PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
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MITAC <strong>SPECIFICATION</strong> SC830215321021 R07C<br />
14.5. POSITIVE LAYER 之寬錫面㆖若作 SOLDER MASK 時,其每㆒單邊應比錫<br />
面大 3mil。<br />
--32--<br />
3mil<br />
SOLDER<br />
MASK<br />
寬錫面<br />
14.6. 正常情況㆘之所有 VIA HOLE 均不作 SOLDER MASK(VIA HOLE 均蓋㆖<br />
防銲漆),當作 ATE TEST-PAD 之 SOLDER-MASK 請參閱 23 節。<br />
15. 文字面(SILK SCREEN)<br />
15.1. 文字圖㆒般以零件面為準,如雙面置放零件時,銲錫面亦必須作文字圖。<br />
15.2. 文字面之符號,圖形及文字之線條寬度 6〜10mil。<br />
15.3. 各零件之圖形應儘量符合該零件之外形,並於第㆒腳處應有清礎之識別記<br />
號。<br />
15.4. 文字之大小規定如㆘:<br />
長度:50mil〜90mil,以 70mil 較適合。<br />
寬度:40mil〜70mil,以 55mil 較適合。
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