Damage formation and annealing studies of low energy ion implants ...
Damage formation and annealing studies of low energy ion implants ... Damage formation and annealing studies of low energy ion implants ...
annealed samples are shown in Figure 6.19. A random spectrum, from an amorphous sample and a spectrum from a virgin Si sample are included in the figure for reference. Approximate depth scales, for scattering off As, Si and O atoms have been added to the figure. Yield (counts per 5 uC) 450 400 350 300 250 200 150 100 50 O depth (nm) 6 4 2 0 3keV As 2E15 ion/cm 2 [111] Blocking direction Si depth (nm) 16 14 12 10 8 6 4 2 0 0 68 70 72 74 76 78 80 82 84 86 88 90 92 94 96 Energy (keV) The spectra of both the Cz and Epi as-implanted samples show that there are no observable differences using MEIS between the Cz or Epi implanted silicon wafers. None are expected in view of the rapid amorphisation rates in Si for As ions. The arsenic peaks coincide and the depths of the back edges of the amorphous layer to are within 0.2 nm. Although the temperatures and times do not follow a systematic isothermal or isochronal series, the different anneals have captured various stages of regrowth along the way to fully regrown crystalline Si. The 550 °C 200 s annealed Si sample has regrown to a depth of ~ 7 nm, and the 600 °C 20 s anneal to a depth of ~ 6 nm. For the samples annealed at 650 °C 10 s and 700 °C 10 s the regrowth process is almost complete. Any minor differences with the previous set of samples (section 6.3.2.2) can be ascribed to small differences between the anneals. 151 As depth (nm) virgin Random Cz as-implanted Cz 550C 200s Cz 600C 20s Cz 650C 10s Cz 700C 10s Epi as-implanted Epi 550C 200s Epi 600C 20s Epi 650C 10s Epi 700C 10s 14 12 10 8 6 4 2 0 Figure 6.19 MEIS energy spectra for the Epi and Cz Si samples, implanted with 3 keV As, asimplanted and following various anneals.
Following annealing it was observed that at the lowest temperatures used, the regrowth was marginally slower in the Epi silicon than the Cz silicon. With the 550 °C Epi sample the depth of the half height of the silicon damage peak is at 7.3 nm, while the Cz sample is ~ 0.4 nm closer to the surface. This behaviour is replicated in the position of the half height of the back edge of the arsenic peaks, which are at the same depth as the corresponding silicon damage layer. A small amount of segregation has occurred, as shown by the additional build-up of arsenic in front of the as-implanted peak, (at a depth of 4 to 7 nm). The 600 °C 20 s anneal also does not produce a fully regrown layer. Here the difference between Cz and Epi silicon appears to be the starkest, with the Epi sample regrown to a depth of 6.4 nm and the Cz has regrown by a further 0.9 nm to a depth of 5.5 nm. This is repeated in a similar fashion for the back edges of the arsenic peak, which appears to be contained within the depth of the silicon damage layer. The higher temperature anneals at 650 °C and 700 °C produce a much better crystal regrowth. All have a silicon surface peak extending to a depth of 3.5 – 3.8 nm. Again the Epi samples are marginally thicker than Cz ones. 6.3.3.2 X-ray Techniques Both the Epi and Cz sample series were studied using combined x-ray scattering methods (18-20). A summary of GI-DXS and SR findings reported in (19, 20), is given. GI-DXS results showed that the EOR region contained point defects, and that the depth of the EOR region is the same for all samples. The signal from the EOR region was weakest in the 700 °C annealed sample. The segregated As peak provides enough electron density to produce an oscillation in the SR spectra for the 650 °C and 700 °C samples in the same way as for the RTA samples described in section 6.2.3.3. However this contrast is weaker than for the spike annealed sample, and does not provide any new information. The results are not presented here. XRD results provide an interesting comparison with MEIS. Before this comparison is made in section 6.3.3.3, the XRD results are briefly summarised. XRD measurements have been carried out on the (004) Bragg peak for both the Epi and Cz series. The two series give very similar results, as was also observed with MEIS. Only the data for the Epi series is shown in Figure 6.20. They show an oscillation with a period getting shorter with increasing annealing temperature. The slope of the intensity is associated with disorder and/or roughness at the a/c interface, while the oscillation is related to the interference between this interface and the EOR defects region. 152
