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Damage formation and annealing studies of low energy ion implants ...

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Chapter 6 Annealing <strong>studies</strong><br />

6.1 Introduct<strong>ion</strong><br />

In this chapter the results <strong>of</strong> a range <strong>of</strong> <strong>annealing</strong> <strong>studies</strong> are described <strong>and</strong><br />

discussed, most <strong>of</strong> which were carried out within the IMPULSE project <strong>and</strong> as such are<br />

highly relevant to current technologies <strong>and</strong> possible solut<strong>ion</strong>s for future devices. The<br />

<strong>studies</strong> in this chapter fall into three general categories.<br />

The first category in sect<strong>ion</strong> 6.2 focuses on implantat<strong>ion</strong> <strong>and</strong> <strong>annealing</strong><br />

condit<strong>ion</strong>s that are similar to those used in device product<strong>ion</strong>. This is based on<br />

<strong>annealing</strong> predominantly using RTA <strong>and</strong> spike <strong>annealing</strong>, at temperatures above<br />

1000 °C. Comparisons with <strong>low</strong>er temperatures are also included. The effects <strong>of</strong><br />

reduced implant <strong>energy</strong> are discussed. The predominant feature with these condit<strong>ion</strong>s is<br />

that diffus<strong>ion</strong> <strong>of</strong> the dopant will be the limiting factor in reducing the junct<strong>ion</strong> depth.<br />

The second category in this chapter is in sect<strong>ion</strong> 6.3, concerning <strong>studies</strong> <strong>of</strong> SPER<br />

at <strong>low</strong>er <strong>annealing</strong> temperatures, in the reg<strong>ion</strong> <strong>of</strong> 550 °C to 700 °C. This <strong>annealing</strong><br />

range has been identified as a possible solut<strong>ion</strong> for 65 <strong>and</strong> 45 nm nodes, as the problem<br />

<strong>of</strong> diffus<strong>ion</strong> would be minimal (1-3). Note that in the semiconductor industry the<br />

terminology SPER <strong>of</strong>ten refers to <strong>annealing</strong> at <strong>low</strong>er temperatures, approximately 550 –<br />

800 °C. From a physical point <strong>of</strong> view, regrowth at higher temperatures still occurs by<br />

the SPER process but is more commonly referred to as RTA/RTP, spike <strong>annealing</strong>,<br />

flash etc, based on the <strong>annealing</strong> equipment used rather than the physical process that<br />

occur.<br />

The final category, in sect<strong>ion</strong> 6.4, is the regrowth behaviour <strong>of</strong> SOI wafers,<br />

which are currently being implemented in product<strong>ion</strong>. Differences in <strong>annealing</strong><br />

behaviour were observed in SOI compared to bulk Si.<br />

One <strong>of</strong> the features <strong>of</strong> the IMPULSE project was to further develop analytical<br />

techniques for USJ characterisat<strong>ion</strong>. Dispersed throughout this chapter are some <strong>of</strong> the<br />

interesting comparisons with various X-ray techniques carried out at the ESRF. As well<br />

as providing addit<strong>ion</strong>al in<strong>format<strong>ion</strong></strong> on the samples, these highlight the potential <strong>of</strong> these<br />

techniques for future <strong>studies</strong>.<br />

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