Cooling IGBT Modules with VDF - Parker
Cooling IGBT Modules with VDF - Parker
Cooling IGBT Modules with VDF - Parker
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Heat Sinks and Cold Plates Tested<br />
• Case A – Air-cooled Heat Sink:<br />
• Extruded aluminum monolithic heat sink, traditional stock design;<br />
• 14:1 fin length to pitch ratio.<br />
• Case B – Standard water-cooled liquid cold plate:<br />
• Extruded aluminum plate, traditional stock design;<br />
• Press-fit continuous copper tubing in back side of plate.<br />
• Case C – Custom water-cooled liquid cold plate:<br />
• Machined aluminum plate;<br />
• Continuous copper D-shaped tubing epoxy-bonded into device mounting surface of<br />
the plate;<br />
• Tubing circuit aligned <strong>with</strong> device die locations for maximum heat transfer.<br />
• Case D – Custom water-cooled liquid cold plate:<br />
• Machined aluminum plate <strong>with</strong> machined cavity;<br />
• Aluminum offset convoluted fin brazed into machined cavity.<br />
• Case E – Custom <strong>VDF</strong> cold plate:<br />
• Machined copper cold plate <strong>with</strong> machined cavity;<br />
• Copper offset convoluted fin brazed into machined cavity.<br />
10 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
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