Damage formation and annealing studies of low energy ion implants ...

Damage formation and annealing studies of low energy ion implants ... Damage formation and annealing studies of low energy ion implants ...

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Pulsed lasers can produce rapid heating of the surface layers, with times of 10 -11 to 10 -6 s. This is known as the adiabatic regime, and affects only the near surface. It is possible with pulsed lasers to either regrow the surface region through liquid phase epitaxy or through solid phase epitaxy in the sub melt region (36). In device production it is currently most common to use RTA or SA but as the need for shallower junctions becomes greater, different types of annealing methods, including laser annealing, are being increasingly considered (37). The annealing of ion implanted amorphous Si produces a variety of effects, depending strongly on the initial state of the implanted region. Effects include epitaxial crystallisation, random nucleation and growth, dopant segregation and defect enhanced diffusion, which are described in this chapter. Regrown layers contain fewer defects when the starting point is amorphous Si compared to initially highly damaged layers. 3.3.2 Solid phase epitaxial regrowth (SPER) Solid phase epitaxial regrowth (SPER) is a process whereby amorphised Si is recrystallised upon thermal annealing from temperatures above half that of the melting temperature of the crystal, i.e. for Si from approximately 500 °C, to approximately 1350 °C. The underlying Si crystal acts as a template for the amorphised Si to be arranged upon (epitaxy). This occurs while the Si is still a solid, hence the term solid phase epitaxial regrowth (14, 38, 39). During SPER the amorphous Si rearranges itself on the underlying crystalline substrate starting from the amorphous / crystalline (a/c) interface and proceeds to the surface in a layer-by-layer fashion. Since crystalline Si has lower free energy there is always a driving force towards rearrangement to the crystal structure. During SPER, the implanted dopants take up substitutional lattice sites as the crystal-amorphous interface passes through their location. Time resolved reflectivity (TRR) (38) is the main technique that has been used for measuring SPER rates. It has been observed that impurities (dopants) affect the regrowth behaviour and the rate of SPER. Intrinsic (undoped) Si will be described first and then the addition of impurities is considered. 3.3.2.1 Intrinsic Si It has been shown for intrinsic amorphous layers, produced by self ion implantation, that the regrowth velocity is temperature and orientation dependant. The orientation dependence is related to the density of atomic packing on the different planes. The regrowth rate on (100) Si is approximately 2.5 times greater than (110) Si 43

and is approximately 25 times faster than (111) Si (40). Regrown (111) substrates have been observed to contain high levels of defects compared to (100) and (110) orientated substrates. In this thesis all experiments were carried out on (100) Si. A model for recrystallisation shows that bonds can be broken and reformed to produce the crystalline phase. To be considered a part of the crystal each atom should have at least two undistorted bonds to already aligned atoms of the crystal. For the (100) surface, a single atom can simply attach to any other atom of the crystal but for (110) and (111) planes two and three adjacent atoms, respectively, must attach simultaneously, to atoms of the crystal, which is less probable, accounting for the differences in rate and defects observed (39). The regrowth velocity is also temperature dependent and is shown to follow an Arrhenius type expression. ⎛ E A ⎞ v = v 0 exp⎜− ⎟ (nms ⎝ kT ⎠ -1 ) (3.3) where v is the growth velocity, k is the Boltzmann constant (8.617E-5 eV/K), T the temperature at which regrowth is occurring and EA the activation energy. v0 and EA can both be obtained from a plot of regrowth rates against temperature. Values obtained for intrinsic (100) Si are EA = 2.68 eV, and v0 = 3.07 × 10 15 nms -1 (39), although various studies have produced values for the activation energy from 2.3 to 2.9 eV (41). Doping changes the regrowth rate. For 2 × 10 14 cm -2 As implanted Si, the values for EA and v0 are 2.76 eV and 3.68 × 10 15 respectively (39). Figure 3.6 shows the trend in regrowth rate with temperature for ion implanted Si. Values for (110) and (111) have been inferred from the (100) values. Values for SPER rates of intrinsic and doped Si using equation 3.3 are given in Table 3.1 below. 44

Pulsed lasers can produce rapid heating <strong>of</strong> the surface layers, with times <strong>of</strong> 10 -11<br />

to 10 -6 s. This is known as the adiabatic regime, <strong>and</strong> affects only the near surface. It is<br />

possible with pulsed lasers to either regrow the surface reg<strong>ion</strong> through liquid phase<br />

epitaxy or through solid phase epitaxy in the sub melt reg<strong>ion</strong> (36).<br />

In device product<strong>ion</strong> it is currently most common to use RTA or SA but as the<br />

need for shal<strong>low</strong>er junct<strong>ion</strong>s becomes greater, different types <strong>of</strong> <strong>annealing</strong> methods,<br />

including laser <strong>annealing</strong>, are being increasingly considered (37).<br />

The <strong>annealing</strong> <strong>of</strong> <strong>ion</strong> implanted amorphous Si produces a variety <strong>of</strong> effects,<br />

depending strongly on the initial state <strong>of</strong> the implanted reg<strong>ion</strong>. Effects include epitaxial<br />

crystallisat<strong>ion</strong>, r<strong>and</strong>om nucleat<strong>ion</strong> <strong>and</strong> growth, dopant segregat<strong>ion</strong> <strong>and</strong> defect enhanced<br />

diffus<strong>ion</strong>, which are described in this chapter. Regrown layers contain fewer defects<br />

when the starting point is amorphous Si compared to initially highly damaged layers.<br />

3.3.2 Solid phase epitaxial regrowth (SPER)<br />

Solid phase epitaxial regrowth (SPER) is a process whereby amorphised Si is<br />

recrystallised upon thermal <strong>annealing</strong> from temperatures above half that <strong>of</strong> the melting<br />

temperature <strong>of</strong> the crystal, i.e. for Si from approximately 500 °C, to approximately<br />

1350 °C. The underlying Si crystal acts as a template for the amorphised Si to be<br />

arranged upon (epitaxy). This occurs while the Si is still a solid, hence the term solid<br />

phase epitaxial regrowth (14, 38, 39).<br />

During SPER the amorphous Si rearranges itself on the underlying crystalline<br />

substrate starting from the amorphous / crystalline (a/c) interface <strong>and</strong> proceeds to the<br />

surface in a layer-by-layer fash<strong>ion</strong>. Since crystalline Si has <strong>low</strong>er free <strong>energy</strong> there is<br />

always a driving force towards rearrangement to the crystal structure. During SPER, the<br />

implanted dopants take up substitut<strong>ion</strong>al lattice sites as the crystal-amorphous interface<br />

passes through their locat<strong>ion</strong>. Time resolved reflectivity (TRR) (38) is the main<br />

technique that has been used for measuring SPER rates. It has been observed that<br />

impurities (dopants) affect the regrowth behaviour <strong>and</strong> the rate <strong>of</strong> SPER. Intrinsic<br />

(undoped) Si will be described first <strong>and</strong> then the addit<strong>ion</strong> <strong>of</strong> impurities is considered.<br />

3.3.2.1 Intrinsic Si<br />

It has been shown for intrinsic amorphous layers, produced by self <strong>ion</strong><br />

implantat<strong>ion</strong>, that the regrowth velocity is temperature <strong>and</strong> orientat<strong>ion</strong> dependant. The<br />

orientat<strong>ion</strong> dependence is related to the density <strong>of</strong> atomic packing on the different<br />

planes. The regrowth rate on (100) Si is approximately 2.5 times greater than (110) Si<br />

43

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