Damage formation and annealing studies of low energy ion implants ...
Damage formation and annealing studies of low energy ion implants ... Damage formation and annealing studies of low energy ion implants ...
3.5.2.1 Standard Fickian diffusion When atomic concentration gradients exist, atoms are able to move by taking the form of point defects, to a region where they can reside at an equilibrium level. Interstitial or vacancy mediated diffusion can occur in crystalline material. For low impurity concentrations, i.e. when the dopant concentration is less than the intrinsic carrier concentration, the diffusion is best described by Fickian diffusion. The rate of transfer of solute atoms per unit area (at/cc) is proportional to the concentration gradient of the solute. ∂C( x, t) J x = −D (3.8) ∂x where Jx is the diffusion flux in one dimension, C is the solute concentration and D is a diffusion coefficient which is equal to − E D = D exp act 0 (3.9) kT where D0 is a frequency factor, that is dependent upon the atomic jump frequency and distance and in As implanted Si is given by 22.9 cm 2 /s (68), Eact is the activation energy for diffusion (for interstitial diffusion Eact = 0.6 – 1 eV, and vacancy diffusion Eact = 3 – 4 eV), and k is the Boltzmann constant. From the law of conservation of matter, the change in the solute concentration equals the decrease in the diffusion flux. ∂C ∂J x = − ∂t ∂x combining 3.8 and 3.10 leads to 57 (3.10) 2 ∂C ⎡∂ C⎤ = D⎢ 2 ⎥ (3.11) ∂t ⎣ ∂x ⎦ Equation 3.8 is known as Ficks first law and 3.11 is known as Ficks second law of diffusion. For low concentration of dopants, i.e. near the intrinsic levels of doping, and using appropriate boundary conditions there can be a good match with experimental results (69). For implantations the concentration is usually too high for Fickian diffusion. At high concentrations the diffusion profiles show a dependence upon the defect concentration. For high concentration diffusion the impurities migrate as impurity point defect complexes. At the temperatures where diffusion occurs, most implanted dopants will be expected to have taken up substitutional sites. The diffusivity of dopant atoms in Si is governed by the local concentration of point defects according to
⎛ 〈 C ⎞ ⎛ ⎞ I 〉 〈 C V 〉 D = D ⎜ ⎟ + ⎜ ⎟ I D * V ⎜ * ⎟ (3.12) ⎝ C I ⎠ ⎝ C V ⎠ where DI and DV are the intrinsic diffusivities due to interactions with self interstitials (I) and vacancies (V) and / Cx * and the local / equilibrium concentration of point defects (70). B is known to diffuse by interstitial mechanisms, Sb by vacancy mechanisms and As is thought to diffuse by both interstitial and vacancy mechanisms (71). 3.5.2.2 Transient enhanced diffusion Anomalous diffusion of dopants has been observed where the diffusivity can be increased by several orders of magnitude from that calculated for normal diffusion. This enhancement was first attributed to the release of Si interstitials during the dissolution of {113} defects during annealing at temperatures from 670 °C to 815 °C (58, 61). However it has since been shown that it is not just the {113} defects that cause TED (59). TED occurred in samples where the implant dose was too low to form {113} defects. In this instance the activation energy for TED was in close agreement with the dissolution of very small clusters of interstitials or the activation energy of migration of free self Si interstitials. Additional experiments had also shown that the maximum diffusivity occurred in timescales before the dissolution of {113} defects starts. Therefore the dissolution of several defect types causes an injection of interstitials responsible for TED. A model to describe TED in PAI Si assumes a surface interstitial concentration which increases with depth to the EOR region where there is a constant concentration of interstitials which decreases with time (72). Essentially all of the emitted interstitials arrive by diffusion at the Si surface where they are trapped. The flux to the surface is inversely related to the depth of the EOR band, so can be beneficial to separate EOR from dopant implant. TED causes the segregated As buried underneath the oxide to diffuse to greater depths. References 1 S.M. Sze, Physics of Semiconductor devices, Second edition, John Wiley and Sons, New York, 1981. 2 C. Kittel, Introduction to solid state physics, Seventh Edition, John Wiley and Sons, New York, 1996. 58
- Page 25 and 26: the active channel, adjacent to the
- Page 27 and 28: To continue to improve devices ther
- Page 29 and 30: produces a device quality regrown l
- Page 31 and 32: technique of channelling Rutherford
- Page 33 and 34: 22 J.S Williams. Solid Phase Recrys
- Page 35 and 36: and the probability of scattering t
- Page 37 and 38: importance for many atomic collisio
- Page 39 and 40: M1, V0, E0 Figure 2.2 Elastic scatt
- Page 41 and 42: 2.3.1 Models for inelastic energy l
- Page 43 and 44: dE/dx (ev/Ang) 10 1 Inelastic Energ
- Page 45 and 46: dE/dx (eV/Ang) 125 100 75 50 25 0 2
- Page 47 and 48: Figure 2.5 Results of TRIM simulati
- Page 49 and 50: Chapter 3 Damage and Annealing proc
- Page 51 and 52: the Si/SiO2 interface, consuming th
- Page 53 and 54: On the basis that by creating an in
- Page 55 and 56: Figure 3.4 Structure of crystalline
- Page 57 and 58: a Si atom will suffer little angula
- Page 59 and 60: 3.2.2.5 Homogeneous model (Critical
- Page 61 and 62: Sputtering and atomic mixing play a
- Page 63 and 64: and is approximately 25 times faste
- Page 65 and 66: elevant dopants later. For equal co
- Page 67 and 68: nearest neighbour distance (52). By
- Page 69 and 70: Category I defects are produced whe
- Page 71 and 72: thermal annealing (600 - 700 °C an
- Page 73 and 74: Figure 3.11 Relationship between im
- Page 75: defect pairs due to Coulomb attract
- Page 79 and 80: 27 R.D. Goldberg, J. S. Williams, a
- Page 81 and 82: 67 H. Bracht. Diffusion Mechanism a
- Page 83 and 84: Hall effect measurements were carri
- Page 85 and 86: energy than one scattered from an a
- Page 87 and 88: epresents a small improvement over
- Page 89 and 90: (dE/dx)out multiplied by the path l
- Page 91 and 92: they are small compared to the diff
- Page 93 and 94: ackscattering (27). This fact forms
- Page 95 and 96: Figure 4.7 a) Plot of a Gaussian di
- Page 97 and 98: similar to the width of the error f
- Page 99 and 100: UP Ion Beam SPIN Rotation Sample Sc
- Page 101 and 102: Kinematic factor (K) 1.0 0.8 0.6 0.
