PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
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MITAC <strong>SPECIFICATION</strong> SC830215321021 R07C<br />
目 錄 (CONTENTS)<br />
1. 目的(SCOPE) ................................................................................................................ 3<br />
2. 參考文件(APPLICABLE DOCUMENTS) .................................................................. 4<br />
3. 資料提供(INFORMATIONS SUPPLYING) ................................................................ 4<br />
4. 通則(GENERAL RULES) ............................................................................................ 5<br />
5. 術語解釋(TERMS)............................................................................................................. 5<br />
6. 外型線規定(BOARD OUTLINE) ................................................................................ 6<br />
7. 定位靶(TARGET) ....................................................................................................... 10<br />
8. 各層圖面(LAYERING) .............................................................................................. 12<br />
9. PAGE 表格(PAGE FORM) ......................................................................................... 12<br />
10. 銲墊(PAD)................................................................................................................... 15<br />
11. 零件腳距(PIN LEAD PITCHES) ............................................................................... 28<br />
12. 線寬(TRACE WIDTH) ............................................................................................... 29<br />
13. 間距(SPACING).......................................................................................................... 30<br />
14. 止銲膜面(SOLDER MASK) ...................................................................................... 31<br />
15. 文字面(SILK SCREEN) ............................................................................................. 32<br />
16. 金手指(GOLD FINGER)............................................................................................ 35<br />
17. 加工孔(TOOLING HOLE) ......................................................................................... 35<br />
18. 基準點(FIDUCIAL MARK)- SMC 板適用 ............................................................... 37<br />
19. 標記(LABELING)....................................................................................................... 39<br />
20. 鑽孔圖(DRILL TEMPLATE) ..................................................................................... 41<br />
21. 零件佈置注意事項(PLACEMENT NOTES).................................................................. 42<br />
22. 佈線注意事項(ROUTING NOTES)........................................................................... 46<br />
23. 測試點(ATE TEST-PAD)............................................................................................ 48<br />
24. FILE OUTPUT ................................................................................................................. 51<br />
25. 附錄 A--MITAC APERTURE LIST................................................................................. 52<br />
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