]<br />
Heat S<strong>in</strong>k<br />
Height<br />
Inch[mm]<br />
Power<br />
(W)<br />
<strong>Thermal</strong> Resistance (°C/W) Part Number<br />
0 LFM 200 LFM 400 LFM 600 LFM *With Fan<br />
P<strong>in</strong> F<strong>in</strong><br />
[PF(1)]<br />
1.376 [34.95] 0.500 [12.70]<br />
5<br />
10<br />
15<br />
12.88<br />
11.24<br />
10.27<br />
6.97<br />
6.66<br />
6.53<br />
4.95<br />
4.82<br />
4.60<br />
3.95<br />
4.94<br />
3.82<br />
3.79<br />
4.06<br />
3.94<br />
1542007-9<br />
P<strong>in</strong> F<strong>in</strong><br />
[PF(2)]<br />
1.376 [34.95] 0.750 [19.05]<br />
5<br />
10<br />
15<br />
11.21<br />
9.66<br />
8.82<br />
5.54<br />
5.41<br />
5.21<br />
3.60<br />
3.51<br />
3.31<br />
3.05<br />
2.94<br />
2.88<br />
4.18<br />
4.02<br />
3.88<br />
3-1542004-6<br />
P<strong>in</strong> F<strong>in</strong><br />
[PF(3)]<br />
1.355 [34.41] 1.100 [27.94]<br />
5<br />
10<br />
15<br />
9.09<br />
8.26<br />
7.93<br />
3.90<br />
3.91<br />
3.80<br />
3.10<br />
2.89<br />
2.92<br />
2.60<br />
2.52<br />
2.49<br />
N/A<br />
N/A<br />
N/A<br />
3-1542005-6<br />
P<strong>in</strong> F<strong>in</strong><br />
[PF(4)]<br />
2.000 [50.80] 0.500 [12.70]<br />
5<br />
10<br />
15<br />
10.13<br />
9.03<br />
8.30<br />
6.14<br />
5.82<br />
5.82<br />
4.40<br />
4.30<br />
4.34<br />
3.45<br />
3.36<br />
3.31<br />
3.47<br />
3.22<br />
3.16<br />
6-1542001-1<br />
P<strong>in</strong> F<strong>in</strong><br />
[PF(5)]<br />
2.000 [50.80] 0750 [19.05]<br />
5<br />
10<br />
15<br />
8.85<br />
7.97<br />
7.41<br />
4.55<br />
5.42<br />
4.57<br />
3.45<br />
3.39<br />
3.34<br />
2.55<br />
2.45<br />
2.42<br />
2.07<br />
2.00<br />
1.97<br />
5-1542001-4<br />
P<strong>in</strong> F<strong>in</strong><br />
[PF(6)]<br />
2.000 [50.80] 1.100 [27.94]<br />
5<br />
10<br />
15<br />
7.28<br />
6.37<br />
6.00<br />
3.35<br />
3.22<br />
3.18<br />
2.55<br />
2.42<br />
2.38<br />
2.25<br />
2.13<br />
2.09<br />
1.63<br />
1.66<br />
1.65<br />
2-1542001-9<br />
Unidirectional<br />
1.985 [50.41]<br />
[Uni(1)]<br />
0.297 [7.54]<br />
5<br />
10<br />
15<br />
11.06<br />
9.86<br />
9.10<br />
6.24<br />
6.04<br />
5.94<br />
4.30<br />
4.15<br />
4.28<br />
3.15<br />
3.04<br />
3.00<br />
3.15<br />
3.14<br />
3.17<br />
6-1542006-5<br />
Unidirectional<br />
1.375 [34.92]<br />
[Uni(2)]<br />
0.342 [8.68]<br />
5<br />
10<br />
15<br />
14.16<br />
12.78<br />
11.74<br />
8.65<br />
8.49<br />
8.35<br />
5.94<br />
5.61<br />
5.72<br />
4.55<br />
4.52<br />
4.54<br />
5.24<br />
4.99<br />
4.85<br />
7-1542001-2*<br />
*12V Double Ball Bear<strong>in</strong>g fan used <strong>in</strong> test<strong>in</strong>g<br />
Data is from tests conducted <strong>in</strong><br />
<strong>Tyco</strong> <strong>Electronics</strong> thermal lab.<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
11
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
30.5mm BGA (Radial Heat S<strong>in</strong>ks)<br />
Catalog 1309431<br />
Issued 5-02<br />
30.5mm BGA<br />
(Radial Heat S<strong>in</strong>ks)<br />
Heat S<strong>in</strong>k<br />
Type<br />
Heat S<strong>in</strong>k<br />
Diameter<br />
Inch[mm]<br />
Heat S<strong>in</strong>k<br />
Height<br />
Inch[mm]<br />
Power<br />
(W)<br />
<strong>Thermal</strong> Resistance (°C/W) Part Number<br />
0 LFM 200 LFM 400 LFM 600 LFM<br />
5 14.09 8.72 6.13 5.27<br />
1 F<strong>in</strong> Radial 1.375 [34.92] 0.255 [6.47] 10 12.72 8.47 5.89 4.80 5-1542005-7<br />
15 11.68 8.23 5.76 4.82<br />
5 13.40 7.80 4.88 4.28<br />
2 F<strong>in</strong> Radial 1.375 [34.92] 0.367 [9.32] 10 11.96 7.30 4.70 4.04 5-1542005-8<br />
15 10.97 7.23 4.58 4.04<br />
5 13.25 6.13 4.35 3.14<br />
3 F<strong>in</strong> Radial 1.375 [34.92] 0.479 [12.16] 10 11.82 6.04 3.99 2.93 5-1542005-9<br />
15 10.75 5.89 3.96 2.99<br />
5 12.59 5.39 3.28 2.80<br />
4 F<strong>in</strong> Radial 1.375 [34.92] 0.591 [15.01] 10 11.18 5.31 3.35 2.63 6-1542005-0<br />
15 10.17 5.32 3.26 2.61<br />
5 11.38 4.46 3.33 2.52<br />
5 F<strong>in</strong> Radial 1.375 [34.92] 0.703 [17.85] 10 10.34 4.35 2.82 2.40 6-1542005-1<br />
15 9.59 4.42 2.93 2.22<br />
5 10.83 4.32 2.89 2.89<br />
6 F<strong>in</strong> Radial 1.375 [34.92] 0.815 [20.70] 10 9.85 4.22 2.76 2.15 6-1542005-2<br />
15 9.08 4.25 2.74 2.12<br />
5 10.54 3.76 2.70 1.79<br />
7 F<strong>in</strong> Radial 1.375 [34.92] 0.927 [23.54] 10 9.61 3.73 2.42 2.01 7-1542003-2<br />
15 8.79 3.73 2.36 1.93<br />
Data is from tests conducted <strong>in</strong><br />
<strong>Tyco</strong> <strong>Electronics</strong> thermal lab.<br />
12 <strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
40mm BGA (Radial Heat S<strong>in</strong>ks)<br />
Catalog 1309431<br />
Issued 5-02<br />
40mm BGA<br />
(Radial Heat S<strong>in</strong>ks)<br />
Heat S<strong>in</strong>k<br />
Type<br />
Heat S<strong>in</strong>k<br />
Diameter<br />
Inch[mm]<br />
Heat S<strong>in</strong>k<br />
Height<br />
Inch[mm]<br />
Power<br />
(W)<br />
<strong>Thermal</strong> Resistance (°C/W) Part Number<br />
0 LFM 200 LFM 400 LFM 600 LFM<br />
5 8.97 5.36 3.76 3.25<br />
1 F<strong>in</strong> Radial 2.000 [50.802] 0.250 [6.35] 10 8.41 5.44 3.78 3.21 3-1542003-8<br />
15 7.92 5.36 3.77 3.21<br />
5 8.91 4.96 3.37 2.72<br />
2 F<strong>in</strong> Radial 2.000 [50.80] 0.357 [9.06] 10 8.08 5.08 3.33 2.63 9-1542003-2<br />
15 7.54 4.99 3.19 2.61<br />
5 8.78 4.22 2.75 2.16<br />
3 F<strong>in</strong> Radial 2.000 [50.80] 0.464 [11.78] 10 8.07 4.43 2.61 2.06 9-1542003-4<br />
15 7.62 4.26 2.60 2.03<br />
5 8.75 3.80 2.30 2.13<br />
4 F<strong>in</strong> Radial 2.000 [50.80] 0.571 [14.50] 10 7.87 3.79 2.20 1.89 9-1542003-5<br />
15 7.37 3.69 2.19 1.88<br />
5 8.73 3.30 1.84 1.95<br />
5 F<strong>in</strong> Radial 2.000 [50.80] 0.678 [17.22] 10 7.69 3.23 1.92 1.59 3-1542003-9<br />
15 7.13 3.21 1.96 1.71<br />
5 7.76 2.80 2.06 1.53<br />
6 F<strong>in</strong> Radial 2.000 [50.80] 0.785 [19.93] 10 7.19 2.74 1.80 1.49 4-1542003-1<br />
15 6.77 2.79 1.77 1.46<br />
5 6.82 2.75 1.87 1.68<br />
7 F<strong>in</strong> Radial 2.000 [50.80] 0.892 [22.65] 10 6.56 2.67 1.67 1.47 4-1542003-2<br />
15 6.17 2.63 1.64 1.45<br />
Data is from tests conducted <strong>in</strong><br />
<strong>Tyco</strong> <strong>Electronics</strong> thermal lab.<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
13
Step 1<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
CoolSnap ® Clip Installations<br />
Ensure that the heat s<strong>in</strong>k is partially threaded (no more than one<br />
complete turn) <strong>in</strong>to the mount<strong>in</strong>g clip, form<strong>in</strong>g the assembly.<br />
Step 2 (Option1)<br />
4 leg clips have 2 legs for centrally locat<strong>in</strong>g the assembly. Slide<br />
one lip leg under package at an angle <strong>in</strong>sur<strong>in</strong>g that the location<br />
legs are aligned with the package. Make sure that lip is completely<br />
<strong>in</strong>serted <strong>in</strong>to the gap between the package and the board.<br />
Carefully press downward until the opposite lip leg snaps onto<br />
the opposite side of the package.<br />
Step 2 (Option 2)<br />
On 2 or 3 legs clip only. Slide the open side on to the package<br />
and centrally position it on the package.<br />
Step 3<br />
Screw the heat s<strong>in</strong>k <strong>in</strong>to place until contact is made with the<br />
package. Torque to the required force.<br />
* Torque values are application specific<br />
Catalog 1309431<br />
Issued 5-02<br />
14 <strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
CoolSnap ®<br />
Clip Removal Instructions<br />
Catalog 1309431<br />
Issued 5-02<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
15
When order<strong>in</strong>g please specify:<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Fan Data<br />
No fan, or type of fan (sleeve bear<strong>in</strong>g, ball/sleeve bear<strong>in</strong>g, or double ball bear<strong>in</strong>g)<br />
Note: Fan Height + Heat S<strong>in</strong>k Height = Heat S<strong>in</strong>k Assembly Overall Height<br />
Catalog 1309431<br />
Issued 5-02<br />
16 <strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change
