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BULETINUL INSTITUTULUI POLITEHNIC DIN IAŞI<br />

Publicat de<br />

<strong>Universitatea</strong> <strong>Tehnică</strong> „Gheorghe Asachi“ <strong>din</strong> Iaşi,<br />

Tomul LVIII (LXII), Fasc. 4, 2012<br />

Secţia<br />

CONSTRUCŢII DE MAŞINI<br />

THERMAL PROPERTIES OF POLYSTYRENE/CARBON<br />

NANOTUBES COMPOSITES PREPARED BY SHEAR CASTING<br />

BY<br />

RĂZVAN FLORIN BARZIC ∗1 , IULIANA STOICA 2 ,<br />

ANDREEA IRINA BARZIC 2 and GHEORGHE DUMITRAŞCU 1<br />

1 “Gheorghe Asachi” Technical University of Iaşi,<br />

Faculty of Mechanics<br />

2 “Petru Poni”Institute of Macromolecular Chemistry, Iaşi<br />

Received: November 10, 2012<br />

Accepted for publication: November 30, 2012<br />

Abstract. The polystyrene/carbon nanotubes (PS/CNT) composite films are<br />

obtained by a simple solution dispersion procedure. The carbon-based nanofillers<br />

are dispersed in methylene chloride, and PS/CNT composites are prepared by<br />

mixing PS/methylene chloride solution with CNT/methylene chloride dispersion,<br />

homogenized by ultrasonication. The correspon<strong>din</strong>g films are characterized by<br />

atomic force microscopy (AFM) technique in order to evaluate the morphology<br />

developed by the resulted system. The thermal conductivity of these materials is<br />

estimated by considering it as an additive function of the PS and CNT<br />

compositions. The obtained results indicate that the studied nanocomposites<br />

exhibit high heat transfer – suitable for protecting chips of overheating in power<br />

electronics.<br />

Key words: thermal conductivity, polymer, carbon nanotubes.<br />

1. Introduction<br />

Thermally conductive polymer composites offer new possibilities for<br />

replacing metal parts in several applications, inclu<strong>din</strong>g power electronics,<br />

electric motors and generators, heat exchangers, thanks to the polymer<br />

advantages such as light weight, corrosion resistance and ease of processing.<br />

∗ Correspon<strong>din</strong>g author: e-mail: barzicrazvan@tuiasi.ro, gdum@tuiasi.ro

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