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Damage formation and annealing studies of low energy ion implants ...

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complex <strong>format<strong>ion</strong></strong>, precipitat<strong>ion</strong> <strong>and</strong> segregat<strong>ion</strong>. At <strong>low</strong> <strong>annealing</strong> temperatures ~<br />

600 °C crystallisat<strong>ion</strong> is strongly dependent on <strong>ion</strong> fluence. There is not a simple rate<br />

enhancement, which tracks the As concentrat<strong>ion</strong> pr<strong>of</strong>ile as seen with B. The maximum<br />

concentrat<strong>ion</strong> before retardat<strong>ion</strong> occurs is ~ 1.5 × 10 21 cm -3 (49). The <strong>format<strong>ion</strong></strong> <strong>of</strong><br />

dislocat<strong>ion</strong>s maybe directly related to As clustering <strong>and</strong> precipitat<strong>ion</strong>. Solubility<br />

increases with temperature <strong>and</strong> therefore fewer defects occur with high temperatures. It<br />

is suggested that As vacancy clusters can form at the a/c interface <strong>and</strong> contribute to the<br />

rate retardat<strong>ion</strong> (38). Severe retardat<strong>ion</strong> <strong>of</strong> the SPER rate is observed at high<br />

concentrat<strong>ion</strong>s.<br />

During SPER dopants may become substitut<strong>ion</strong>al <strong>and</strong> electrically active in<br />

concentrat<strong>ion</strong>s well exceeding the equilibrium solid solubility (39). Substitut<strong>ion</strong>al<br />

concentrat<strong>ion</strong>s incorporated into an amorphous regrowth can exceed the equilibrium<br />

solid solubility by as much as 560 times (41). The high substitut<strong>ion</strong>al concentrat<strong>ion</strong> <strong>of</strong><br />

impurities observed after SPER can be attributed to trapping by the rapidly moving<br />

interface (39).<br />

3.3.2.3 Models for SPER<br />

A number <strong>of</strong> models adopting several differing approaches have been developed<br />

to describe the mechanisms <strong>of</strong> the SPER process. Atomistic models consider how the<br />

atoms on the amorphous Si side <strong>of</strong> the interface are rearranged onto the crystal template.<br />

Electric field models consider the electronic properties <strong>of</strong> the structure at the amorphous<br />

/ crystalline interface <strong>and</strong> consider more closely the effects <strong>of</strong> the dopant on the SPER<br />

process. Finally kinematic models attempt to identify the rate limiting step <strong>of</strong> the SPER<br />

process <strong>and</strong> derive equat<strong>ion</strong>s that can predict the SPER rate as a funct<strong>ion</strong> <strong>of</strong> temperature<br />

<strong>and</strong> dopant concentrat<strong>ion</strong> (17). The most important models are briefly ment<strong>ion</strong>ed here.<br />

Starting with the atomistic approach models, the focus is to consider the<br />

behaviour at the a/c interface <strong>and</strong> the structure <strong>of</strong> the amorphous Si, which can be<br />

described by a continuous r<strong>and</strong>om network (CRN). Considerat<strong>ion</strong> is made as to how<br />

atoms from the amorphous side might reorder themselves onto the crystalline template.<br />

A model was first created for Si (111) (50). The a/c interface is viewed to be fully<br />

coordinated, i.e. there are no free bonds, so it would be in the <strong>low</strong>est <strong>energy</strong><br />

configurat<strong>ion</strong>. The difference in <strong>energy</strong> between amorphous <strong>and</strong> crystalline Si is due to<br />

bond angle distort<strong>ion</strong> (50, 51). In the model, crystallisat<strong>ion</strong> is viewed as a simple bond<br />

rearrangement process which starts with the breaking <strong>of</strong> a single bond <strong>and</strong> continues as<br />

the defect propagates along a crystal ledge to minimise bond angle distort<strong>ion</strong> <strong>and</strong><br />

47

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