PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
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MITAC <strong>SPECIFICATION</strong> SC830215321021 R07C<br />
16. 金手指(GOLD FINGER)<br />
16.1. 本公司如有要求金手指作導線時,該導線應延伸至板子邊。<br />
SOLDER MASK<br />
30mil <br />
4mil<br />
<br />
<br />
<br />
<br />
<br />
<br />
線寬 125mil,延伸至板邊<br />
線寬 15mil<br />
<br />
--35--<br />
VIA<br />
外框範圍<br />
0.2〞〜0.3〞<br />
16.2. 金手指應作 SOLDER MASK,其每㆒單邊應比金手指邊緣大 3mil。<br />
16.3. 金手指㆖方之 VIA PAD 與金手指之距離不得小於 30mil,但若該 VIA 與金手<br />
指相接通時,VIA PAD 與金手指距離至少 15mil。<br />
17. 加工孔(TOOLING HOLE)<br />
17.1. 為配合自動插件設備,板子㆕周必須作 TOOLING HOLE,位置皆應標示於<br />
FAB. DWG.㆖,正常情況㆘,TOOLING HOLE ㆗心距板邊為 0.197〞<br />
(5mm),NON-PTH 孔。
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