Cooling IGBT Modules with VDF - Parker
Cooling IGBT Modules with VDF - Parker Cooling IGBT Modules with VDF - Parker
Cooling of IGBT Modules with Vaporizable Dielectric Fluid (VDF) David B. Levett and Jeremy C. Howes Parker SSD Drives, Charlotte NC USA David L. Saums DS&A LLC, Amesbury MA USA IMAPS France Advanced Technology Workshop on Thermal Management 2008, La Rochelle, France 30-31 January 2008
- Page 2 and 3: Outline and Goals • Vaporizable d
- Page 4 and 5: A Brief History • Drive system de
- Page 6 and 7: Key Points: VDF Cooling Loop • Wa
- Page 8 and 9: Test Bed and Conditions • IGBT Mo
- Page 10 and 11: Heat Sinks and Cold Plates Tested
- Page 12 and 13: IGBT Internal View Open module show
- Page 14 and 15: IGBT Die Layout Die layout and equi
- Page 16 and 17: Case B: Water-Cooled Continuous Cop
- Page 18 and 19: Case E: Prototype VDF Copper Offset
- Page 20 and 21: Case E: Prototype VDF Copper Convol
- Page 22 and 23: Heat Sink/Cold Plate Performance Co
- Page 24 and 25: Forced Air Cooling System Pros •
- Page 26 and 27: Water-based Cooling System • Cons
- Page 28 and 29: VDF-Based Cooling System • Cons
- Page 30 and 31: 750kW/1000HP Proof-of-Concept Drive
- Page 32 and 33: The Future VDF cooling offers the d
- Page 34 and 35: Contact Information: Parker Hannifi
- Page 36 and 37: Cross Section of a Complete Three-p
<strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid (<strong>VDF</strong>)<br />
David B. Levett and Jeremy C. Howes<br />
<strong>Parker</strong> SSD Drives, Charlotte NC USA<br />
David L. Saums<br />
DS&A LLC, Amesbury MA USA<br />
IMAPS France Advanced Technology Workshop on Thermal<br />
Management 2008, La Rochelle, France 30-31 January 2008
Outline and Goals<br />
• Vaporizable dielectric fluid (<strong>VDF</strong>) concept:<br />
• Explain how a <strong>VDF</strong>-based cooling system operates;<br />
• Illustrate air-cooled heat sinks and liquid cold plate designs developed.<br />
• Show comparative test results for three cooling solutions:<br />
• Traditional forced-air cooling (as used in production drive systems)<br />
• Water/ethylene glycol and traditional liquid cooling<br />
• <strong>VDF</strong>-based liquid cold plates and cooling system<br />
• List positive and negative attributes of each system solution<br />
• Show test data to indicate <strong>VDF</strong> cooling system technical attributes.<br />
• Demonstrate a complete proof-of-concept 750kW/1000HP inverter design utilizing a<br />
<strong>VDF</strong> cooling system.<br />
2 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
A Brief History<br />
• 1999: Thermal Form & Function LLC contracts <strong>with</strong> Compaq Computer Corporation to<br />
develop pumped liquid multiphase cooling (PLMC) system concept.<br />
• 2004: TF&F demonstrates enterprise server cabinet PLMC system prototypes<br />
• 2005: <strong>Parker</strong> Hannifin acquires Eurotherm/SSD Drives.<br />
• 2007: <strong>Parker</strong> Hannifin Corporation and Thermal Form & Function LLC announce<br />
collaboration to develop and patent vaporizable dielectric fluid (<strong>VDF</strong>) cooling system for<br />
high performance server processors:<br />
• Highly constrained physical space availability <strong>with</strong>in server cabinets<br />
• Highly constrained cost targets for commercial applications<br />
• Very high heat flux<br />
• Processor die power level: 400W.<br />
• 2007: <strong>Parker</strong> Hannifin Corporation initiates joint development project to design<br />
production <strong>VDF</strong>-cooled drive system.<br />
• Question: “Can <strong>VDF</strong> technology be scaled up to cool power semiconductor<br />
devices?”<br />
3 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
A Brief History<br />
• Drive system development partners:<br />
• <strong>Parker</strong> Hannifin Climate Systems Division (New Haven IN USA) – Component<br />
