Design specific variation in pattern transfer by via/contact etch ...
Design specific variation in pattern transfer by via/contact etch ...
Design specific variation in pattern transfer by via/contact etch ...
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Process-Aware <strong>Design</strong> Optimization vs.<br />
<strong>Design</strong>-Aware Process Optimization<br />
Upon completion of the hot spot check the follow<strong>in</strong>g correction<br />
actions can be undertaken:<br />
DESIGN PROCESS<br />
• Intelligent dummy-fill<br />
• Mask correction at the MDP stage<br />
• Tun<strong>in</strong>g the process parameters<br />
• Modification of the process<strong>in</strong>g gas<br />
composition<br />
Copyright ©2008, Mentor Graphics.<br />
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