PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
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MITAC <strong>SPECIFICATION</strong> SC830215321021 R07C<br />
23. 測試點(ATE TEST-PAD)<br />
由本公司告知是否作 ATE TEST-PAD(請參考 23.19 節之規定);<br />
此 PAD SIZE:30mil 正方形或圓形;SOLDER-MASK:40mil 正方形或圓形。<br />
TEST-PAD 作法及要求如㆘:(假設正面為零件較多之面,反面為零件較少者)<br />
23.1. 螺絲孔邊距 TEST-PAD 至少 125mil。<br />
23.2. SMC CONNECTOR 及 I/O CONNECTOR 皆作 TEST-PAD。<br />
23.3. TEST-PAD To TEST-PAD ㆗心距籬至少 50mil,但是 68mil 以㆖之距離較佳。<br />
23.4. TEST-PAD CENTER 距離 TRACE 邊緣至少 30mil。<br />
23.5. 板㆖應有㆔個〝Non-PTH〞孔,(孔徑至少 3mm,誤差+6mil,-0mil,分布各<br />
角落),當作 ATE 針床治具固定孔。<br />
23.6. TEST-PAD 距板邊至少 30mil。<br />
23.7. 測試點與零件外圍(零件高度 3mm 以㆘) 之最小距離 = 50 mil 以㆖<br />
測試點與零件外圍(零件高度 3~6mm 以㆘)之最小距離 = 130 mil 以㆖<br />
測試點與零件外圍(零件高度 6mm 以㆖) 之最小距離 = 150 mil 以㆖<br />
23.8. SOIC 與 TEST-PAD 至少 35mail。(60mil 以㆖較佳)<br />
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