- Page 103 and 104: Figure 4.14 Illustration of the dou
- Page 105 and 106: 4.2.2.4 Interpretation of spectra A
- Page 107 and 108: with are comparatively small, ~ 0.5
- Page 109 and 110: Inelastic energy loss (eV/Ang) 32 2
- Page 111 and 112: iterative procedure is carried out
- Page 113 and 114: Yield (couts per 5µC) 300 250 200
- Page 115 and 116: SIMS experiments were also carried
- Page 117 and 118: MEIS, using the scattering conditio
- Page 119 and 120: 4.5 Sample production Samples have
- Page 121 and 122: an N2/O2 environment to maintain an
- Page 123 and 124: 38 M. Anderle, M. Barozzi, M. Bersa
- Page 125 and 126: damage evolution behaviour observed
⎛ 〈 C ⎞ ⎛ ⎞<br />
I 〉 〈 C V 〉<br />
D = D<br />
⎜<br />
⎟ + ⎜ ⎟<br />
I D<br />
* V ⎜ * ⎟<br />
(3.12)<br />
⎝ C I ⎠ ⎝ C V ⎠<br />
where DI <strong>and</strong> DV are the intrinsic diffusivities due to interact<strong>ion</strong>s with self interstitials<br />
(I) <strong>and</strong> vacancies (V) <strong>and</strong> / Cx * <strong>and</strong> the local / equilibrium concentrat<strong>ion</strong> <strong>of</strong> point<br />
defects (70). B is known to diffuse by interstitial mechanisms, Sb by vacancy<br />
mechanisms <strong>and</strong> As is thought to diffuse by both interstitial <strong>and</strong> vacancy mechanisms<br />
(71).<br />
3.5.2.2 Transient enhanced diffus<strong>ion</strong><br />
Anomalous diffus<strong>ion</strong> <strong>of</strong> dopants has been observed where the diffusivity can be<br />
increased by several orders <strong>of</strong> magnitude from that calculated for normal diffus<strong>ion</strong>. This<br />
enhancement was first attributed to the release <strong>of</strong> Si interstitials during the dissolut<strong>ion</strong><br />
<strong>of</strong> {113} defects during <strong>annealing</strong> at temperatures from 670 °C to 815 °C (58, 61).<br />
However it has since been shown that it is not just the {113} defects that cause TED<br />
(59). TED occurred in samples where the implant dose was too <strong>low</strong> to form {113}<br />
defects. In this instance the activat<strong>ion</strong> <strong>energy</strong> for TED was in close agreement with the<br />
dissolut<strong>ion</strong> <strong>of</strong> very small clusters <strong>of</strong> interstitials or the activat<strong>ion</strong> <strong>energy</strong> <strong>of</strong> migrat<strong>ion</strong> <strong>of</strong><br />
free self Si interstitials. Addit<strong>ion</strong>al experiments had also shown that the maximum<br />
diffusivity occurred in timescales before the dissolut<strong>ion</strong> <strong>of</strong> {113} defects starts.<br />
Therefore the dissolut<strong>ion</strong> <strong>of</strong> several defect types causes an inject<strong>ion</strong> <strong>of</strong> interstitials<br />
responsible for TED.<br />
A model to describe TED in PAI Si assumes a surface interstitial concentrat<strong>ion</strong><br />
which increases with depth to the EOR reg<strong>ion</strong> where there is a constant concentrat<strong>ion</strong> <strong>of</strong><br />
interstitials which decreases with time (72). Essentially all <strong>of</strong> the emitted interstitials<br />
arrive by diffus<strong>ion</strong> at the Si surface where they are trapped. The flux to the surface is<br />
inversely related to the depth <strong>of</strong> the EOR b<strong>and</strong>, so can be beneficial to separate EOR<br />
from dopant implant. TED causes the segregated As buried underneath the oxide to<br />
diffuse to greater depths.<br />
References<br />
1 S.M. Sze, Physics <strong>of</strong> Semiconductor devices, Second edit<strong>ion</strong>, John Wiley <strong>and</strong><br />
Sons, New York, 1981.<br />
2 C. Kittel, Introduct<strong>ion</strong> to solid state physics, Seventh Edit<strong>ion</strong>, John Wiley <strong>and</strong><br />
Sons, New York, 1996.<br />
58