Part Number: 1-1542007-1<br />
2.0 GHz - AL/AL<br />
Product Features<br />
■ Direct Alum<strong>in</strong>um F<strong>in</strong> to<br />
Alum<strong>in</strong>um Base Brazed<br />
part, enclosed <strong>in</strong> an<br />
Alum<strong>in</strong>um Shroud directly<br />
bonded to the base<br />
add<strong>in</strong>g the additional<br />
thermal benefits.<br />
■ Equipped with our<br />
Standard Delta Fan which<br />
can be replaced with a<br />
60 x 60 x 15 mm Nidec<br />
Fan to impove thermal<br />
preformance.<br />
TYCO and AMP FAX are trademarks.<br />
Pentium 4 is a registered trademarks of Intel Corporation.<br />
1309XXX—AMP-CC&CE— PDF file only 04/02<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Active <strong>Thermal</strong> Solution<br />
P4-478 Pentium 4 ®<br />
Catalog 1309431<br />
Issued 5-02<br />
Description:<br />
This Active Solution is <strong>in</strong>tended for use on the Northwood Pentium<br />
4® and will preform up to 2.0 GHz<br />
Mechanical Specifications<br />
Dimensions (Includ<strong>in</strong>g Fan):<br />
82.7 x 70.0 x 55.9 mm<br />
[3.3′′ x 2.8′′ x 2.2′′]<br />
Total Weight: 365.0 grams<br />
<strong>Thermal</strong> Performance:<br />
Theta ca = 0.41° C/W<br />
Flow Rate = 9.6 CFM@0.05 <strong>in</strong>ch H2O<br />
<strong>Thermal</strong> test<strong>in</strong>g conducted us<strong>in</strong>g a Grease TIM with an<br />
average thermal resistance of 0.06°C/W<br />
Fan Specifications:<br />
Type: Delta EFB0612MA-F00<br />
Dimensions: 60 x 60 x 10 mm<br />
Operat<strong>in</strong>g Voltage: 7.0 - 13.8 VDC<br />
Fan Speed: 3600 RPM<br />
MTBF: 70,000 hours @ 40°C<br />
Leads: Standard 3 p<strong>in</strong> Connections<br />
Noise Level: 29 dB (33 Max)<br />
Shock & Vibration:<br />
Product was tested and approved to a 40G shock and a<br />
166 <strong>in</strong>/sec velocity change. Test results available upon request.<br />
<strong>Thermal</strong> Interface Material:<br />
This unit can be supplied with Grease, Phase Change, or<br />
Customer specified <strong>Thermal</strong> Interface Material.<br />
Attachment Mechanism:<br />
Clip Attachment: Two Piece Metal<br />
Clip Engagement Force: 25 lbs<br />
Load Force: 60 lbs<br />
Clip engagement and load force can be customized to suit <strong>in</strong>dividual<br />
requirements. This unit can be supplied with <strong>Tyco</strong> <strong>Electronics</strong><br />
approved clip or Customer specified clip.<br />
Frame ordered separated. See page 26<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
17
18<br />
Part Number: 1-1542007-2<br />
2.5 GHz - AL/AL<br />
Product Features<br />
■ Direct Alum<strong>in</strong>um F<strong>in</strong> to<br />
Alum<strong>in</strong>um Base Brazed<br />
part, enclosed <strong>in</strong> an<br />
Alum<strong>in</strong>um Shroud directly<br />
bonded to the base<br />
add<strong>in</strong>g the additional<br />
thermal benefits.<br />
■ Equipped with our<br />
Standard Delta Fan which<br />
can be replaced with a<br />
60 x 60 x 15 mm Nidec<br />
Fan to impove thermal<br />
preformance.<br />
TYCO and AMP FAX are trademarks.<br />
Pentium 4 is a registered trademarks of Intel Corporation.<br />
1309XXX—AMP-CC&CE— PDF file only 02/02<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Active <strong>Thermal</strong> Solution<br />
P4-478 Pentium 4 ®<br />
Catalog 1309431<br />
Issued 5-02<br />
Description:<br />
This solution is an Alum<strong>in</strong>um Folded F<strong>in</strong> metallurgically bonded to<br />
an Alum<strong>in</strong>um Base, encased <strong>in</strong> an Alum<strong>in</strong>um Shroud.<br />
Mechanical Specifications<br />
Dimensions (Includ<strong>in</strong>g Fan):<br />
83.0 x 70.0 x 63.9 mm<br />
[3.3′′ x 2.8′′ x 2.5′′]<br />
Total Weight: 340 grams<br />
<strong>Thermal</strong> Performance:<br />
Theta ca = 0.36° C/W<br />
Flow Rate = 20.3 CFM@0.10 <strong>in</strong>ch H2O<br />
<strong>Thermal</strong> test<strong>in</strong>g conducted us<strong>in</strong>g a Grease TIM with an<br />
average thermal resistance of 0.06°C/W<br />
Fan Specifications:<br />
Dimensions: 70 x 70 x 15 mm<br />
Operat<strong>in</strong>g Voltage: 3.5 - 13.8 VDC<br />
Fan Speed: 4600 RPM ± 300RPM<br />
MTBF: 70,000 hours @ 40°C<br />
Leads: Standard 3 p<strong>in</strong> Connections<br />
Shock & Vibration:<br />
Product was tested and approved to a 40G shock and a<br />
166 <strong>in</strong>/sec velocity change. Test results available upon request.<br />
<strong>Thermal</strong> Interface Material:<br />
This unit can be supplied with Grease, Phase Change, or<br />
Customer specified <strong>Thermal</strong> Interface Material.<br />
Attachment Mechanism:<br />
Clip Attachment: S<strong>in</strong>gle Lever Cam Actuated Plastic Clip<br />
Clip Engagement Force: 15 lbs<br />
Load Force: 85lbs<br />
Creep Rate: Average 15% total Creep from ambient up to 45°<br />
Frame ordered separately, see page 36<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change
Part Number: 1-1542007-3<br />
Nickel Plated<br />
Product Features<br />
■ Features a copper base,<br />
copper f<strong>in</strong>s and an<br />
alum<strong>in</strong>um shrould all<br />
Solder bonded for added<br />
strength and preformmance.<br />
Product comes<br />
nickel plated.<br />
■ Part can be easily configured<br />
to meet <strong>in</strong>dividual<br />
customer needs and<br />
design requirements.<br />
TYCO and AMP FAX are trademarks.<br />
Itanium is a registered trademarks of Intel Corporation.<br />
1309XXX—AMP-CC&CE— PDF file only 02/02<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Passive Solution for Server Based Systems<br />
For the ItaniumIA64 ** — M c K<strong>in</strong>ley<br />
Catalog 1309431<br />
Issued 5-02<br />
0.15<br />
0.05<br />
1 2 3 4 5<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
Rs-a (deg. C/W)<br />
0.3<br />
0.27<br />
0.24<br />
0.21<br />
0.18<br />
Air Flow (m/s)<br />
Description:<br />
This Passive Solution is <strong>in</strong>tended for use on the Itanium IA64<br />
Processor code named McK<strong>in</strong>ley<br />
Mechanical Specifications<br />
Dimensions:<br />
71.0 x 100.0 x 44.1 mm<br />
[2.8′′ x 3.9′′ x 1.7′′]<br />
Total Weight: 600.0 grams<br />
<strong>Thermal</strong> Performance:<br />
Theta sa at 2 m/s = 0.25° C/W<br />
Pressure Drop at 2 m/s = 0.09 <strong>in</strong> H2O Theta sa at 4 m/s = 0.21° C/W<br />
Pressure Drop at 4 m/s = 0.25 <strong>in</strong> H2O <strong>Thermal</strong> Interface Material:<br />
Shock & Vibration:<br />
Product was tested and approved at a 40G shock and a<br />
166 <strong>in</strong>/sec velocity change. Test results available upon request.<br />
Available to Customer Specifications.<br />
Attachment Mechanism:<br />
An Optional Die Cast Stiff Plate with all required attach<strong>in</strong>g<br />
hardware for ease of assembly to the Retention Frame can be<br />
added to the Base Heat s<strong>in</strong>k upon customer request.<br />
Customer Options:<br />
Nickel Plat<strong>in</strong>g on Base Plate, Folded F<strong>in</strong> or Shroud available<br />
upon request. Stiff Plate and attach<strong>in</strong>g hardware for assembly<br />
to RM available upon request. Custom modifications to fit<br />
system configuration available upon request.<br />
y<br />
0.3<br />
0.25<br />
0.2<br />
0.15<br />
0.1<br />
Pressure Drop (<strong>in</strong>H2O)<br />
19
20<br />
Part Number: 7-1542007-9<br />
Without Nickel Plat<strong>in</strong>g<br />
Product Features<br />
■ Features a copper base,<br />
copper f<strong>in</strong>s and an<br />
alum<strong>in</strong>um shrould all<br />
Solder bonded for added<br />
strength and preformmance.<br />
Product components<br />
come without<br />
Nickel Plat<strong>in</strong>g.<br />
■ Part can be easily configured<br />
to meet <strong>in</strong>dividual<br />
customer needs and<br />
design requirements.<br />
TYCO and AMP FAX are trademarks.<br />
Itanium is a registered trademarks of Intel Corporation.<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Passive Solution for Server Based Systems<br />
