Design specific variation in pattern transfer by via/contact etch ...
Design specific variation in pattern transfer by via/contact etch ...
Design specific variation in pattern transfer by via/contact etch ...
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Bias Map<br />
<strong>Design</strong><br />
� Normalized CD Bias :<br />
Area 1-2:<br />
Area 4:<br />
Area 5:<br />
Etch CD Bias Prediction<br />
∆<br />
n<br />
CDBott<br />
− CD<br />
=<br />
CD<br />
Area 4<br />
BARC.<br />
o<br />
BARC<br />
. o<br />
γ CF γ CF 2 γ CF 3<br />
= { α0<br />
+ α1γ<br />
F[<br />
1−α<br />
2(<br />
1−<br />
α3D)]}[<br />
β0<br />
+ β1(<br />
) + β2<br />
( ) + β3(<br />
) ] −1<br />
γ γ γ<br />
� Bias is represented <strong>in</strong> terms of CD BARC.o_predicted .<br />
� Large bias is expected <strong>in</strong> RED regions, and could become hot<br />
spots.<br />
� 12x12 <strong>via</strong> blocks (area 1-2 vs. area 5) : Long range<br />
microload<strong>in</strong>g may lead to different level of bias maps<br />
although these two <strong>pattern</strong>s are locally identical.<br />
Area 1-2 Area 5<br />
F<br />
Copyright ©2008, Mentor Graphics.<br />
F<br />
F<br />
∆ n ≤ -0.2<br />
∆ n = 0<br />
∆ n ≥ 0.1