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Damage formation and annealing studies of low energy ion implants ...

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Chapter 4 Experimental Techniques <strong>and</strong> sample preparat<strong>ion</strong><br />

4.1 Introduct<strong>ion</strong><br />

Throughout this study several techniques have been used to characterise the<br />

samples. The principal technique applied was medium <strong>energy</strong> <strong>ion</strong> scattering (MEIS) (1,<br />

2), which was carried out at CCLRC Daresbury laboratory (UK) (3).<br />

MEIS is a refinement <strong>of</strong> Rutherford Backscattering Spectrometry (RBS), which<br />

has been in common use since the 1960s for studying a variety <strong>of</strong> applicat<strong>ion</strong>s such as<br />

<strong>ion</strong> implantat<strong>ion</strong> <strong>of</strong> semiconductors, surfaces <strong>and</strong> thin films (4, 5). The underlying<br />

principle behind RBS <strong>and</strong> MEIS is essentially the same, with modificat<strong>ion</strong> to the<br />

detailed experimental condit<strong>ion</strong>s <strong>and</strong> some differences with the equipment. MEIS is<br />

capable <strong>of</strong> producing quantitative depth pr<strong>of</strong>iles <strong>of</strong> implanted heavy <strong>ion</strong>s <strong>and</strong> capable <strong>of</strong><br />

simultaneously detecting displaced Si atoms, surface oxide atoms <strong>and</strong> any surface<br />

contaminant. This enables the experiments to provide in<strong>format<strong>ion</strong></strong> on the crystal lattice<br />

damage caused by the implantat<strong>ion</strong>, the regrowth <strong>of</strong> the damaged Si crystal <strong>and</strong><br />

movement <strong>of</strong> dopant fol<strong>low</strong>ing <strong>annealing</strong>. Occas<strong>ion</strong>al RBS experiments were carried<br />

out at Salford University to confirm findings from MEIS.<br />

Secondary <strong>ion</strong> mass spectrometry (SIMS) (2, 5, 6) was used to compliment the<br />

MEIS analysis. SIMS was carried out at ITC-IRST, Trento, Italy <strong>and</strong> at IMEC in<br />

Leuven, Belgium. The combinat<strong>ion</strong> <strong>of</strong> MEIS <strong>and</strong> SIMS al<strong>low</strong>s, for instance,<br />

in<strong>format<strong>ion</strong></strong> regarding substitut<strong>ion</strong>al dopants to be obtained. SIMS is also useful for<br />

pr<strong>of</strong>iling light elements such as B, for which <strong>ion</strong> scattering techniques have a very much<br />

reduced sensitivity.<br />

Other techniques have been used to characterise a small number <strong>of</strong> samples.<br />

Various X-ray <strong>studies</strong> have been performed at beamline ID01 at the European<br />

Synchrotron Radiat<strong>ion</strong> Facility (ESRF), France (10). Some <strong>of</strong> the findings <strong>of</strong> these<br />

experiments are reported in this thesis <strong>and</strong> elsewhere (9, 41), where the comparison with<br />

MEIS has been instrumental in their interpretat<strong>ion</strong>. Combined in<strong>format<strong>ion</strong></strong> has provided<br />

further in<strong>format<strong>ion</strong></strong> on the segregat<strong>ion</strong> <strong>of</strong> As <strong>and</strong> details <strong>of</strong> the regrowth <strong>of</strong> Si. The<br />

techniques are not explained in any detail in this thesis <strong>and</strong> further in<strong>format<strong>ion</strong></strong> on these<br />

experiments <strong>and</strong> techniques can be found elsewhere (9, 10, 46, 47). Cross sect<strong>ion</strong>al<br />

transmiss<strong>ion</strong> electron microscopy (XTEM) (49) was performed at The University <strong>of</strong><br />

Salford to investigate damage fol<strong>low</strong>ing <strong>annealing</strong>, <strong>and</strong> the result is in Chapter 6.<br />

Energy filtered transmiss<strong>ion</strong> electron microscopy (EFTEM) carried out at CNR, Catania,<br />

Italy, has been used to image specific elements <strong>and</strong> the results are used in Chapter 7.<br />

63

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