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Fol<strong>low</strong>ing <strong>annealing</strong> it was observed that at the <strong>low</strong>est temperatures used, the<br />
regrowth was marginally s<strong>low</strong>er in the Epi silicon than the Cz silicon. With the 550 °C<br />
Epi sample the depth <strong>of</strong> the half height <strong>of</strong> the silicon damage peak is at 7.3 nm, while<br />
the Cz sample is ~ 0.4 nm closer to the surface. This behaviour is replicated in the<br />
posit<strong>ion</strong> <strong>of</strong> the half height <strong>of</strong> the back edge <strong>of</strong> the arsenic peaks, which are at the same<br />
depth as the corresponding silicon damage layer. A small amount <strong>of</strong> segregat<strong>ion</strong> has<br />
occurred, as shown by the addit<strong>ion</strong>al build-up <strong>of</strong> arsenic in front <strong>of</strong> the as-implanted<br />
peak, (at a depth <strong>of</strong> 4 to 7 nm). The 600 °C 20 s anneal also does not produce a fully<br />
regrown layer. Here the difference between Cz <strong>and</strong> Epi silicon appears to be the starkest,<br />
with the Epi sample regrown to a depth <strong>of</strong> 6.4 nm <strong>and</strong> the Cz has regrown by a further<br />
0.9 nm to a depth <strong>of</strong> 5.5 nm. This is repeated in a similar fash<strong>ion</strong> for the back edges <strong>of</strong><br />
the arsenic peak, which appears to be contained within the depth <strong>of</strong> the silicon damage<br />
layer. The higher temperature anneals at 650 °C <strong>and</strong> 700 °C produce a much better<br />
crystal regrowth. All have a silicon surface peak extending to a depth <strong>of</strong> 3.5 – 3.8 nm.<br />
Again the Epi samples are marginally thicker than Cz ones.<br />
6.3.3.2 X-ray Techniques<br />
Both the Epi <strong>and</strong> Cz sample series were studied using combined x-ray scattering<br />
methods (18-20). A summary <strong>of</strong> GI-DXS <strong>and</strong> SR findings reported in (19, 20), is given.<br />
GI-DXS results showed that the EOR reg<strong>ion</strong> contained point defects, <strong>and</strong> that the depth<br />
<strong>of</strong> the EOR reg<strong>ion</strong> is the same for all samples. The signal from the EOR reg<strong>ion</strong> was<br />
weakest in the 700 °C annealed sample. The segregated As peak provides enough<br />
electron density to produce an oscillat<strong>ion</strong> in the SR spectra for the 650 °C <strong>and</strong> 700 °C<br />
samples in the same way as for the RTA samples described in sect<strong>ion</strong> 6.2.3.3. However<br />
this contrast is weaker than for the spike annealed sample, <strong>and</strong> does not provide any<br />
new in<strong>format<strong>ion</strong></strong>. The results are not presented here.<br />
XRD results provide an interesting comparison with MEIS. Before this<br />
comparison is made in sect<strong>ion</strong> 6.3.3.3, the XRD results are briefly summarised. XRD<br />
measurements have been carried out on the (004) Bragg peak for both the Epi <strong>and</strong> Cz<br />
series. The two series give very similar results, as was also observed with MEIS. Only<br />
the data for the Epi series is shown in Figure 6.20. They show an oscillat<strong>ion</strong> with a<br />
period getting shorter with increasing <strong>annealing</strong> temperature. The slope <strong>of</strong> the intensity<br />
is associated with disorder <strong>and</strong>/or roughness at the a/c interface, while the oscillat<strong>ion</strong> is<br />
related to the interference between this interface <strong>and</strong> the EOR defects reg<strong>ion</strong>.<br />
152