PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
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MITAC <strong>SPECIFICATION</strong> SC830215321021 R07C<br />
A<br />
0.05〞<br />
PAD 大小‥0.025〞X0.075/0.120〞<br />
SOLDER MASK‥0.035〞X 0.085/0.130〞<br />
包裝型式及腳數 A PAD SIZE<br />
JEDEC,SOIC,8,14,16PIN 0.21〞 0.025X0.075〞<br />
JEDEC,SOL,16,20,24PIN 0.38〞 0.025X0.075〞<br />
EIAJ,8,14,16,20,24PIN 0.28〞 0.025X0.075〞<br />
JEDEC與EIAJ共用,8,14,16PIN 0.24〞 0.025X0.120〞<br />
JEDEC與EIAJ共用,20,24PIN 0.33〞 0.025X0.120〞<br />
10.6.3.2. 其他 Gull Wing SMT PAD Design 設計原則:<br />
<br />
<br />
B<br />
E<br />
L<br />
B<br />
B≧2A 或 B≧15 兩者取大值者。<br />
L=E+2B<br />
D= C<br />
, W=C+2D<br />
5<br />
A<br />
--23--<br />
C<br />
<br />
<br />
D D<br />
10.6.3.3. 無鉛製程之設計:原則㆖,㆖述公式之 B 值設定為 0.020〞較適當。Stencil<br />
Design 則可以再比 PAD 向外長約 0.004〞。<br />
10.6.3.4. 在腳距為 0.5mm 以㆘之 SOIC(SOP)包裝,於無鉛製程時應於端點 PAD<br />
加寬原來之㆒半寬度,如㆘圖示:<br />
W
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