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Damage formation and annealing studies of low energy ion implants ...

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durat<strong>ion</strong>, is observed. MEIS results have shown that the segregated As is located<br />

underneath the oxide layer. Figure 6.8 c) shows the O depth pr<strong>of</strong>iles for the NoPAI<br />

samples. The 0.6 nm increase in the oxide layer width is exactly replicated in the shift in<br />

depths <strong>of</strong> the As peaks <strong>of</strong> Figure 6.8a). It is likely from a simple considerat<strong>ion</strong> <strong>of</strong> the<br />

shape <strong>of</strong> the O peaks that the oxide layer contains some suboxides (15). The back edge<br />

<strong>of</strong> the peak is substantially less steep than the front edge <strong>and</strong> also less steep than the<br />

back edge <strong>of</strong> the corresponding Si peak plotted on the same depth scale in Figure 6.8d).<br />

This result again shows that the segregated As clearly sits underneath the SiO2 layer,<br />

although probably in a reg<strong>ion</strong> <strong>of</strong> some suboxides. The Si is probably distorted around<br />

the segregated As <strong>and</strong> this is reflected in increased backscattering.<br />

6.2.5 BF2 implanted samples<br />

Similar sets <strong>of</strong> experiments have been carried out using BF2 implanted samples.<br />

The regrowth is seen to proceed in the same way. Neither B nor F is visible in MEIS at<br />

the concentrat<strong>ion</strong>s used; therefore the results are not presented here. However a novel<br />

effect involving the interact<strong>ion</strong> between Xe, F <strong>and</strong> the defect structure was identified.<br />

This is the subject <strong>of</strong> chapter 7 <strong>of</strong> this thesis.<br />

6.3 SPER <strong>studies</strong><br />

6.3.1 Introduct<strong>ion</strong><br />

There is interest in <strong>studies</strong> <strong>of</strong> <strong>low</strong> temperature SPER, i.e. ~ 550 °C – 800 °C as<br />

this temperature range has been suggested as a possible solut<strong>ion</strong> for the <strong>format<strong>ion</strong></strong> <strong>of</strong><br />

USJs in the 65 nm <strong>and</strong> 45 nm nodes (1-3). These temperatures are currently not used<br />

due to problems <strong>of</strong> <strong>low</strong>er electrical activat<strong>ion</strong> / solubility <strong>and</strong> a high level <strong>of</strong> defects left<br />

after <strong>annealing</strong>. However the real strength <strong>of</strong> this type <strong>of</strong> <strong>annealing</strong> is less diffus<strong>ion</strong>, as<br />

the results in this sect<strong>ion</strong> will corroborate.<br />

The first part <strong>of</strong> this sect<strong>ion</strong> shows results <strong>of</strong> <strong>annealing</strong> a 3 keV As implanted<br />

wafer. An isothermal <strong>annealing</strong> series at 600 °C <strong>and</strong> an isochronal series for 10 s were<br />

carried out. MEIS results show the same effects as discussed before, i.e. segregat<strong>ion</strong> <strong>of</strong><br />

As, with a fract<strong>ion</strong> <strong>of</strong> As taking up substitut<strong>ion</strong>al posit<strong>ion</strong>s <strong>and</strong> the movement <strong>of</strong> the a/c<br />

crystalline interface towards the surface in a layer by layer fash<strong>ion</strong>. The As<br />

substitut<strong>ion</strong>ality is observed to fol<strong>low</strong> the depth <strong>of</strong> the a/c interface. SIMS<br />

measurements show the same movement <strong>of</strong> As, seen in MEIS, <strong>and</strong> also show that the<br />

As invisible to MEIS is retained <strong>and</strong> importantly does not diffuse deeper into the bulk.<br />

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