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Damage formation and annealing studies of low energy ion implants ...

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Yield (counts per 5 µC)<br />

450<br />

400<br />

350<br />

300<br />

250<br />

200<br />

150<br />

100<br />

50<br />

4500<br />

400<br />

350<br />

300<br />

250<br />

200<br />

150<br />

100<br />

50<br />

60 nm SOI, PAI, 3keV As 1E15 <strong>ion</strong>/cm 2 [111] Blocking direct<strong>ion</strong><br />

25 20 15 10 5 0<br />

O depth<br />

6 4 2 0<br />

Si depth (nm)<br />

a) 550 C<br />

virgin<br />

R<strong>and</strong>om<br />

as-impl<br />

200s<br />

500s<br />

600s<br />

As depth (nm)<br />

14 12 10 8 6 4 2 0<br />

c) 650 C<br />

0<br />

66 68 70 72 74 76 78 80 82 84 86 88 90 92 94<br />

Results from the samples annealed at 600 °C are shown in Figure 6.25b. The<br />

anneal times used, appear to have captured stages in the regrowth process that fol<strong>low</strong> on<br />

from the sample annealed at 550 °C for 600s. The sample annealed for 60 s shows a<br />

pr<strong>of</strong>ile that could be thought to consist <strong>of</strong> different damage reg<strong>ion</strong>s. There is an ~ 7 nm<br />

wide fully amorphous layer beyond which there is reg<strong>ion</strong>, at depth from 7 to 16 nm,<br />

with a high level <strong>of</strong> residual damage, as evidenced by a scattering yield substantially<br />

above the dechannelling level <strong>of</strong> around 75 counts. For the sample annealed for 70 s the<br />

amorphous layer has reduced to ~ 5 nm <strong>and</strong> is accompanied by a considerable, but not<br />

complete, regrowth <strong>of</strong> the residual damage reg<strong>ion</strong> seen with the 60 s anneal. Annealing<br />

for 90 s produces a further reduct<strong>ion</strong> in the width <strong>of</strong> the surface peak <strong>and</strong> a substantial<br />

reduct<strong>ion</strong> in the residual damage. Annealing for 200 s produces an almost completely<br />

regrown layer. Here the addit<strong>ion</strong>al width <strong>of</strong> the Si peak relative to the virgin spectra is<br />

to some extent accounted for by the increased oxide layer thickness. However the height<br />

<strong>of</strong> the Si peak is greater than that <strong>of</strong> the virgin sample suggesting that the layer is still<br />

not quite fully regrown. For this series <strong>of</strong> samples a general sharpening-up <strong>of</strong> the a/c<br />

160<br />

O depth<br />

6 4 2 0<br />

Si depth (nm)<br />

25 20 15 10 5 0<br />

25 20 15 10 5 0<br />

Si depth (nm)<br />

virgin<br />

R<strong>and</strong>om<br />

as-impl<br />

Si depth (nm)<br />

O depth<br />

6 4 2 0<br />

8s<br />

10s<br />

11s<br />

12s<br />

15s<br />

30s<br />

O depth<br />

6 4 2 0<br />

b) 600 C<br />

virgin<br />

R<strong>and</strong>om<br />

as-impl<br />

60s<br />

70s<br />

90s<br />

200s<br />

d) Higher Temp<br />

virgin<br />

R<strong>and</strong>om<br />

as-impl<br />

700C 15s<br />

1050C sp<br />

66 68 70 72 74 76 78 80 82 84 86 88 90 92 94 96<br />

Energy (keV)<br />

25 20 15 10 5 0<br />

As depth (nm)<br />

14 12 10 8 6 4 2 0<br />

As depth (nm) As depth (nm)<br />

14 12 10 8 6 4 2 0<br />

14 12 10 8 6 4 2 0<br />

Figure 6.25 MEIS <strong>energy</strong> spectra from 60 nm SOI samples, pre amorphised with 40 keV Xe<br />

1E14 cm -2 <strong>and</strong> implanted with 3 keV As to 1E15 cm -2 , annealed at a) 550 °C, b) 600 °C, c)<br />

650 °C, <strong>and</strong> d) higher temperatures.

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