Design specific variation in pattern transfer by via/contact etch ...
Design specific variation in pattern transfer by via/contact etch ...
Design specific variation in pattern transfer by via/contact etch ...
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<strong>Design</strong> optimization <strong>by</strong> means of dummy <strong>via</strong><br />
<strong>in</strong>sertion<br />
VCE predicts bottom<br />
CD <strong>variation</strong> through<br />
the entire chip:<br />
�� Before dummy<br />
placement<br />
� After dummy<br />
placement<br />
CD Map<br />
No dummy fill With dummy fill<br />
∆ Max – ∆ M<strong>in</strong> :<br />
no-fill / fill =<br />
1.32<br />
CD map full range = 6e -3<br />
Copyright ©2008, Mentor Graphics.<br />
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