Cooling IGBT Modules with VDF - Parker

Cooling IGBT Modules with VDF - Parker Cooling IGBT Modules with VDF - Parker

28.02.2013 Views

Test Bed and Conditions • IGBT Modules tested are dual 1700V, 450A in the 122mm x 62mm EconoDUAL package. • Three modules are used in one mechanical assembly and can be configured as either: • Three-phase bridge • Single dual switch, operating in parallel. • Functional modules for system testing: • Supplied as production modules but without internal protective gel; • Painted for improved emissivity; • Die temperatures measured with thermal camera. • Maximum module load measured for each type of heat sink or cold plate to produce an IGBT junction temperature (T J ) of 120°C. • Two test conditions selected: • 100% steady-state load; • Load condition with 220% 10-second overload capability. EconoDUAL is a trademark of Infineon Technologies 8 Levett, Howes, Saums – Cooling of IGBT Modules with Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France

Test Bed and Conditions • Air-cooled heat sink operated at 40°C and 150CFM air flow. • All water-cooled liquid cold plates operated at: • Water flow rate of 2 gal/min per cold plate; • Operated in parallel for a 6 gal/min total flow rate; • Maximum air temperature: 40°C; • Maximum temperature rise in heat exchanger: 10°C. • VDF cold plates operated at: • Minimum flow rate of 0.4 gal/min per cold plate; • Operated in parallel for a 1.2 gal/min total flow rate; • Maximum air temperature: 40°C; • Maximum temperature rise in heat exchanger: 10°C. 9 Levett, Howes, Saums – Cooling of IGBT Modules with Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France

Test Bed and Conditions<br />

• <strong>IGBT</strong> <strong>Modules</strong> tested are dual 1700V, 450A in the 122mm x 62mm EconoDUAL<br />

package.<br />

• Three modules are used in one mechanical assembly and can be configured as either:<br />

• Three-phase bridge<br />

• Single dual switch, operating in parallel.<br />

• Functional modules for system testing:<br />

• Supplied as production modules but <strong>with</strong>out internal protective gel;<br />

• Painted for improved emissivity;<br />

• Die temperatures measured <strong>with</strong> thermal camera.<br />

• Maximum module load measured for each type of heat sink or cold plate to produce an<br />

<strong>IGBT</strong> junction temperature (T J ) of 120°C.<br />

• Two test conditions selected:<br />

• 100% steady-state load;<br />

• Load condition <strong>with</strong> 220% 10-second overload capability.<br />

EconoDUAL is a trademark of Infineon Technologies<br />

8 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France

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