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Damage formation and annealing studies of low energy ion implants ...

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Figure 6.10 MEIS <strong>energy</strong> spectra for 3 keV As <strong>implants</strong>, as-implanted <strong>and</strong> after<br />

<strong>annealing</strong> at 600 °C for various times. A r<strong>and</strong>om spectrum from an<br />

amorphous sample is included in the figure. Depth scales have been<br />

added to indicate scattering <strong>of</strong>f As <strong>and</strong> Si atoms.<br />

Figure 6.11 MEIS Si depth pr<strong>of</strong>iles (top), As depth pr<strong>of</strong>iles (bottom) <strong>and</strong><br />

approximate regrowth rates (centre).<br />

Figure 6.12 As, Si <strong>and</strong> O depth pr<strong>of</strong>iles for the 3 keV As implanted samples, asimplanted<br />

<strong>and</strong> fol<strong>low</strong>ing 600 °C <strong>annealing</strong> for different durat<strong>ion</strong>s.<br />

Figure 6.13 SIMS results for samples annealed at 600 °C for different durat<strong>ion</strong>s.<br />

Figure 6.14 Sheet resistance <strong>and</strong> activated dose for a 600 °C anneal with different<br />

anneal durat<strong>ion</strong>s.<br />

Figure 6.15 100keV He MEIS <strong>energy</strong> spectra for the [111] blocking direct<strong>ion</strong>, for<br />

3keV As 2E15 implanted samples annealed for 10s at 600 °C, 650 °C,<br />

<strong>and</strong> 700 °C.<br />

Figure 6.16 0.5 keV Cs + SIMS As depth pr<strong>of</strong>iles for the 3 keV implanted samples<br />

annealed for 10s at 600 °C, 650 °C <strong>and</strong> 700 °C.<br />

Figure 6.17 MEIS <strong>and</strong> SIMS combined depth pr<strong>of</strong>iles.<br />

Figure 6.18 Sheet resistance <strong>and</strong> activated dose for 10 s <strong>annealing</strong> at different anneal<br />

temperatures.<br />

Figure 6.19 MEIS <strong>energy</strong> spectra for the Epi <strong>and</strong> Cz Si samples, implanted with 3<br />

keV As, as-implanted <strong>and</strong> fol<strong>low</strong>ing various anneals.<br />

Figure 6.20 Radial scan through (004) Bragg reflect<strong>ion</strong> for the Epi series <strong>and</strong> a virgin<br />

sample.<br />

Figure 6.21 a) Lattice parameter strain pr<strong>of</strong>ile in the growth direct<strong>ion</strong> resulting from<br />

the best fit. b) Static disorder depth pr<strong>of</strong>ile resulting from the best fit.<br />

Figure 6.22 Thickness <strong>of</strong> the regrown layer: comparison between MEIS <strong>and</strong> XRD<br />

results. The constant <strong>of</strong>f-set is due to the different definit<strong>ion</strong>s <strong>of</strong> the start<br />

<strong>and</strong> points for the two techniques.<br />

Figure 6.23 Comparison <strong>of</strong> MEIS depth pr<strong>of</strong>iles, with the strain pr<strong>of</strong>ile from XRD<br />

after rescaling <strong>of</strong> the depth.<br />

Figure 6.24 MEIS <strong>energy</strong> spectra from bulk Si, 60 nm SOI <strong>and</strong> 100 nm SOI samples,<br />

implanted with 3 keV As to a dose <strong>of</strong> 2E15 <strong>ion</strong>s/cm 2 , as-implanted <strong>and</strong><br />

fol<strong>low</strong>ing <strong>annealing</strong> at 600 °C for 30s.<br />

Figure 6.25 MEIS <strong>energy</strong> spectra from 60 nm SOI samples, pre amorphised with 40<br />

keV Xe 1E14 cm -2 <strong>and</strong> implanted with 3 keV As to 1E15 cm -2 , annealed<br />

at a) 550 °C, b) 600 °C, c) 650 °C, <strong>and</strong> d) higher temperatures.<br />

xi

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