Cooling IGBT Modules with VDF - Parker
Cooling IGBT Modules with VDF - Parker Cooling IGBT Modules with VDF - Parker
Water-based Cooling System • Cons • Fluid leaks can cause serious damage and failure of equipment. • Water can be corrosive and has potential for biological contamination. • High flow rates require large pumps, power supply, pipe diameters and reservoir. • Protection required as a pressurized system. • If operated in series there is thermal stacking. • Potential for condensation. • Ethylene glycol is not environmentally friendly. 26 Levett, Howes, Saums – Cooling of IGBT Modules with Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
VDF-Based Cooling System • Pros • Very good thermal performance/cost ratio. • Under cyclical load, reduced module baseplate ΔT.* • Low flow rates allow use of: • Small, low-power pump • Small reservoir • Reduced-diameter tubing. • Lower overall system weight. • Dielectric coolant reduces risk of short circuits or damage in case of a leak. • Heat exchanger location can be remote from heat sources. • Low thermal stacking for liquid cold plates operated in series. • Allows use of simple quick-disconnect system for coolant loop. * For module failure mode due to insulator-to-baseplate delamination, a 10°C reduction can increase life by a factor of three. 27 Levett, Howes, Saums – Cooling of IGBT Modules with Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
- Page 1 and 2: Cooling of IGBT Modules with Vapori
- Page 3 and 4: A Brief History • 1999: Thermal F
- Page 5 and 6: How does VDF cooling work? Pump 3 x
- Page 7 and 8: Key Points: VDF Cooling Loop • VD
- Page 9 and 10: Test Bed and Conditions • Air-coo
- Page 11 and 12: Phase Module: 1200VAC 450A EconoDUA
- Page 13 and 14: IGBT Thermal Image at Load Thermal
- Page 15 and 16: Case A: Air-Cooled Extruded Aluminu
- Page 17 and 18: Case D: Water-cooled Custom Aluminu
- Page 19 and 20: Case E: Prototype VDF Liquid Cold P
- Page 21 and 22: Heat Sink/Cold Plate Performance Co
- Page 23 and 24: Cooling Loop Comparison Table Table
- Page 25: Water-based Cooling System • Pros
- Page 29 and 30: 750kW/1000hp Proof-of-Concept Inver
- Page 31 and 32: VDF Cooling Loop for Single Pluggab
- Page 33 and 34: Mérci! 33 Levett, Howes, Saums - C
- Page 35 and 36: Appendix 35 Levett, Howes, Saums -
- Page 37: Vaporizable Dielectric Fluids • A
<strong>VDF</strong>-Based <strong>Cooling</strong> System<br />
• Pros<br />
• Very good thermal performance/cost ratio.<br />
• Under cyclical load, reduced module baseplate ΔT.*<br />
• Low flow rates allow use of:<br />
• Small, low-power pump<br />
• Small reservoir<br />
• Reduced-diameter tubing.<br />
• Lower overall system weight.<br />
• Dielectric coolant reduces risk of short circuits or<br />
damage in case of a leak.<br />
• Heat exchanger location can be remote from heat sources.<br />
• Low thermal stacking for liquid cold plates operated in series.<br />
• Allows use of simple quick-disconnect system for coolant loop.<br />
* For module failure mode due to insulator-to-baseplate delamination, a 10°C reduction<br />
can increase life by a factor of three.<br />
27 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
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