For the ItaniumIA64 ** — M c K<strong>in</strong>ley<br />
Catalog 1309431<br />
Issued 5-02<br />
0.15<br />
0.05<br />
1 2 3 4 5<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
Rs-a (deg. C/W)<br />
0.3<br />
0.27<br />
0.24<br />
0.21<br />
0.18<br />
Air Flow (m/s)<br />
Description:<br />
This Passive Solution is <strong>in</strong>tended for use on the Itanium IA64<br />
Processor code named McK<strong>in</strong>ley<br />
Mechanical Specifications<br />
Dimensions:<br />
71.0 x 100.0 x 44.1 mm<br />
[2.8′′ x 3.9′′ x 1.7′′]<br />
Total Weight: 600.0 grams<br />
<strong>Thermal</strong> Performance:<br />
Theta sa at 2 m/s = 0.25° C/W<br />
Pressure Drop at 2 m/s @ 0.09 <strong>in</strong> H2O <strong>Thermal</strong> test<strong>in</strong>g conducted us<strong>in</strong>g a Grease TIM with an<br />
average thermal resistance of 0.06°C/W<br />
<strong>Thermal</strong> Interface Material:<br />
Available to Customer Specifications.<br />
Attachment Mechanism:<br />
An Optional Die Cast Stiff Plate with all required attach<strong>in</strong>g<br />
hardware for ease of assembly to the Retention Frame can be<br />
added to the Base Heat s<strong>in</strong>k upon customer request.<br />
Customer Options:<br />
Nickel Plat<strong>in</strong>g on Base Plate, Folded F<strong>in</strong> or Shroud available<br />
upon request. Stiff Plate and attach<strong>in</strong>g hardware for assembly to<br />
RM available upon request. Custom modifications to fit system configuration<br />
available upon request.<br />
y<br />
0.3<br />
0.25<br />
0.2<br />
0.15<br />
0.1<br />
Pressure Drop (<strong>in</strong>H2O)
Part Number: 1-1542007-4<br />
AL/AL Passive<br />
Product Features<br />
■ Direct Alum<strong>in</strong>um F<strong>in</strong> to<br />
Alum<strong>in</strong>um Base Brazed<br />
part, enclosed <strong>in</strong> an<br />
Alum<strong>in</strong>um Shroud Directly<br />
bonded to the base<br />
add<strong>in</strong>g the additional<br />
<strong>Thermal</strong> Benefits.<br />
TYCO and AMP FAX are trademarks.<br />
Intel Xeon is a registered trademarks of Intel Corporation.<br />
1309XXX—AMP-CC&CE— PDF file only 02/02<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Passive Solution for Socketed CPU’s<br />
Intel Xeon Processor — Foster<br />
Rs-a (deg. C/W)<br />
Catalog 1309431<br />
Issued 5-02<br />
0.245<br />
0.080<br />
1.50 2.00 2.50 3.00 3.50 4.00 4.50<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
0.300<br />
0.295<br />
0.290<br />
0.285<br />
0.280<br />
0.275<br />
0.270<br />
0.265<br />
0.260<br />
0.255<br />
0.250<br />
Foster<br />
Air Flow Rate (m/s)<br />
0.240<br />
0.220<br />
0.200<br />
0.180<br />
0.160<br />
0.140<br />
0.120<br />
0.100<br />
Description:<br />
This Passive Solution is <strong>in</strong>tended for use on the Intel Xeon<br />
Processor Code name Foster<br />
Mechanical Specifications<br />
Dimensions:<br />
88.9 x 63.5 x 50.8 mm<br />
[3.5′′ x 2.5′′ x 2′′]<br />
Total Weight: 295 grams<br />
<strong>Thermal</strong> Performance:<br />
Theta sa at 2 m/s = 0.31° C/W<br />
Pressure Drop at 2 m/s = 0.10 <strong>in</strong> H2O Theta sa at 4 m/s = 0.24° C/W<br />
Pressure Drop at 4 m/s = 0.25 <strong>in</strong> H2O <strong>Thermal</strong> Interface Material:<br />
Chomerics T454 (46.7 x 41.27) or as per customer requirements<br />
Attachment Mechanism:<br />
Ordered separately, see page 26 for options.<br />
Pressure Drop (<strong>in</strong>.H2O)<br />
21
Part Number: 1-1542007-5<br />
AL/CU Passive<br />
Product Features<br />
■ Direct Alum<strong>in</strong>um F<strong>in</strong> to<br />
Copper Base Soldered<br />
part, enclosed <strong>in</strong> an<br />
Alum<strong>in</strong>um Shroud directly<br />
bonded to the base<br />
add<strong>in</strong>g the additional<br />
thermal benefits.<br />
TYCO and AMP FAX are registarted trademarks.<br />
Intel Xeon is a registered trademarks of Intel Corporation.<br />
1309XXX—AMP-CC&CE— PDF file only 02/02<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Passive Solution<br />
Intel Xeon Processor — Prestonia<br />
Rs-a (deg. C/W)<br />
Catalog 1309431<br />
Issued 5-02<br />
22 <strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
0.270<br />
0.265<br />
0.260<br />
0.255<br />
0.250<br />
0.245<br />
0.240<br />
0.235<br />
0.230<br />
0.225<br />
1.50 2.00 2.50 3.00 3.50 4.00 4.50<br />
Air Flow Rate (m/s)<br />
Description:<br />
This Passive Solution is <strong>in</strong>tended for use on the Intel Xeon<br />
Processor Code name Prestonia.<br />
Mechanical Specifications<br />
Dimensions:<br />
88.9 x 63.5 x 50.4 mm<br />
[3.5′′ x 2.5′′ x 1.9′′]<br />
Total Weight: 466 grams<br />
<strong>Thermal</strong> Performance:<br />
Theta sa at 2 m/s = 0.28° C/W<br />
Pressure Drop at 2 m/s = 0.08 <strong>in</strong> H2O Theta sa at 4 m/s = 0.22° C/W<br />
Pressure Drop at 4 m/s = 0.18 <strong>in</strong> H2O <strong>Thermal</strong> Interface Material:<br />
As per customer requirements<br />
Attachment Mechanism:<br />
Ordered separately, see page 26 for options.<br />
0.170<br />
0.160<br />
0.150<br />
0.140<br />
0.130<br />
0.120<br />
0.110<br />
0.100<br />
0.090<br />
0.080<br />
Pressure Drop (<strong>in</strong>.H2O)
Part Number: 7-1542007-8<br />
AL/Active<br />
Product Features<br />
■ Alum<strong>in</strong>um Folded F<strong>in</strong><br />
metallurgically bond<strong>in</strong>g<br />
to an Alum<strong>in</strong>um base<br />
encased <strong>in</strong> an Alum<strong>in</strong>um<br />
Shroud.<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
AMD (Athlon) Sockets - Socket 462<br />
Catalog 1309431<br />
Issued 5-02<br />
Description:<br />
App roved <strong>Thermal</strong> Solution for the AMD Athlon XP TM<br />
socket 462.<br />
Fan Specifications:<br />
Dimensions: 60 x 60 x 10mm<br />
Operat<strong>in</strong>g Voltage: 7.0-13.8VDC max<br />
Fan Speed: 4600 RPM ± 300 RPM<br />
Leads: Standard 3 p<strong>in</strong> Connector<br />
Mechanical Specifications<br />
80.0 x 61.6 x 58.3 mm<br />
Dimensions:<br />
(3.1” x 2.4” x 2.3”)<br />
Total Weight: 286 grams<br />
<strong>Thermal</strong> Performance:<br />
Theta ja = 0.67° C/W<br />
Flow Rate = 13 CFM @ 0.09 <strong>in</strong>ch H2O<br />
<strong>Thermal</strong> test<strong>in</strong>g conducted us<strong>in</strong>g a Grease TIM with an<br />
average thermal resistance of 0.08°C/W<br />
Shock & Vibration:<br />
Product was tested and approved to a 40G shock and a<br />
166<strong>in</strong>/sec velocity change. Test results available upon request.<br />
<strong>Thermal</strong> Interface Material:<br />
This unit can be supplied with Grease, Phase Change, or<br />
Customer specified <strong>Thermal</strong> Interface Material.<br />
Clip Attachment:<br />
S<strong>in</strong>gle Piece Sta<strong>in</strong>less Clip<br />
Engagement Force: 5 to 8 lbs<br />
Load Force: 12 to 25 lbs<br />
Clip engagement and load force can be customized to suit<br />
<strong>in</strong>dividual requirements. This unit can be supplied with the<br />
<strong>Tyco</strong> <strong>Electronics</strong> approved clip or Customer specified clip.<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
23
Part Number: 3-1542007-5<br />
AL/CU Passive<br />
Product Features<br />
■ Approved <strong>Thermal</strong><br />
Solution for the<br />
Pentium III ®<br />
Socket 370.<br />
This solution is an<br />
Alum<strong>in</strong>um Folded F<strong>in</strong><br />
metallurgically bonded<br />
to a Copper Base.<br />
Note: Dimensions (Small P<strong>in</strong>ot)<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Passive 866 MHz to 1.0 GHz <strong>Thermal</strong> Solution (Small P<strong>in</strong>ot)<br />
<strong>Thermal</strong> Performance Chart<br />
Description:<br />
Mechanical Specifications<br />
Dimensions:<br />
64.5 x 55.9 x 26.8 mm<br />
(2.5” x 2.2” x 1.1”)<br />
Total Weight: 202 grams<br />
<strong>Thermal</strong> Performance:<br />
Theta sa = 0.60° C/W<br />
Pressure Drop = 2m/s @ 0.13 <strong>in</strong>ch H2O<br />
Catalog 1309431<br />
Issued 5-02<br />
0.3<br />
0.00<br />
0 1 2 3 4 5 6<br />
<strong>Thermal</strong> test<strong>in</strong>g conducted us<strong>in</strong>g a Grease TIM with an<br />
