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Damage formation and annealing studies of low energy ion implants ...

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acquired were converted into damage depth distribut<strong>ion</strong>s in terms <strong>of</strong> number <strong>of</strong><br />

displaced Si atoms or dopant atoms cm -3 , using a st<strong>and</strong>ard calibrat<strong>ion</strong> procedure (22).<br />

The backscattered <strong>ion</strong> yield was referenced to the r<strong>and</strong>om level measured on a Si<br />

sample, amorphised by high dose self <strong>ion</strong> bombardment. In addit<strong>ion</strong> the <strong>energy</strong> scales<br />

were converted into depth scales using established inelastic <strong>energy</strong> loss data (23) <strong>and</strong><br />

applying the surface approximat<strong>ion</strong> (22, 24). Implanted As / Sb <strong>and</strong> displaced Si<br />

distribut<strong>ion</strong>s can be detected down to levels <strong>of</strong> ~ 1 × 10 19 cm -3 <strong>and</strong> 10 21 cm -3 ,<br />

respectively.<br />

Addit<strong>ion</strong>al SIMS As pr<strong>of</strong>iles were obtained in an Atomika 4500 instrument at<br />

IMEC using a 0.5 keV 02 + primary beam at normal incidence. In these measurements a<br />

crater size <strong>of</strong> 250 µm was used <strong>and</strong> mass Si 30 was monitored to ensure a better than 1%<br />

current stability. Depth scale calibrat<strong>ion</strong> relied on a constant <strong>ion</strong> beam current <strong>and</strong> was<br />

performed using the eros<strong>ion</strong> rate obtained on one deep crater in combinat<strong>ion</strong> the eros<strong>ion</strong><br />

time for each crater. Relative sensitivity factors (RSF, from implant st<strong>and</strong>ard) were<br />

repeatable within 1%.<br />

5.3 Results <strong>and</strong> discuss<strong>ion</strong><br />

Considering first the damage evolut<strong>ion</strong> during As <strong>ion</strong> bombardment, a series <strong>of</strong><br />

Si samples was implanted through the native oxide with 2.5 keV As <strong>ion</strong>s to doses<br />

ranging from 3 × 10 13 to 1.8 × 10 15 cm -2 . The dose dependence <strong>of</strong> the MEIS spectra<br />

obtained for these samples is shown in Figure 5.1. Peaks resulting from the As implant,<br />

the displaced Si atoms <strong>and</strong> the oxide, respectively, are indicated in the figure. For<br />

comparison Figure 5.1 also contains the spectrum for a virgin Si sample as well as a<br />

r<strong>and</strong>om spectrum. The virgin Si sample shows two peaks due to scattering <strong>of</strong>f Si (edge<br />

at 171 keV) <strong>and</strong> O atoms (edge at 153 keV) both contained in the native oxide. The<br />

thickness <strong>of</strong> the native oxide thickness is calculated as ~1.5 nm. It should be noted<br />

however that in the case <strong>of</strong> the Si peak there is also a contribut<strong>ion</strong> from disordered Si<br />

atoms at the oxide / Si interface (19, 25). The virgin spectrum is the base against which<br />

any addit<strong>ion</strong>al backscattering from displaced Si atoms that results from the As implant<br />

is measured. The figure shows the changes in the <strong>energy</strong> spectrum in terms <strong>of</strong> the<br />

growth <strong>of</strong> the As <strong>and</strong> Si scattering peaks for increasing As implant dose. It is seen that<br />

the Si damage peak <strong>and</strong> also the As peak, spread towards <strong>low</strong>er energies, i.e. greater<br />

depths, although the movement <strong>of</strong> the latter is less pronounced.<br />

107

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