Design specific variation in pattern transfer by via/contact etch ...
Design specific variation in pattern transfer by via/contact etch ...
Design specific variation in pattern transfer by via/contact etch ...
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Hot-spot check: Bottom CD <strong>variation</strong><br />
� VCE calibrates the bottom CD<br />
model based on the customer<br />
provided measurements of postlitho<br />
top CD and post-<strong>etch</strong> bottom<br />
CD for a number of features<br />
�� VCE predicts bottom CD<br />
<strong>variation</strong> through the entire chip<br />
78.00<br />
76.00<br />
74.00<br />
72.00<br />
70.00<br />
68.00<br />
1 3 5 7 9 11 13 15 17<br />
Measured values<br />
(plotted <strong>by</strong> diamonds)<br />
and calculated values<br />
(squares) of <strong>via</strong>s with<br />
top diameter of 67 nm<br />
(as-designed)<br />
77<br />
76<br />
75<br />
74<br />
73<br />
y = 0.6716x + 24.4<br />
R 2 = 0.6722<br />
72<br />
70.00 72.00 74.00 76.00 78.00<br />
Copyright ©2008, Mentor Graphics.<br />
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