development and manufacturing:<br />
Liquid cold plates<br />
Separator<br />
Condensor<br />
Quick-disconnects<br />
Fluid distributors<br />
• <strong>Parker</strong> Hannifin SSD Division (Charlotte NC USA) – <strong>IGBT</strong> drive system development<br />
• <strong>Parker</strong> Hannifin Corporation – Pump design and development<br />
• Thermal Form & Function LLC (Manchester MA USA) – Liquid cold plate,<br />
condensor, cooling system thermal analysis and component design<br />
<strong>VDF</strong>: Vaporizable Dielectric Fluid<br />
4 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
How does <strong>VDF</strong> cooling work?<br />
Pump<br />
3 x cold<br />
plates<br />
Vapor<br />
Air Cooled<br />
CONDENSER<br />
Liquid<br />
<strong>VDF</strong> cooling loop <strong>with</strong> a pump, three cold plates and air cooled condenser.<br />
5 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Key Points: <strong>VDF</strong> <strong>Cooling</strong> Loop<br />
• Water system:<br />
• For water, 4.2J (0.00398 BTU) are required to raise the temperature of 1g (0.035 oz.)<br />
of water by 1°C (1.8°F).<br />
• Therefore, to dissipate 1kW (3414 BTU/hr.) of power, a flow rate of 2.9 l/min. (46<br />
gal./hr.) is required, assuming a 5°C increase in water temperature.<br />
• <strong>VDF</strong> system:<br />
• Uses liquid-to-gas phase change of common refrigerant such as R134-A.<br />
• As long as there is fluid in the cold plate, the cold plate surface will be held close to<br />
the boiling point of the fluid.<br />
• For 40°C refrigerant, 151J (0.143 BTU) are required to convert 1g (0.035 oz.) of<br />
refrigerant from liquid to gas.<br />
• Therefore, to dissipate 1kW (3414 BTU/hr.) of power, a flow-rate of 0.35 l/min. (5.8<br />
gal./hr.) is required.<br />
• Lower flow rates for <strong>VDF</strong> system equate to a smaller pump, power supply, reservoir, and<br />
smaller tube diameters.<br />
6 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Key Points: <strong>VDF</strong> <strong>Cooling</strong> Loop<br />
• <strong>VDF</strong> system:<br />
• Pressure and temperature are allowed to “float” relative to ambient conditions.<br />
• System design target: System is designed for maximum power load at maximum<br />
ambient conditions.<br />
• No compression cycle: System cannot cool below heat exchanger medium<br />
temperature. This is not refrigeration.<br />
• Gravity fed:<br />
• Pump must be located below liquid cold plates in the loop.<br />
• Heat exchanger must be located above the liquid cold plates in the loop.<br />
• Heat exchanger can be:<br />
• Air-to-fluid (i.e., traditional tube-and-fin);<br />
• Water-to-fluid (e.g., shell-and-tube for external chilled water or tower).<br />
• System design engineer may set the refrigerant saturation temperature by adjusting<br />
system operating pressure:<br />
• Adds additional degree of freedom for system design;<br />
• Higher pressure will increase saturation temperature, enabling a higher junction<br />
temperature and smaller condenser and/or lower airflow.<br />
• Refrigerant or other dielectric vaporizable fluid will tolerate greater temperature<br />
extremes for outdoor applications.<br />
• “Refrigerant agnostic”: Alternative refrigerants and dielectric fluids may be selected,<br />
<strong>with</strong> some changes required in system component design.<br />
7 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Test Bed and Conditions<br />
• <strong>IGBT</strong> <strong>Modules</strong> tested are dual 1700V, 450A in the 122mm x 62mm EconoDUAL<br />
package.<br />
• Three modules are used in one mechanical assembly and can be configured as either:<br />
• Three-phase bridge<br />
• Single dual switch, operating in parallel.<br />
• Functional modules for system testing:<br />
• Supplied as production modules but <strong>with</strong>out internal protective gel;<br />