average thermal resistance of 0.06°C/W<br />
Shock & Vibration:<br />
Product was tested and approved to a 40G shock and a<br />
166<strong>in</strong>/sec velocity change. Test results available upon request.<br />
<strong>Thermal</strong> Interface Material:<br />
This unit comes with standard <strong>in</strong>terface material but can be<br />
supplied with Grease, Phase Change, or Customer specified<br />
<strong>Thermal</strong> Interface Material.<br />
Attachment Mechanism:<br />
Standard Attachment Mechanism available upon request.<br />
24 <strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
Rs-a (deg. C/W)<br />
1.0<br />
0.9<br />
0.8<br />
0.7<br />
0.6<br />
0.5<br />
0.4<br />
Air Flow (m/s)<br />
0.35<br />
0.30<br />
0.25<br />
0.20<br />
0.15<br />
0.10<br />
0.05
Part Number: 3-1542007-6<br />
AL/CU Passive<br />
Product Features<br />
■ Approved <strong>Thermal</strong><br />
Solution for the<br />
Pentium III ®<br />
Socket 370.<br />
This solution is an<br />
Alum<strong>in</strong>um Folded F<strong>in</strong><br />
metallurgically bonded<br />
to a Copper Base.<br />
Note: Dimensions (Large P<strong>in</strong>ot)<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Passive 866 MHz to 1.0 GHz <strong>Thermal</strong> Solution (Large P<strong>in</strong>ot)<br />
Catalog 1309431<br />
Issued 5-02<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
Rs-a (deg. C/W)<br />
<strong>Thermal</strong> Performance Chart<br />
0. 70<br />
0. 65<br />
0. 60<br />
0. 55<br />
0. 50<br />
0. 45<br />
0. 40<br />
0. 35<br />
1 2 3 4 5 6<br />
Ai r Fl ow (m /s)<br />
Description:<br />
Mechanical Specifications<br />
Dimensions:<br />
86.1 x 64.2 x 26.8 mm<br />
(3.4′′ x 2.5′′ x 1.1′′)<br />
Total Weight: 289 grams<br />
<strong>Thermal</strong> Performance:<br />
Theta sa = 0.40° C/W<br />
Pressure Drop = 2m/s @ 0.10 <strong>in</strong>ch H2O<br />
<strong>Thermal</strong> test<strong>in</strong>g conducted us<strong>in</strong>g a Grease TIM with an<br />
average thermal resistance of 0.06°C/W<br />
Shock & Vibration:<br />
Product was tested and approved to a 40G shock and a<br />
166<strong>in</strong>/sec velocity change. Test results available upon request.<br />
<strong>Thermal</strong> Interface Material:<br />
This unit comes with standard <strong>in</strong>terface material but can be<br />
supplied with Grease, Phase Change, or Customer specified<br />
<strong>Thermal</strong> Interface Material.<br />
Attachment Mechanism:<br />
Standard Attachment Mechanism available upon request.<br />
0. 4<br />
0. 35<br />
0. 3<br />
0. 25<br />
0. 2<br />
0. 15<br />
0. 1<br />
0. 05<br />
Pressure Drop (<strong>in</strong> H O)<br />
2<br />
25
Attachment Mechanism for P4<br />
Heat S<strong>in</strong>ks<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Passive Solution<br />
Attachment Mechanism for Foster and Prestonia Heat S<strong>in</strong>ks<br />
Attachment Options:<br />
Part Number Description<br />
1542625-1 Metal Clip without quick release*<br />
1542626-1 Plastic Retention Module with push p<strong>in</strong>s*<br />
1542627-1 Metal Clip with quick release<br />
1542628-1 Plastic Retention Module with out push p<strong>in</strong>s<br />
Note: Attachment mechanisms are not part of assemblies - must be ordered<br />
separately <strong>in</strong> pairs.<br />
* Recommended version<br />
Catalog 1309431<br />
Issued 5-02<br />
Attachment Options:<br />
Part Number Description<br />
1470197-1 Plastic Retention Module with push p<strong>in</strong>s<br />
Note: Attachment mechanisms are not part of assemblies - must be ordered separately.<br />
26 <strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change
TYCO ELECTRONICS INTRODUCES<br />
MPI Metallized Particle Interconnect<br />
Catalog 1309431<br />
Issued 5-02<br />
The MPI Material System: MPI is a material system designed to address high<br />
density socket and connector requirements. Today's microprocessors and ASICs<br />
cont<strong>in</strong>ue to <strong>in</strong>crease <strong>in</strong> both p<strong>in</strong> count and density. The MPI product l<strong>in</strong>e produces<br />
sizes from 24 to 5000+ I/O on 1mm and 1,27 mm grid spac<strong>in</strong>g.<br />
The patented MPI (Metalized Particle Interconnect) material system provides a<br />
highly conductive <strong>in</strong>terconnect. This proprietary material consists of a high temperature<br />
polymer compound that has been embedded with metalized particles. The<br />
material is formed <strong>in</strong>to micro-columns just 0.635mm <strong>in</strong> diameter and 1mm high.<br />
The columns are held <strong>in</strong> a grid pattern by a th<strong>in</strong> polyimide substrate. This carrier<br />
registers the columns to the pads on the silicon package to the pads on the PC<br />
board.<br />
MPI Column<br />
When mechanically compressed, the columns' electrical characteristics are optimized.<br />
Due to its short compressed length of .70mm, it is virtually transparent at<br />
gigahertz speeds. A signal runn<strong>in</strong>g at 10 gigahertz does not encounter any disturbance<br />
when pass<strong>in</strong>g through an MPI column.<br />
Chip-to-Board MPI/LGA Socket Board-to-Board<br />
MPIConnectorSocket<br />
Polyimide Substrate<br />
Flex-to-Board MPI Socket<br />
Optical Module Interconnect Compression Hardware MPI>SI - Side Interface<br />
Daughter Card to Backplane<br />
Interconnect Socket<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
27
28<br />
Typical Application:<br />
<strong>Tyco</strong> <strong>Electronics</strong> MPI system solves the challenge of<br />
connect<strong>in</strong>g high I/O microprocessors and ASICs to<br />
PC boards. MPI LGA Sockets utilize solderless, compression<br />
mount technology. Force must be applied to<br />
each column for it to achieve its superior electrical<br />
performance. Threaded hardware connects to the<br />
studs of the bolster plate which pass through the PC<br />
board, socket and heats<strong>in</strong>k. Tighten<strong>in</strong>g the hardware<br />
creates a load on the heats<strong>in</strong>k, which is generated by<br />
the spr<strong>in</strong>gs. This causes the LGA package to compress<br />
the MPI conductive columns to the board. The<br />
bolster plate provides support beh<strong>in</strong>d the PC board as<br />
the columns are compressed.<br />
MPI>SI Backplane Interconnect:<br />
TYCO ELECTRONICS INTRODUCES<br />
MPI Metallized Particle Interconnect<br />
In years past, low frequency transmissions could<br />
absorb the difference between the connector parameters<br />
and the PCB. As data transfers and rise times<br />
push <strong>in</strong>to the gigabit range, signal r<strong>in</strong>g<strong>in</strong>g, jitter and<br />
edge rate profiles break down the signal quality to<br />
unacceptable levels. MPI>SI refers to a revolutionary<br />
PCB technology. SI allows the <strong>in</strong>ner layers to exit<br />
through the actual side of the PCB (represented by<br />
the thickness dimension). This provides a flat mat<strong>in</strong>g<br />
surface for the MPI contact. The advantage of this<br />
technology is that you keep the signal with<strong>in</strong> the PCB<br />
for greater period of time. By stay<strong>in</strong>g with<strong>in</strong> the<br />
“Controlled Impedance Environment” longer, there is<br />
less disturbance to the signal. This short <strong>in</strong>terconnect<br />
distance elim<strong>in</strong>ates the large electrical <strong>in</strong>terruption<br />
one would see <strong>in</strong> traditional two piece connectors.<br />
Threaded<br />
Hardware<br />
Land Grid<br />
Array Package<br />
PC Board<br />
Catalog 1309431<br />
Issued 5-02<br />
Heat S<strong>in</strong>k<br />
MPI LGA<br />
Socket<br />
Bolster<br />
Plate<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change
Product Features<br />
■ Alum<strong>in</strong>a-filled re<strong>in</strong>forced<br />
thermal gel<br />
■ Soft and compressible<br />
■ Low thermal resistance<br />
■ Excellent surface wett<strong>in</strong>g<br />
■ Accommodates wide<br />
