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Programm Photovoltaik Ausgabe 2008 ... - Bundesamt für Energie BFE

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Seite 46 von 288<br />

Collaborations<br />

IMT is active in a collaboration on a national level with the EPFL for advanced transmission electron<br />

microscopy (TEM) sample preparation, supporting the textured heterojunction solar cell improvement.<br />

In addition, international “informal” collaboration are conducted with the German Hahn-Meitner-Institut<br />

(HMI), the Japanese National Institute of Advanced Industrial Science and Technology (AIST) and the<br />

US-American National Renewable Energy Laboratory (NREL).<br />

Evaluation 2007 and Outlook <strong>2008</strong><br />

THIFIC was successfully launched in mid-2007. From the beginning of the project, we pursued the<br />

amorphous/crystalline silicon interface recombination modeling for fast heterojunction solar cell single<br />

process step analysis and improvement. Textured wafers can now be cleaned and therefore the same<br />

kind of lifetime measurement assisted layer development is performed. Up to now, a textured silicon<br />

heterojunction solar cell with an open-circuit voltage of 700 mV is achieved. Despite the current gain<br />

from the textures geometrical light-trapping, this cell’s efficiency remains, with 17%, lower than the<br />

best one on flat silicon (19%) because of its low fill factor. Fig. 7 illustrates that this fill factor loss is<br />

partly caused by the texture based surface increase on same sized cells as compared to flat cells. For<br />

a flat small cell doubling the surface leads to a relative fill factor loss of more than 10% because of<br />

series resistance due to the lacking front metal grid. Worth recognizing positively too in Fig. 7 is that<br />

the open-circuit voltage is even higher when quadrupling the textured solar cells size. Therefore the<br />

most urgent step to take at present in our silicon heterojunction solar cell processing is the development<br />

of a front contact metallization. Actually three different metallization schemes are under test.<br />

Shortly they will reach the application phase to solar cells and will then permit us to validate our first<br />

results also on larger solar cells.<br />

Fig. 7: Series resistance losses in small sized textured cells without front metal grid.<br />

References<br />

[1] S. Olibet, E. Vallat-Sauvain, C. Ballif: Effect of light induced degradation on passivating properties of a-Si:H layers<br />

deposited on crystalline Si, Proceedings of the 21st EU-PVSEC, Dresden, Germany, p.1366, 2006.<br />

[2] L. Fesquet, S. Olibet, E. Vallat-Sauvain, A. Shah, C. Ballif: High quality surface passivation and heterojunction fabrication<br />

by VHF-PECVD deposition of amorphous silicon on crystalline Si: Theory and experiments, to be published<br />

in the Proceedings of the 22th EU-PVSEC, Milano, Italy, 2007.<br />

[3] S. Olibet, E. Vallat-Sauvain and C. Ballif: Model for a-Si:H/c-Si interface recombination based on the amphoteric<br />

nature of silicon dangling bonds, Physical Review B 76, 035326, 2007.<br />

[4] S. Olibet, E. Vallat-Sauvain, C. Ballif, L. Fesquet: Recombination through amphoteric states at the amorphous/crystalline<br />

silicon interface: modelling and experiment, Proceedings of NUMOS-workshop (Numerical modelling<br />

of thin film solar cells), Gent, Belgium, p. 141, 2007.<br />

[5] S. Olibet, E. Vallat-Sauvain, C. Ballif, L. Korte, L. Fesquet: Silicon Solar Cell Passivation using Heterostructures,<br />

Proceedings of the 17 th Workshop on Crystalline Silicon Solar Cells and Modules: Materials and Processes, Vail, Colorado<br />

USA, p. 130, 2007.<br />

[6] S. Olibet, E. Vallat-Sauvain, C. Ballif, L. Korte, L. Fesquet: Heterojunction solar cell efficiency improvement on various<br />

c-Si substrates by interface recombination modelling, To be presented at the PVSEC-17, Fukuoka, Japan, 2007.<br />

THIFIC, S. Olibet, IMT Neuchâtel<br />

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