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Design specific variation in pattern transfer by via/contact etch ...

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Bias Map<br />

<strong>Design</strong><br />

� Normalized CD Bias :<br />

Area 1-2:<br />

Area 4:<br />

Area 5:<br />

Etch CD Bias Prediction<br />

∆<br />

n<br />

CDBott<br />

− CD<br />

=<br />

CD<br />

Area 4<br />

BARC.<br />

o<br />

BARC<br />

. o<br />

γ CF γ CF 2 γ CF 3<br />

= { α0<br />

+ α1γ<br />

F[<br />

1−α<br />

2(<br />

1−<br />

α3D)]}[<br />

β0<br />

+ β1(<br />

) + β2<br />

( ) + β3(<br />

) ] −1<br />

γ γ γ<br />

� Bias is represented <strong>in</strong> terms of CD BARC.o_predicted .<br />

� Large bias is expected <strong>in</strong> RED regions, and could become hot<br />

spots.<br />

� 12x12 <strong>via</strong> blocks (area 1-2 vs. area 5) : Long range<br />

microload<strong>in</strong>g may lead to different level of bias maps<br />

although these two <strong>pattern</strong>s are locally identical.<br />

Area 1-2 Area 5<br />

F<br />

Copyright ©2008, Mentor Graphics.<br />

F<br />

F<br />

∆ n ≤ -0.2<br />

∆ n = 0<br />

∆ n ≥ 0.1

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