tolerance range<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
HeatPath GTQ-HS Series<br />
DRAM memory module heat spreader plate and<br />
thermal <strong>in</strong>terface material assembly<br />
Assembly comb<strong>in</strong>es<br />
HeatPath thermal <strong>in</strong>terface<br />
material pre-applied to the<br />
DRAM module heat spreader<br />
plate, to provide a costeffective<br />
solution for DRAM<br />
heat dissipation.<br />
The heat spreader plate<br />
meets Intel requirements<br />
and is available <strong>in</strong> a variety<br />
of standard colors <strong>in</strong> an<br />
anodized f<strong>in</strong>ish. Five standard<br />
pedestal heights as<br />
well as custom heights are<br />
available.<br />
HeatPath thermal <strong>in</strong>terface<br />
material consists of an alum<strong>in</strong>a<br />
filled silicone gel to<br />
provide for excellent heat<br />
transfer at a cost effective<br />
price. Comb<strong>in</strong><strong>in</strong>g softness<br />
and compressibility with<br />
excellent surface wett<strong>in</strong>g,<br />
the HeatPath material<br />
accommodates a wide<br />
range of gaps, tolerances,<br />
and uneven surfaces to provide<br />
for low thermal resis-<br />
tance at low compression,<br />
maximiz<strong>in</strong>g heat flow to the<br />
DRAM module heat spreader<br />
plate.<br />
Versatility and Variety<br />
HeatPath GTQ-HS series<br />
materials have a high thermal<br />
conductivity and are<br />
available <strong>in</strong> two different<br />
versions to meet the most<br />
demand<strong>in</strong>g applications:<br />
•GTQ-HS-R100, pad-onplate,<br />
for general applications.<br />
The HeatPath pad is<br />
re<strong>in</strong>forced with a fiberglass<br />
carrier for mproved<br />
handl<strong>in</strong>g and tear resistance.<br />
The HeatPath pad<br />
is available preattached <strong>in</strong><br />
five standard thicknesses<br />
and <strong>in</strong> pad sizes customized<br />
to DRAM chip<br />
layout.<br />
•GTQ-HS-R200, dispenseon-plate,<br />
for low compression<br />
applications. By<br />
dispens<strong>in</strong>g and cur<strong>in</strong>g the<br />
Catalog 1309431<br />
Issued 5-02<br />
HeatPath <strong>in</strong> place prior<br />
to module assembly, the<br />
thermal <strong>in</strong>terface material<br />
is four times as compressible<br />
as the standard GTQ-<br />
R100. With the enhanced<br />
softness and compressibility,<br />
GTQ-R200 can<br />
accommodate a wider<br />
range of gaps, tolerances,<br />
and uneven surfaces.<br />
Assemblies are supplies <strong>in</strong><br />
trays of 50 pieces each.<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
29
HeatPath GTQ-R100<br />
Typical product properties<br />
127.00 ±0.25<br />
(5.000 ±.010)<br />
HeatPath GTQ-HS Series<br />
DRAM memory module heat spreader plate and<br />
thermal <strong>in</strong>terface material assembly<br />
26.54<br />
(1.045)<br />
Catalog 1309431<br />
Issued 5-02<br />
Test condition Unit R100 R200 Test method<br />
<strong>Thermal</strong> conductivity W/m°K 1.1 1.0 ASTM E 1530<br />
<strong>Thermal</strong> resistance (T0.50 mm) at 20 psi °C–<strong>in</strong> 2 /w 0.70 0.55 Analysis Tech-Tip 31 Device<br />
Compression deflection (T0.50 mm) at 20 psi % 8 30 Analysis Tech-Tip 31 Device<br />
Specific gravity g/cm 3 2.0 2.0 ASTM D 792<br />
Use temperature °C –40 to 150 –40 to 150<br />
Volume resistivity ohm-cm 1 X 10 12 1 X 10 12 ASTM D 257<br />
Dielectric breakdown voltage T0.25 mm V kVac 2 2 ASTM D 149<br />
T0.50 mm V kVac 6 6<br />
Coefficient of l<strong>in</strong>ear thermal expansion /°C 5.5 X 10 -4 5.5 X 10 -4 ASTM E 831<br />
Flammability HB* HB* UL 94<br />
Color Gray Gray<br />
*UL 94 VO available.<br />
Part number<strong>in</strong>g system<br />
GTQ-HSX-X YY Z-RXXX-TX.X-XXX<br />
Product draw<strong>in</strong>g number (for R-100 only)<br />
Draw<strong>in</strong>g Number HeatPath width (mm) HeatPath length (mm) CL1 CL2<br />
-078 11 100 58.86 9.45<br />
-080 11.36 104 58.86 9.45<br />
-098 12 109 58.86 9.45<br />
-102 12 108.25 58.86 9.45<br />
-132 11 55 58.86 9.45<br />
For R-100<br />
T.50 = .500 ± 0.10 mm (.020 <strong>in</strong>)<br />
T.75 = .750 ± 0.15 mm (.030 <strong>in</strong>)<br />
T1.0 = 1.00 ± 0.2 mm (.040 <strong>in</strong>)<br />
For R-200<br />
T.50 = .500 ± 0.05 mm (.020 <strong>in</strong>)<br />
HeatPath material<br />
R100 = GTQ-R100 fiberglass re<strong>in</strong>forced thermal material<br />
R200 = GTQ-R200 non re<strong>in</strong>forced thermal material<br />
Plat<strong>in</strong>g<br />
1 = Anodize 12.7-20 µm thick per ISO 8079<br />
Plat<strong>in</strong>g Color<br />
00 = Black 14 = Gold<br />
11 = Clear 16 = Blue<br />
12 = Red 24 = Light Gold<br />
Pedestal height<br />
1 = 1.17 ± 0.05 mm (.046 <strong>in</strong>)<br />
2 = 1.25 ± 0.05 mm (.049 <strong>in</strong>)<br />
3 = 1.34 ± 0.05 mm (.053 <strong>in</strong>)<br />
4 = 1.50 ± 0.05 mm (.059 <strong>in</strong>)<br />
5 = 1.70 ± 0.05 mm (.067 <strong>in</strong>)<br />
6 = 1.12 ± 0.05 mm (.044 <strong>in</strong>)<br />
7 = 1.40 ± 0.05 mm (.055 <strong>in</strong>)<br />
Module size<br />
2 = 1.250 <strong>in</strong> DRAM module<br />
3 = 1.375 <strong>in</strong> DRAM module<br />
30 <strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change
Product Features<br />
■ Alum<strong>in</strong>a-filled re<strong>in</strong>forced<br />
thermal gels<br />
■ Soft and compressible<br />
■ Low thermal resistance<br />
■ Excellent surface wett<strong>in</strong>g<br />
■ High surface tack<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
HeatPath GTQ R100 Series<br />
<strong>Thermal</strong> <strong>in</strong>terface material for DRAM memory modules and<br />
Direct Rambus modules<br />
HeatPath thermal <strong>in</strong>terface material<br />
is designed<br />
to cost-effectively maximize heat<br />
transfer from DRAM modules to the<br />
heat spreader plate. Comb<strong>in</strong><strong>in</strong>g<br />
softness and compressibility with<br />
excellent surface wett<strong>in</strong>g, the<br />
HeatPath material accommodates a<br />
wide range of gaps, tolerances, and<br />
uneven surfaces to provide for low<br />
thermal resistance at low compression,<br />
maximiz<strong>in</strong>g heat flow to the<br />
DRAM heat spreader plate.<br />
HeatPath GTQ R100 products consist<br />
of an alum<strong>in</strong>a-filled silicone gel to<br />
provide for excellent heat transfer at<br />
a cost-effective price. It <strong>in</strong>corporates<br />
a fiberglass carrier, which provides<br />
physical re<strong>in</strong>forcement for improved<br />
handl<strong>in</strong>g and tear resistance.<br />
Variety<br />
HeatPath GTQ R100 series material<br />
have a high thermal conductivity<br />
and are available <strong>in</strong> two<br />
different versions to meet the most<br />
demand<strong>in</strong>g applications:<br />
•GTQ R100 for general applications<br />
Proven performance<br />
Extensive physical test<strong>in</strong>g, <strong>in</strong>clud<strong>in</strong>g<br />
tensile and compression tests,<br />
demonstrates that HeatPath thermal<br />
<strong>in</strong>terface material is stable and does<br />
not become brittle over time. Test<strong>in</strong>g<br />
also shows that the HeatPath material<br />
rema<strong>in</strong>s stable after accelerated<br />
ag<strong>in</strong>g.<br />
Easy <strong>in</strong>stallation<br />
HeatPath is <strong>in</strong>herently very tacky,<br />
stay<strong>in</strong>g <strong>in</strong> position dur<strong>in</strong>g assembly<br />
without the need for adhesives, and<br />
can be easily removed and repositioned.<br />
Prestamped pieces are quickly<br />
<strong>in</strong>stalled by hand or with vacuum<br />
pick and place <strong>in</strong>stallation equipment.<br />
Catalog 1309431<br />
Issued 5-02<br />
Versatility<br />
HeatPath GTQ R100 products are<br />
available <strong>in</strong> prestamped shapes on<br />
cont<strong>in</strong>uous rolls or <strong>in</strong> sheets, with<br />
release film on both sides.<br />
Prestamped shapes are available to<br />
