Damage formation and annealing studies of low energy ion implants ...

Damage formation and annealing studies of low energy ion implants ... Damage formation and annealing studies of low energy ion implants ...

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3.5.2.1 Standard Fickian diffusion When atomic concentration gradients exist, atoms are able to move by taking the form of point defects, to a region where they can reside at an equilibrium level. Interstitial or vacancy mediated diffusion can occur in crystalline material. For low impurity concentrations, i.e. when the dopant concentration is less than the intrinsic carrier concentration, the diffusion is best described by Fickian diffusion. The rate of transfer of solute atoms per unit area (at/cc) is proportional to the concentration gradient of the solute. ∂C( x, t) J x = −D (3.8) ∂x where Jx is the diffusion flux in one dimension, C is the solute concentration and D is a diffusion coefficient which is equal to − E D = D exp act 0 (3.9) kT where D0 is a frequency factor, that is dependent upon the atomic jump frequency and distance and in As implanted Si is given by 22.9 cm 2 /s (68), Eact is the activation energy for diffusion (for interstitial diffusion Eact = 0.6 – 1 eV, and vacancy diffusion Eact = 3 – 4 eV), and k is the Boltzmann constant. From the law of conservation of matter, the change in the solute concentration equals the decrease in the diffusion flux. ∂C ∂J x = − ∂t ∂x combining 3.8 and 3.10 leads to 57 (3.10) 2 ∂C ⎡∂ C⎤ = D⎢ 2 ⎥ (3.11) ∂t ⎣ ∂x ⎦ Equation 3.8 is known as Ficks first law and 3.11 is known as Ficks second law of diffusion. For low concentration of dopants, i.e. near the intrinsic levels of doping, and using appropriate boundary conditions there can be a good match with experimental results (69). For implantations the concentration is usually too high for Fickian diffusion. At high concentrations the diffusion profiles show a dependence upon the defect concentration. For high concentration diffusion the impurities migrate as impurity point defect complexes. At the temperatures where diffusion occurs, most implanted dopants will be expected to have taken up substitutional sites. The diffusivity of dopant atoms in Si is governed by the local concentration of point defects according to

⎛ 〈 C ⎞ ⎛ ⎞ I 〉 〈 C V 〉 D = D ⎜ ⎟ + ⎜ ⎟ I D * V ⎜ * ⎟ (3.12) ⎝ C I ⎠ ⎝ C V ⎠ where DI and DV are the intrinsic diffusivities due to interactions with self interstitials (I) and vacancies (V) and / Cx * and the local / equilibrium concentration of point defects (70). B is known to diffuse by interstitial mechanisms, Sb by vacancy mechanisms and As is thought to diffuse by both interstitial and vacancy mechanisms (71). 3.5.2.2 Transient enhanced diffusion Anomalous diffusion of dopants has been observed where the diffusivity can be increased by several orders of magnitude from that calculated for normal diffusion. This enhancement was first attributed to the release of Si interstitials during the dissolution of {113} defects during annealing at temperatures from 670 °C to 815 °C (58, 61). However it has since been shown that it is not just the {113} defects that cause TED (59). TED occurred in samples where the implant dose was too low to form {113} defects. In this instance the activation energy for TED was in close agreement with the dissolution of very small clusters of interstitials or the activation energy of migration of free self Si interstitials. Additional experiments had also shown that the maximum diffusivity occurred in timescales before the dissolution of {113} defects starts. Therefore the dissolution of several defect types causes an injection of interstitials responsible for TED. A model to describe TED in PAI Si assumes a surface interstitial concentration which increases with depth to the EOR region where there is a constant concentration of interstitials which decreases with time (72). Essentially all of the emitted interstitials arrive by diffusion at the Si surface where they are trapped. The flux to the surface is inversely related to the depth of the EOR band, so can be beneficial to separate EOR from dopant implant. TED causes the segregated As buried underneath the oxide to diffuse to greater depths. References 1 S.M. Sze, Physics of Semiconductor devices, Second edition, John Wiley and Sons, New York, 1981. 2 C. Kittel, Introduction to solid state physics, Seventh Edition, John Wiley and Sons, New York, 1996. 58

⎛ 〈 C ⎞ ⎛ ⎞<br />

I 〉 〈 C V 〉<br />

D = D<br />

⎜<br />

⎟ + ⎜ ⎟<br />

I D<br />

* V ⎜ * ⎟<br />

(3.12)<br />

⎝ C I ⎠ ⎝ C V ⎠<br />

where DI <strong>and</strong> DV are the intrinsic diffusivities due to interact<strong>ion</strong>s with self interstitials<br />

(I) <strong>and</strong> vacancies (V) <strong>and</strong> / Cx * <strong>and</strong> the local / equilibrium concentrat<strong>ion</strong> <strong>of</strong> point<br />

defects (70). B is known to diffuse by interstitial mechanisms, Sb by vacancy<br />

mechanisms <strong>and</strong> As is thought to diffuse by both interstitial <strong>and</strong> vacancy mechanisms<br />

(71).<br />

3.5.2.2 Transient enhanced diffus<strong>ion</strong><br />

Anomalous diffus<strong>ion</strong> <strong>of</strong> dopants has been observed where the diffusivity can be<br />

increased by several orders <strong>of</strong> magnitude from that calculated for normal diffus<strong>ion</strong>. This<br />

enhancement was first attributed to the release <strong>of</strong> Si interstitials during the dissolut<strong>ion</strong><br />

<strong>of</strong> {113} defects during <strong>annealing</strong> at temperatures from 670 °C to 815 °C (58, 61).<br />

However it has since been shown that it is not just the {113} defects that cause TED<br />

(59). TED occurred in samples where the implant dose was too <strong>low</strong> to form {113}<br />

defects. In this instance the activat<strong>ion</strong> <strong>energy</strong> for TED was in close agreement with the<br />

dissolut<strong>ion</strong> <strong>of</strong> very small clusters <strong>of</strong> interstitials or the activat<strong>ion</strong> <strong>energy</strong> <strong>of</strong> migrat<strong>ion</strong> <strong>of</strong><br />

free self Si interstitials. Addit<strong>ion</strong>al experiments had also shown that the maximum<br />

diffusivity occurred in timescales before the dissolut<strong>ion</strong> <strong>of</strong> {113} defects starts.<br />

Therefore the dissolut<strong>ion</strong> <strong>of</strong> several defect types causes an inject<strong>ion</strong> <strong>of</strong> interstitials<br />

responsible for TED.<br />

A model to describe TED in PAI Si assumes a surface interstitial concentrat<strong>ion</strong><br />

which increases with depth to the EOR reg<strong>ion</strong> where there is a constant concentrat<strong>ion</strong> <strong>of</strong><br />

interstitials which decreases with time (72). Essentially all <strong>of</strong> the emitted interstitials<br />

arrive by diffus<strong>ion</strong> at the Si surface where they are trapped. The flux to the surface is<br />

inversely related to the depth <strong>of</strong> the EOR b<strong>and</strong>, so can be beneficial to separate EOR<br />

from dopant implant. TED causes the segregated As buried underneath the oxide to<br />

diffuse to greater depths.<br />

References<br />

1 S.M. Sze, Physics <strong>of</strong> Semiconductor devices, Second edit<strong>ion</strong>, John Wiley <strong>and</strong><br />

Sons, New York, 1981.<br />

2 C. Kittel, Introduct<strong>ion</strong> to solid state physics, Seventh Edit<strong>ion</strong>, John Wiley <strong>and</strong><br />

Sons, New York, 1996.<br />

58

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