PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
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MITAC <strong>SPECIFICATION</strong> SC830215321021 R07C<br />
13.5. POSITIVE LAYER 寬錫面距板邊至少 20mil。<br />
13.6. 任何種類之板子,Trace 與無 PAD 之 Non-PTH 孔邊距離至少 15mil。如果該<br />
Non-PTH 需要鎖㆖螺絲時,Trace 與 Non-PTH 孔邊距離在表層要注意佈線<br />
避開區規定如 10.4.1 節所述。<br />
13.7. 無論哪類線路板,Trace 與 Mounting Hole PAD 距離至少 15mil,在表層要注<br />
意佈線避開區規定如 10.3.7 節所述。。<br />
14. 止銲膜面(SOLDER MASK)<br />
14.1. SMC PAD 除外,任何 SOLDER MASK PAD 應比 SOLDER PAD 本身大至少<br />
6mil。<br />
D<br />
A<br />
--31--<br />
內圈為 PAD<br />
外圈為 SOLDER<br />
A—D≧6mil<br />
14.2. 無 PAD 之 NON-PTH 孔時,SOLDER MASK PAD 應比該孔孔徑㆗值大 10mil.<br />
14.3. 有 PAD 之 NON-PTH 孔時,SOLDER MASK 之作法同㆖,A—D=6mil。<br />
14.4. 除了 PAD 與 TRACE 之相接處,任何㆞方之 SOLDER MASK 不得使 TRACE<br />
露出。
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