meet each manufacturer’s specific<br />
dimensions, <strong>in</strong> thicknesses of .25,<br />
.375, .50, .75, and 1.0 millimeter<br />
(.010, .015, .020, .030, and .040<br />
<strong>in</strong>ch).<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
31
Typical product properties<br />
Part number<strong>in</strong>g system<br />
GTQ-R100-TX.XX-XXX-XX<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
HeatPath GTQ R100 Series<br />
<strong>Thermal</strong> <strong>in</strong>terface material for DRAM memory modules and<br />
Direct Rambus modules<br />
Top Cover Material (for R100 only)<br />
UP = Ustamped Poly film<br />
SP = Stamped Poly film<br />
Product draw<strong>in</strong>g number<br />
0XXX = Stamped on sheets<br />
1XXX = Stamped on rolls<br />
Product thickness (mm)<br />
0.25 mm ±.05 (.010 <strong>in</strong> ± .002)<br />
0.375 mm ±.05 (.015 <strong>in</strong> ± .002)<br />
0.50 mm ±.05 (.020 <strong>in</strong> ± .002)<br />
0.75 mm ±.15 (.030 <strong>in</strong> ± .006)<br />
1.00 mm ±.20 (.040 <strong>in</strong> ± .008)<br />
Material type<br />
R100 = Fiberglass-re<strong>in</strong>forced thermal material<br />
Catalog 1309431<br />
Issued 5-02<br />
Test condition Unit R100 Test method<br />
<strong>Thermal</strong> conductivity W/m°K 1.1 ASTM E 1530<br />
<strong>Thermal</strong> resistance (T0.50 mm) at 20 psi °C–<strong>in</strong> 2 /w 0.70 Analysis Tech-Tip 31 Device<br />
Compression deflection (T0.50 mm) at 20 psi % 8 Analysis Tech-Tip 31 Device<br />
Specific gravity g/cm 3 2.0 ASTM D 792<br />
Use temperature °C –40 to 150<br />
Volume resistivity ohm-cm 1 X 10 12 ASTM D 257<br />
Dielectric breakdown voltage T0.25 mm kVac 2 ASTM D 149<br />
T0.50 mm kVac 6<br />
Coefficient of l<strong>in</strong>ear thermal expansion /°C 5.5 X 10 –4 ASTM E 831<br />
Flammability HB* UL 94<br />
Color Gray<br />
*UL 94 VO available.<br />
Stamped shapes on rolls (preferred package)<br />
T0.25 mm 150 ft/roll<br />
T0.375 mm 125 ft/roll<br />
T0.50 mm 100 ft/roll<br />
T0.75 mm 75 ft/roll<br />
T1.0 mm 50 ft/roll<br />
Stamped sheets (4 x 10 <strong>in</strong>ch sheet)<br />
T0.25 mm 200 sheets/box<br />
T0.375 mm 175 sheets/box<br />
T0.50 mm 150 sheets/box<br />
T0.75 mm 100 sheets/box<br />
T1.0 mm 75 sheets/box<br />
32 <strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change
Product Features<br />
■ Silicone elastomer<br />
■ High thermal conductivity<br />
■ UL 94 V0<br />
■ K = 0.9 W/m-K to<br />
2.9 W/m-K<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
HeatPath GTQ 1200 Series<br />
Th<strong>in</strong> thermal <strong>in</strong>terface elastomer<br />
The HeatPath GTQ 1200 series of<br />
th<strong>in</strong> <strong>in</strong>terface materials consists of<br />
advanced silicone elastomer compounds<br />
with high thermal conductivity<br />
and superior flame-retardancy.<br />
These materials are designed to<br />
cost-effectively transfer heat from<br />
power transistors and <strong>in</strong>tegrated circuits<br />
to a heat plate or heat s<strong>in</strong>k.<br />
They are usable over a wide temperature<br />
range and provide excellent<br />
electrical <strong>in</strong>sulat<strong>in</strong>g properties.<br />
HeatPath GTQ 1200 series materials<br />
have a high thermal conductivity<br />
and are also available with a fiberglass<br />
re<strong>in</strong>forcement for improved<br />
material handl<strong>in</strong>g and poke-through<br />
resistance. The<br />
fiberglass-re<strong>in</strong>forced material is<br />
also available with a pressure-sensitive<br />
adhesive (PSA)<br />
back<strong>in</strong>g for easy and quick <strong>in</strong>stallation.<br />
Variety<br />
HeatPath GTQ 1200 series material<br />
have a high thermal conductivity<br />
and are available <strong>in</strong> three<br />
different versions to meet the most<br />
demand<strong>in</strong>g applications:<br />
•GTQ 1202 and 1212 with fiberglass<br />
re<strong>in</strong>forcements to m<strong>in</strong>imize<br />
stretch<strong>in</strong>g<br />
•GTQ 1232 and 1242 for general<br />
applications<br />
•GTQ 1252 and 1262 for high<br />
thermal conductivity requirement<br />
applications<br />
•GTQ 1272 with Boron Nitride for<br />
very high performance<br />
Proven performance<br />
Extensive physical test<strong>in</strong>g, <strong>in</strong>clud<strong>in</strong>g<br />
tensile and compression tests,<br />
demonstrates that HeatPath thermal<br />
<strong>in</strong>terface material is stable and does<br />
not become brittle over time. Test<strong>in</strong>g<br />
also shows that the HeatPath material<br />
rema<strong>in</strong>s stable after accelerated<br />
ag<strong>in</strong>g.<br />
Catalog 1309431<br />
Issued 5-02<br />
Easy <strong>in</strong>stallation<br />
HeatPath thermal <strong>in</strong>terface material<br />
is cold-applied and requires no heat<br />
or cur<strong>in</strong>g. The material can be<br />
removed easily and cleanly, with no<br />
special tools, for access and rework.<br />
Versatility<br />
HeatPath GTQ 1200 products are<br />
available <strong>in</strong> unstamped rolls and as<br />
<strong>in</strong>dividual stamped<br />
shapes <strong>in</strong> a variety of standard<br />
thicknesses. The PSA-backed material<br />
is available either unstamped on<br />
rolls or <strong>in</strong> stamped shapes on rolls<br />
or sheets, with a carrier film. The<br />
operat<strong>in</strong>g use temperature is –60°C<br />
to 180°C (–45°C to 150°C for the<br />
PSA-backed material).<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
33
34<br />
Typical product properties<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
HeatPath GTQ 1200 Series<br />
Th<strong>in</strong> thermal <strong>in</strong>terface elastomer<br />
Catalog 1309431<br />
Issued 5-02<br />
Test condition Unit 1202 1212 1232 1242 1252 1262 1272 Test method<br />
Color Green Brown Black Green Brown Gray White<br />
Re<strong>in</strong>forcement material Fiberglass Fiberglass Fiberglass<br />
<strong>Thermal</strong> conductivity W/m°K 0.9 1.4 1.1 1.2 1.7 2.6 2.9 ASTM E 1530<br />
<strong>Thermal</strong> resistance (T0.30) °C-<strong>in</strong> 2 /W 1.13 1.03 0.87 0.87 0.71 0.54 0.70 Analysis Tech<br />
Elongation % 2 2 250 100 60 110 2 ASTM D 412<br />
Specific gravity g/cm 3 2.2 2.4 2.2 2.3 2.4 2.5 1.7 ASTM D 792<br />
Hardness (Shore A) 92 92 55 75 85 79 85 ASTM D 2240<br />
Tear strength (45°) lb/<strong>in</strong> (kg/cm) 73 (13) 50 (9) 73 (13) 50 (9) 39 (7) 45 (8) 73 (13) ASTM D 624,<br />
C-Die<br />
Volume resistivity ohm-cm 10 15 10 15 10 14 10 15 10 15 10 14 10 15 ASTM D 257<br />
Dielectric constant at 1 KHz 3.5 3.9 4.1 4.4 4.9 5.3 3.0 ASTM D 150<br />
Loss factor at 1 KHz 0.003 0.003 0.003 0.002 0.004 0.001 0.001 ASTM D 150<br />
Dielectric breakdown voltage kVac 8.0 9.0 11.0 10.0 9.0 9.0 10.0 ASTM D 149<br />
Flammability V0 V0 V0 V0 V0 V0 V0 UL94<br />
Electrical <strong>in</strong>sulant standard 150%<br />
Note: Values reflect nom<strong>in</strong>al performance of T0.30-mm sample. Complete specifications are available from Raychem.<br />
Order<strong>in</strong>g Information<br />
Part number<strong>in</strong>g system<br />
GTQ-12XX-T0.XX-XXXX-XX<br />
AD = Adhesive option for 1202, 1212 and 1272 only<br />
Product draw<strong>in</strong>g number<br />
0XXX = Stamped on sheets<br />
1XXX = Stamped on rolls<br />
2XXX = Unstamped sheets<br />
3XXX = Individual stamped pieces<br />
5XXX = Unstamped rolls<br />
Product thickness<br />
1232, 1242, 1252, 1262: 1202, 1212:<br />
t0.30 = 0.3 + 0.1/-0 t0.15 = 0.15 + 0.02/-0.04<br />
t0.45 = 0.45 +/- 0.05 t0.20 = 0.20 + 0.02/-0.04<br />
t0.85 = 0.85 +/- 0.05 t0.30 = 0.30 +0.10 /-0<br />
Material type<br />
1202 = Fiberglass-re<strong>in</strong>forced silicone elastomer, K = 0.9 W/m°K<br />
1212 = Fiberglass-re<strong>in</strong>forced silicone elastomer, K = 1.4 W/m°K<br />
1232 = Silicone elastomer, K = 1.1 W/m°K<br />
1242 = Silicone elastomer, K = 1.2 W/m°K<br />
1252 = Silicone elastomer, K = 1.7 W/m°K<br />
1262 = Silicone elastomer, K = 2.6 W/m°K<br />
1272 = Fiberglass-re<strong>in</strong>forced silicone elastomer, K = 2.9 W/m°K<br />
