Damage formation and annealing studies of low energy ion implants ...
Damage formation and annealing studies of low energy ion implants ... Damage formation and annealing studies of low energy ion implants ...
emain at the extract ion energy throughout the entire length of the beam line for higher energy implants. This is called the drift mode. The UHV part of the system comprises of the target chamber, a sample preparation chamber, and a loadlock chamber which can be quickly vented to air allow the vacuum in the target chamber to be maintained while allowing fast transfer of samples. Silicon samples of up to 12 × 12 mm are mounted into sample holders, and are transported between chambers by transfer rods. The preparation chamber and the loadlock both contain a carousel for storing up to six samples. The target chamber is also equipped with X-ray gun, electron gun and electron energy analyser for in situ XPS and AES analysis. Figure 4.23 – Salford ultra low energy ion beam system. 4.5.2 Annealing equipment Most samples were annealed in a lamp based RTP system. Halogen lamps mounted above and below were capable of producing ramp rates of typically 25 – 70 °Cs -1 Wafers were mounted on a quartz holder. For samples annealed at Salford, small samples were placed onto an 8" wafer in the annealer. Samples were annealed in 101
an N2/O2 environment to maintain an oxide layer to prevent dopant loss. This resulted in some oxide growth for certain annealing conditions. References 1 J.F. Van der Veen, Surf. Sci. Rep., 5, Nos. 5/6, 1985. 2 R.M. Tromp, Medium Energy Ion Scattering. In: Briggs D. and Seah P. editors. Practical surface analysis. Volume 2 – Ion and Neutral Spectroscopy. 2nd ed. John Wiley Ltd. 1992. 3 http://www.dl.ac.uk/MEIS/ (accessed 11/2/06). 4 Backscattering Spectrometry, W. K. Chu, J. W. Mayer, M. Nicolet, Academic Press, New York, 1978. 5 Fundamentals of surface and thin film analysis, L.C. Feldman, J. Mayer, North- Holland, 1986. 6 Methods of Surface Analysis. Techniques and Applications. Edited by J.M. Walls. Cambridge University Press, 1989. 7 L.J. van der Pauw. Philips Tech. Rev. Vol 20, (1958), p220. 8 Electronic Materials Science For Integrated Circuits in Si and GaAs. J.W. Mayer, S.S. Lau. Macmillian Publishing Company, 1990. 9 L. Capello, PhD thesis. Structural investigation of silicon after ion-implantation using combined x-ray scattering methods. University of Lyon (France) and Torino (Italy), 2005. 10 http://www.esrf.fr/UsersAndScience/Experiments/SurfaceScience/ID01/ (accessed 11/2/06). 11 R. D. Goldberg, D. G. Armour, J. A. van den Berg, N. Knorr, H. Ohno, S. Whelan, S. Zhang, C. E. A. Cook, and M. A. Foad, Rev. Sci. Instr. 71 (2) (2000) 1032 12 http://www.appliedmaterials.com/products/Quantum.html?menuID=1_10_1 (accessed 11/2/06). 13 P. Bailey, T.C.Q. Noakes, C.J. Baddeley, S.P.Tear, D.P.Woodruff, Nucl. Instr. and Meth. B 183 (2001) 62. 14 M. Copel, R.M. Tromp. Surface. Sci. Lett. 337 (1995) L773. 15 D.P.Woodruff, D. Brown, P.D. Quinn, T.C.Q. Noakes, P. Bailey. Nucl. Instr. and Meth. B 183 (2001) 128. 16 T. Gustafsson, H.C. Lu, B.W. Busch, W.H. Schulte, E. Garfunkel. Nucl. Instr. and Meth. B 183 (2001) 146. 102
- Page 69 and 70: Category I defects are produced whe
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emain at the extract <strong>ion</strong> <strong>energy</strong> throughout the entire length <strong>of</strong> the beam line for higher<br />
<strong>energy</strong> <strong>implants</strong>. This is called the drift mode.<br />
The UHV part <strong>of</strong> the system comprises <strong>of</strong> the target chamber, a sample<br />
preparat<strong>ion</strong> chamber, <strong>and</strong> a loadlock chamber which can be quickly vented to air al<strong>low</strong><br />
the vacuum in the target chamber to be maintained while al<strong>low</strong>ing fast transfer <strong>of</strong><br />
samples. Silicon samples <strong>of</strong> up to 12 × 12 mm are mounted into sample holders, <strong>and</strong> are<br />
transported between chambers by transfer rods. The preparat<strong>ion</strong> chamber <strong>and</strong> the<br />
loadlock both contain a carousel for storing up to six samples. The target chamber is<br />
also equipped with X-ray gun, electron gun <strong>and</strong> electron <strong>energy</strong> analyser for in situ XPS<br />
<strong>and</strong> AES analysis.<br />
Figure 4.23 – Salford ultra <strong>low</strong> <strong>energy</strong> <strong>ion</strong> beam system.<br />
4.5.2 Annealing equipment<br />
Most samples were annealed in a lamp based RTP system. Halogen lamps<br />
mounted above <strong>and</strong> be<strong>low</strong> were capable <strong>of</strong> producing ramp rates <strong>of</strong> typically 25 –<br />
70 °Cs -1 Wafers were mounted on a quartz holder. For samples annealed at Salford,<br />
small samples were placed onto an 8" wafer in the annealer. Samples were annealed in<br />
101