Design specific variation in pattern transfer by via/contact etch ...
Design specific variation in pattern transfer by via/contact etch ... Design specific variation in pattern transfer by via/contact etch ...
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28.02.2013
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Non-etchable Non suppressed Includes all area Pattern Density & Radical Fluxes Maps Density CF2 flux F flux Copyright ©2008, Mentor Graphics.
CF2 flux F flux SEMbar (1) in all01 Flux Distributions SEMbar (2) in all01 SEMbar isolated Copyright ©2008, Mentor Graphics.
- Page 1 and 2: Design Design Design specific speci
- Page 3 and 4: Etch Step in Pattern Transfer Simul
- Page 5 and 6: Effects of Aspect Ratio & Microload
- Page 7 and 8: • Neutral radical generation •
- Page 9 and 10: Mass-balance Differential equation
- Page 11 and 12: Radical Flux to the Feature � Whe
- Page 13 and 14: Die-level analysis: Calculation of
- Page 15 and 16: Thin & Thick Polymer Regimes T. Tat
- Page 17 and 18: Approximation of “Thin Polymer”
- Page 19 and 20: Etch Stop Condition � Etch stops
- Page 21 and 22: VCE Input/Output Copyright ©2008,
- Page 23 and 24: Calculation of Gas Kinetic Paramete
- Page 25 and 26: Calibration Methodology � The maj
- Page 27 and 28: VCE Capability Based on accurate ca
- Page 29 and 30: VCE Capability Across-die etch hot-
- Page 31 and 32: APPLICATIONS of VCE Copyright ©200
- Page 33 and 34: Process-Aware Design Optimization v
- Page 35 and 36: Process optimization • VCE predic
- Page 37 and 38: F Concentration, mass fraction Redu
- Page 39 and 40: Averaged pattern density R=1000µm
- Page 41: OBSERVATION: FIB inspection of 0.26
- Page 45 and 46: Calibration/Prediction - Resist Mod
- Page 47 and 48: Calibration/Prediction - Main Etch
- Page 49: Mentor Graphics Corp., San Jose, CA
Non-<strong>etch</strong>able Non suppressed<br />
Includes all area<br />
Pattern Density & Radical Fluxes Maps<br />
Density<br />
CF2 flux F flux<br />
Copyright ©2008, Mentor Graphics.
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