Standard packag<strong>in</strong>g<br />
Unstamped rolls<br />
50-meter length for T0.45 and thicker<br />
100-meter length for T0.30 and th<strong>in</strong>ner<br />
Individual stamped pieces<br />
500 pieces per bag<br />
Stamped shapes on rolls<br />
(1202, 1212 and 1272 with adhesive)<br />
100-meter length<br />
1272:<br />
t0.20 = 0.20+/- 0.05<br />
t0.30 = 0.30 +0.1/-0<br />
t0.45 = 0.45+/- 0.05<br />
t0.85 = 0.85+/- 0.05<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change
Product Features<br />
■ Silicone elastomer<br />
■ Soft and conformable<br />
■ Low silicone volatiles<br />
■ UL 94 V0<br />
■ -40°C to +150°C<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
HeatPath GTQ 2200 Series<br />
Gap filler thermal <strong>in</strong>terface elastomer<br />
The HeatPath GTQ 2200 series of<br />
thick gap filler pads are advanced<br />
silicone elastomer compounds that<br />
are highly conformable, with high<br />
thermal conductivity and superior<br />
flame-retardancy. They are designed<br />
to fill <strong>in</strong> rough, uneven, or out-ofparallel<br />
surfaces, easily accommodat<strong>in</strong>g<br />
tolerance stack-up between<br />
CPU or semiconductors and their<br />
heat s<strong>in</strong>k or heat spreader. GTQ<br />
2200 products have low silicone<br />
volatiles and are suitable for silicone-volatile-sensitive<br />
applications.<br />
They are usable over a wide temperature<br />
range, provide excellent electrical<br />
<strong>in</strong>sulat<strong>in</strong>g properties, and are<br />
easily compressed, provid<strong>in</strong>g excellent<br />
cushion<strong>in</strong>g of components.<br />
Variety<br />
HeatPath GTQ 2200 series materials<br />
have a high thermal conductivity<br />
and are available <strong>in</strong> four different<br />
versions to meet the most demand<strong>in</strong>g<br />
applications:<br />
• GTQ 2212 gap filler material for<br />
general applications.<br />
• GTQ 2222 gap filler material with<br />
one side tacky for improved handl<strong>in</strong>g.<br />
• GTQ 2232 gap filler material with<br />
nylon mesh to m<strong>in</strong>imize stretch<strong>in</strong>g.<br />
• GTQ 2242 gap filler material with<br />
nylon mesh and one side tacky<br />
for improved handl<strong>in</strong>g where<br />
stretch<strong>in</strong>g is a concern.<br />
Catalog 1309431<br />
Issued 5-02<br />
Proven performance<br />
Extensive physical test<strong>in</strong>g, <strong>in</strong>clud<strong>in</strong>g<br />
tensile and compression tests,<br />
demonstrates that HeatPath thermal<br />
<strong>in</strong>terface material is stable and does<br />
not become brittle over time. Test<strong>in</strong>g<br />
also shows that the HeatPath material<br />
rema<strong>in</strong>s stable after accelerated<br />
ag<strong>in</strong>g.<br />
Easy <strong>in</strong>stallation<br />
HeatPath thermal <strong>in</strong>terface material<br />
is cold-applied and requires no heat<br />
or cur<strong>in</strong>g. The material can be<br />
removed easily and cleanly, with no<br />
special tools, for access and rework.<br />
Versatility<br />
HeatPath GTQ 2200 products are<br />
available as <strong>in</strong>dividual cut pieces, as<br />
sheets of prestamped pieces, or as<br />
unstamped sheets.<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
35
Typical product properties<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
HeatPath GTQ 2200 Series<br />
Gap filler thermal <strong>in</strong>terface elastomer<br />
Catalog 1309431<br />
Issued 5-02<br />
Test condition Unit 2212 2222 2232 2242 Test method<br />
Color Dark gray Dark gray Dark gray Dark gray Visual<br />
<strong>Thermal</strong> conductivity W/m°K 1.50 1.50 1.50 1.50 ASTM D 5470<br />
<strong>Thermal</strong> resistance (T3.0 mm) at 20 psi °C-<strong>in</strong> 2 /W 3 3 3 3 ASTM 1530<br />
Compression at 10 psi % 10 7 20 16<br />
at 20 psi % 20 17 51 44<br />
Hardness Shore 00 < 70 < 70 < 70 < 70 ASTM D 2240<br />
Elongation % 100 80 80 60 ASTM D 412<br />
Tensile strength Kg/cm 2 3.0 5.0 5.0 7.0<br />
Specific gravity g/cm 3 2.6 2.6 2.6 2.6 ASTM D 792<br />
Temperature range °C -40 to 150 -40 to 150 -40 to 150 -40 to 150<br />
Volume resistivity ohm-cm 1.0 x 10 13 1.0 x 10 13 1.0 x 10 13 1.0 x 10 13 ASTM D 257<br />
Dielectric breakdown voltage kVac > 20 > 20 > 20 > 20 ASTM D 149<br />
Silicone volatiles D4-D20 wt%
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Neotherm 202 Series<br />
Experimental thermal <strong>in</strong>terface material<br />
Product Description<br />
<strong>Tyco</strong> <strong>Electronics</strong> is develop<strong>in</strong>g a new class of thermal <strong>in</strong>terface<br />
materials that offer the thermal performance benefits of<br />
thermal greases and phase change materials with the handl<strong>in</strong>g<br />
and stability benefits of elastomeric materials.<br />
Basic Uses<br />
The "Neotherm" 202 Series of thermal <strong>in</strong>terface materials<br />
are designed for use <strong>in</strong> any application where thermal<br />
greases, phase change materials or th<strong>in</strong> elastomeric pads<br />
are currently used. These materials have been specifically<br />
designed for CPU and memory application, but they may<br />
also be used for telecom applications and power supplies.<br />
Packag<strong>in</strong>g<br />
Available as cont<strong>in</strong>uous films or pre-cut decals on waterslide<br />
decal paper or coated plastic film. Film thickness range from<br />
0.05 mm up to 0.5 mm.<br />
Catalog 1309431<br />
Issued 5-02<br />
Installation<br />
The "Neotherm" 202 Series materials are applied to heat<br />
s<strong>in</strong>ks and heat spreaders by decal transfer. For cont<strong>in</strong>uous<br />
films, the material should be cut to the desired dimensions<br />
before remov<strong>in</strong>g the protective cover sheet to avoid deformation<br />
of the edges. After remov<strong>in</strong>g the protective cover<br />
sheet, apply the tacky side of the material to the substrate.<br />
For waterslide decal paper, apply water to the paper back<strong>in</strong>g<br />
with a sponge or eye-dropper. Wait at least one m<strong>in</strong>ute for<br />
the water to activate the release paper. Remove the paper<br />
back<strong>in</strong>g by slid<strong>in</strong>g the paper along the surface of the substrate.<br />
Remove any excess water from the substrate with a<br />
clean, l<strong>in</strong>t free cloth. The material is now ready for f<strong>in</strong>al<br />
assembly. No high temperature reflow or removal of excess<br />
material is necessary.<br />
Properties<br />
Neotherm 202-1 202-3<br />
Applications CPU’s, memory Memory, Power<br />
Cone Penetration<br />
ASTM 217<br />
200-300 300-500<br />
Volume Resistivity<br />
1x10 12<br />
ohm-cm 1x10 12<br />
ASTM D 257<br />
ohm-cm<br />
Initial Thickness 8 mil (0.20mm) 6 mil (0.15mm)<br />
Thickness @ 80 psi 3.5 mil (0.09) 1 mil (0.04mm)<br />
<strong>Thermal</strong> Resistance @ 80 psi<br />
Analysis Tech<br />
<strong>Thermal</strong> Resistance @ 30 psi<br />
ASTM D 5470<br />
0.02°C-<strong>in</strong> 2<br />
/W 0.10°C-<strong>in</strong> 2<br />
/W<br />
0.06°C-<strong>in</strong> 2<br />
/W 0.10°C-<strong>in</strong> 2<br />
/W<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
37
Test<strong>in</strong>g and Evaluation<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
Neotherm 202 Series<br />
Experimental thermal <strong>in</strong>terface material<br />
"Neotherm" 202-1 has been tested by several techniques<br />
aga<strong>in</strong>st thermal grease and phase change thermal <strong>in</strong>terface<br />
materials to illustrate the benefits of this new material. A<br />
modified ASTM D 5470 test apparatus was used to determ<strong>in</strong>e<br />
the thermal resistance of thermal <strong>in</strong>terface materials<br />
as a function of pressure (Figure 1). At an applied pressure<br />
of 30 psi, "Neotherm" 202-1 shows similar performance with<br />
grease and phase change (the phase change material<br />
requires an elevated temperature reflow process before<br />
