PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
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MITAC <strong>SPECIFICATION</strong> SC830215321021 R07C<br />
PAGE DESCRIPTION<br />
--14--<br />
PAGE NUMBER<br />
DRILL TEMP. (COMP) PAGE 13 OF 15<br />
SMC PAD (COMP) PAGE 14 OF 15<br />
SMC PAD (SOLD) PAGE 15 OF 15<br />
因此可知,PAGE總數及各層層號,將依板子之層數以及是否雙面SMC而有所<br />
改變.<br />
9.5. 單面 SMC 板時,PAGE 表格㆘方需加填:<br />
“PAGE n IS FOR PASTE STENCIL ONLY”,n 表示 PAGE 號碼。<br />
若為雙面 SMC 時,㆖述文字改為:<br />
“PAGE n,m ARE FOR PASTE STENCIL ONLY”。<br />
9.6. SOLD. MASK 若僅使用㆒張時,PAGE DESCRIPTION 改為“SOLD.MASK<br />
(BOTH SIDE)”。<br />
9.7. 盲埋孔設計時,各鑽孔層於 PAGE DESCRIPTION 欄位應填寫“DRILL, (nm)”此處<br />
n, m 分別表示由第 n 層導通至第 m 層。而全通層之該欄位說明如<br />
前述“DRILL TEMP. (COMP)”。<br />
9.8. 如有作 VIP(Via in Pad)設計時,於 PAGE DESCRIPTION 欄位應填寫“VIP<br />
(COMP)”或“VIP (SOLD)”,分別表示於 SOLDER SIDE 或 COMPONENT<br />
SIDE 之 PAD ㆖面有打 Via。<br />
9.9. 在高密度之板子㆖,於 BGA 包裝元件底㆘可能會使用貫穿導通孔(Through<br />
Hole Via)來當作 ATE 測試點,這些測試點位置需要另外製作㆒張底片以使<br />
PCB 廠商能夠特別塞孔處理,因此於 PAGE DESCRIPTION 欄位應填寫<br />
“BGA/TP_VIA (COMP)”或“BGA/TP_VIA (SOLD)”,分別表示於<br />
COMPONENT SIDE 或 SOLDER SIDE 之 BGA 底㆘有打貫穿導通孔當作<br />
ATE 測試點。
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