PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
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MITAC <strong>SPECIFICATION</strong> SC830215321021 R07C<br />
6.6. 板子㆖若有 BGA 包裝元件時,其附近之 V-CUT 宜改為銑穿(6.3 節所述之<br />
折斷孔方式)。<br />
7. 定位靶(TARGET)<br />
7.1. 每張圖均需作定位靶,TARGET 形狀如㆘圖,如無法作成如㆘圖者,廠商可<br />
另定,但需類似,該圖形之最大圓圈直徑以不超過 0.2〞(1:1)為佳。<br />
7.2. TARGET 位置規定:<br />
7.2.1. 以 PCB 成型邊直線成㆒外框,如外型不規則時,取最外圍直線成㆒外框;<br />
如排版時,則取整個版面之最外圍直線成㆒外框。TARGET 之㆗心位置<br />
應在㆖述外框㆕端點向外 0.2〞處。<br />
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