test<strong>in</strong>g).<br />
Tr (C-<strong>in</strong> 2/W)<br />
0.13<br />
0.12<br />
0.11<br />
0.1<br />
0.09<br />
0.08<br />
0.07<br />
0.06<br />
0.05<br />
"Neotherm" 202-1<br />
phase change<br />
grease<br />
0.04<br />
10 15 20 25 30<br />
applied pressure (psi)<br />
Figure 1. Modified ASTM D 5470 data<br />
Similar results for thermal resistance versus pressure were<br />
performed us<strong>in</strong>g an Analysis Tech <strong>Thermal</strong> Analyzer (Figure<br />
2). The Analysis Tech data also shows that phase change<br />
materials require an elevated temperature reflow process to<br />
obta<strong>in</strong> optimal thermal performance.<br />
Catalog 1309431<br />
Issued 5-02<br />
38 <strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
Tr (C-<strong>in</strong> 2/W)<br />
0.5<br />
0.4<br />
0.3<br />
0.2<br />
0.1<br />
0<br />
"Neotherm" 202-1<br />
phase change (<strong>in</strong>itial)<br />
phase change (65 C reflow)<br />
0 20 40 60 80 100<br />
applied pressure (psi)<br />
Figure 2. Analysis Tech <strong>Thermal</strong> Analyzer data<br />
An Intel Pentium III based desktop computer was configured<br />
with CPU temperature monitor<strong>in</strong>g software to evaluate the<br />
CPU operat<strong>in</strong>g temperature with different thermal <strong>in</strong>terface<br />
materials (Figure 3). "Neotherm" 202-1 performs as well or<br />
better than other common <strong>in</strong>terface materials.<br />
CPU delta T (C)<br />
70 <strong>in</strong>itial<br />
60<br />
59<br />
50<br />
after 65 C<br />
reflow<br />
40<br />
30<br />
20<br />
10<br />
0<br />
w/o TIM<br />
13<br />
Neotherm 202-1<br />
34<br />
Phase Change<br />
18<br />
13<br />
Grease<br />
Figure 3. Desktop CPU data<br />
(delta T = CPU temp - motherboard temp)
39<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong><br />
HeatPath <strong>Thermal</strong>ly Conductive Material<br />
Selection Guide<br />
Product L<strong>in</strong>e 2100 2101 2160 2212 2222 2232 2242<br />
Color Gray Gray Gray Gray Gray Gray Gray<br />
Thickness (mm) 2.2 +/- 0.40 2.2 +/- 0.40 2.2 +/- 0.40 0.5 +/- 0.1 0.5 +/- 0.1 0.5 +/- 0.1 0.5 +/- 0.1<br />
3+/- 0.50 3+/- 0.50 3+/- 0.50 1.0 +/- 0.2 1.0 +/- 0.2 1.0 +/- 0.2 1.0 +/- 0.2<br />
3.8 +/- 0.71 3.8 +/- 0.71 3.8 +/- 0.71 1.5 +/- 0.2 1.5 +/- 0.2 1.5 +/- 0.2 1.5 +/- 0.2<br />
4.6 +/- 0.71 4.6 +/- 0.71 4.6 +/- 0.71 2.0 +/- 0.3 2.0 +/- 0.3 2.0 +/- 0.3 2.0 +/- 0.3<br />
2.5 +/-0.3 2.5 +/-0.3 2.5 +/-0.3 2.5 +/-0.3<br />
3.0 +/-0.3 3.0 +/-0.3 3.0 +/-0.3 3.0 +/-0.3<br />
3.5 +/- 0.3 3.5 +/- 0.3 3.5 +/- 0.3 3.5 +/- 0.3<br />
4.0 +/- 0.4 4.0 +/- 0.4 4.0 +/- 0.4 4.0 +/- 0.4<br />
<strong>Thermal</strong> Resistance,<br />
5.0 +/- 0.5 5.0 +/- 0.5 5.0 +/- 0.5 5.0 +/-0.5<br />
ºC-<strong>in</strong>◊/W<br />
<strong>Thermal</strong> Conductivity,<br />
4.5 4.5 4.7 3 3 3 3<br />
W/mº-K nom<strong>in</strong>al<br />
Voltage Breakdown -<br />
0.7 0.7 0.7 1.5 1.5 1.5 1.5<br />
(T3.0 mm) >20 >20 >20 >20 >20 >20 >20<br />
Cont<strong>in</strong>uous Use Temp.ºC -40C to 150C -40C to 150C -40C to 150C -40C to 150C -40C to 150C -40C to 150C -40C to 150C<br />
Flammability (UL 94) HB V1 HB VO V0 VO V0<br />
Construction Unsupported Unsupported Unsupported Unsupported Unsupported Fabric re<strong>in</strong>forced Fabric rei<br />
forced One side tacky One side tacky One side tacky<br />
Matrix Silicone gel Silicone gel Silicone gel Silicone rubber Silicone rubber Silicone rubber Silicone rubber<br />
Filler<br />
Note:<br />
Alum<strong>in</strong>a Alum<strong>in</strong>a Alum<strong>in</strong>a Alum<strong>in</strong>a Alum<strong>in</strong>a Alum<strong>in</strong>a Alum<strong>in</strong>a<br />
GTQ-1200 series: Values reflect nom<strong>in</strong>al performance of T0.30 mm sample<br />
GTQ-1500 series: <strong>Thermal</strong> resistance: Values reflect nom<strong>in</strong>al performance of T0.25 mm sample<br />
Voltage Breakdown: Values reflect nom<strong>in</strong>al performance of T1.0 mm sample<br />
GTQ-4000 series:Values reflect nom<strong>in</strong>al performance of T0.127 mm sample<br />
GTQ-2100, 2500, and 2200 series: Values reflect nom<strong>in</strong>al performance of T3.0 mm sample<br />
GTQ-2400 series: Values reflect nom<strong>in</strong>al performance of T2.5 mm sample<br />
Catalog 1309431<br />
Issued 5-02<br />
GTQ Product L<strong>in</strong>e 1202 1212 1232 1242 1252 1262 1272 1500 1502 1560 4103 4213 4223 4233 4323<br />
Color Green Brown Black Green Brown Gray White Gray Gray Gray White P<strong>in</strong>k P<strong>in</strong>k P<strong>in</strong>k Gray<br />
Thickness (mm) 0.15 +0.02/-0.04 0.15 +0.02/-0.04 0.30 +0.1/-0 0.30 +0.1/-0 0.30 +0.1/-0 0.30 +0.1/-0 0.20 +/-0.05 0.25 +/- 0.05 0.25 +/- 0.05 0.25 +/- 0.05 0.127 0.051 0.076 0.102 0.076<br />
0.20 +0.02/-0.04 0.20 +0.02/-0.04 0.45 +/-0.05 0.45 +/-0.05 0.45 +/-0.05 0.45 +/-0.05 0.30 +0.1/-0 0.5 +/- 0.05 0.5 +/- 0.05 0.5 +/- 0.05<br />
0.30 +0.10/-0 0.30 +0.10/-0 0.85 +/-0.05 0.85 +/-0.05 0.85 +/-0.05 0.85 +/-0.05 0.45 +/-0.05 0.75 +/- 0.15 0.75 +/- 0.15 0.75 +/- 0.15<br />
0.85 +/-0.05 1 +/- 0.20 1 +/- 0.20 1 +/- 0.20<br />
1.5 +/- 0.02 1.5 +/- 0.02 1.5 +/- 0.02<br />
<strong>Thermal</strong> Resistance,<br />
ºC-<strong>in</strong>◊/W<br />
1.13 1.03 0.87 0.87 0.71 0.54 0.7<br />
0.45 0.6 0.75 0.03 0.16 0.27 0.35 0.05<br />
<strong>Thermal</strong> Conductivity,<br />
W/mº-K nom<strong>in</strong>al<br />
0.9 1.4 1.1 1.2 1.7 2.6 2.9<br />
1.1 0.9 1.1<br />
Voltage Breakdown (kVac) 8 9 11 10 9 9 10<br />
8 8 8<br />
Cont<strong>in</strong>uous Use<br />
Temperature ºC<br />
-60 to 180 -60 to 180 -60 to 180 -60 to 180 -60 to 180 -60 to 180 -60 to 180<br />
-40 to 150 -40 to 150 -40 to 150 Max 200 Max 200 Max 200 Max 200 Max 200<br />
Cont<strong>in</strong>uous Use Temp.<br />
ºC - PSA backed<br />
Flammability (UL 94)<br />
-45 to 150<br />
V0<br />
-45 to 150<br />
V0<br />
N/A<br />
V0<br />
N/A<br />
V0<br />
N/A<br />
V0<br />
N/A<br />
V0<br />
-45 to 150<br />
V0<br />
N/A<br />
HB<br />
N/A<br />
V0<br />
N/A<br />
HB<br />
N/A N/A<br />
V0<br />
N/A<br />
V0<br />
N/A<br />
V0<br />
N/A<br />
Construction Fiberglass Fiberglass Unsupported Unsupported Unsupported Unsupported Fiberglass Fiberglass Fiberglass Fiberglass None Polyimide Polyimide Polyimide Alum<strong>in</strong>um<br />
Matrix Silicone rubber Silicone rubber Silicone rubber Silicone rubber Silicone rubber Silicone rubber Silicone rubber Silicone gel Silicone gel Silicone gel Parraf<strong>in</strong> wax Parraf<strong>in</strong> wax Parraf<strong>in</strong> wax Parraf<strong>in</strong> wax Parraf<strong>in</strong> wax<br />
Filler Alum<strong>in</strong>a Alum<strong>in</strong>a Alum<strong>in</strong>a Alum<strong>in</strong>a Alum<strong>in</strong>a Alum<strong>in</strong>a Boron nitride Alum<strong>in</strong>a Alum<strong>in</strong>a Alum<strong>in</strong>a ZnO ZnO ZnO ZnO ZnO<br />
<strong>Tyco</strong> <strong>Electronics</strong> <strong>Thermal</strong> <strong>Solutions</strong> 1-800-522-6752 Specifications<br />
www.thermal.tycoelectronics.com Product Information Center/AMP FAX Service subject to change<br />
2412 2422 2432 2442 2500<br />
Gray Gray Gray Gray Blue<br />
0.5 +/- 0.1 0.5 +/- 0.1 0.5 +/- 0.1 0.5 +/- 0.1 2.2 +/- 0.40<br />
1.0 +/- 0.2 1.0 +/- 0.2 1.0 +/- 0.2 1.0 +/- 0.2 3+/- 0.50<br />
1.5 +/- 0.2 1.5 +/- 0.2 1.5 +/- 0.2 1.5 +/- 0.2<br />
2.0 +/- 0.3 2.0 +/- 0.3 2.0 +/- 0.3 2.0 +/- 0.3<br />
2.5 +/-0.3 2.5 +/-0.3 2.5 +/-0.3 2.5 +/-0.3<br />
3.0 +/-0.3 3.0 +/-0.3 3.0 +/-0.3 3.0 +/-0.3<br />
3.5 +/- 0.3 3.5 +/- 0.3 3.5 +/- 0.3 3.5 +/- 0.3<br />
4.0 +/- 0.4 4.0 +/- 0.4 4.0 +/- 0.4 4.0 +/- 0.4<br />
5.0 +/- 0.5 5.0 +/- 0.5 5.0 +/- 0.5 5.0 +/- 0.5<br />
1.4 1.6 1.6 1.6 3.8<br />
2 2 2 2 0.9<br />
>20 >20 >20 >20 >20<br />
-40C to 150C -40C to 150C -40C to 150C -40C to 150C -40C to 150C<br />
V0 V0 V1 V1 HB<br />
Unsupported Unsupported Fabric re<strong>in</strong>forced Fabric re<strong>in</strong>forced Unsupported<br />
One side tacky One side tacky<br />
Silicone rubber Silicone rubber Silicone rubber Silicone rubber Silicone gel<br />
Boron nitride Boron nitride Boron nitride Boron nitride Alum<strong>in</strong>a