• Painted for improved emissivity;<br />
• Die temperatures measured <strong>with</strong> thermal camera.<br />
• Maximum module load measured for each type of heat sink or cold plate to produce an<br />
<strong>IGBT</strong> junction temperature (T J ) of 120°C.<br />
• Two test conditions selected:<br />
• 100% steady-state load;<br />
• Load condition <strong>with</strong> 220% 10-second overload capability.<br />
EconoDUAL is a trademark of Infineon Technologies<br />
8 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Test Bed and Conditions<br />
• Air-cooled heat sink operated at 40°C and 150CFM air flow.<br />
• All water-cooled liquid cold plates operated at:<br />
• Water flow rate of 2 gal/min per cold plate;<br />
• Operated in parallel for a 6 gal/min total flow rate;<br />
• Maximum air temperature: 40°C;<br />
• Maximum temperature rise in heat exchanger: 10°C.<br />
• <strong>VDF</strong> cold plates operated at:<br />
• Minimum flow rate of 0.4 gal/min per cold plate;<br />
• Operated in parallel for a 1.2 gal/min total flow rate;<br />
• Maximum air temperature: 40°C;<br />
• Maximum temperature rise in heat exchanger: 10°C.<br />
9 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Heat Sinks and Cold Plates Tested<br />
• Case A – Air-cooled Heat Sink:<br />
• Extruded aluminum monolithic heat sink, traditional stock design;<br />
• 14:1 fin length to pitch ratio.<br />
• Case B – Standard water-cooled liquid cold plate:<br />
• Extruded aluminum plate, traditional stock design;<br />
• Press-fit continuous copper tubing in back side of plate.<br />
• Case C – Custom water-cooled liquid cold plate:<br />
• Machined aluminum plate;<br />
• Continuous copper D-shaped tubing epoxy-bonded into device mounting surface of<br />
the plate;<br />
• Tubing circuit aligned <strong>with</strong> device die locations for maximum heat transfer.<br />
• Case D – Custom water-cooled liquid cold plate:<br />
• Machined aluminum plate <strong>with</strong> machined cavity;<br />
• Aluminum offset convoluted fin brazed into machined cavity.<br />
• Case E – Custom <strong>VDF</strong> cold plate:<br />
• Machined copper cold plate <strong>with</strong> machined cavity;<br />
• Copper offset convoluted fin brazed into machined cavity.<br />
10 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Phase Module: 1200VAC 450A EconoDUAL<br />
Three module assembly. Bus capacitors at top. Gel-less painted module on right. Copper tube bonded<br />
water cold plate fitted. (Liquid cold plates illustrated are Case C – Custom machined aluminum cold plate.)<br />
11 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
<strong>IGBT</strong> Internal View<br />
Open module showing DCB and die layout. Larger die are <strong>IGBT</strong>’s and smaller die diodes.<br />
12 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
<strong>IGBT</strong> Thermal Image at Load<br />
Thermal image of module die operating at load<br />
13 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
<strong>IGBT</strong> Die Layout<br />
Die layout and equivalent thermal image<br />
14 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Case A: Air-Cooled Extruded Aluminum Heat Sink<br />
Aluminum extruded air-cooled heatsink<br />
15 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Case B: Water-Cooled Continuous Copper Tube Aluminum Liquid Cold Plate<br />
Aluminum water-cooled plate <strong>with</strong> press-fitted copper tube inserts<br />
16 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Case D: Water-cooled Custom Aluminum Convoluted Fin Liquid Cold Plate<br />
Aluminum water cold plate <strong>with</strong> inserted aluminum convoluted fin pack brazed into cavity<br />
17 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Case E: Prototype <strong>VDF</strong> Copper Offset Convoluted Fin/Copper Liquid Cold Plate<br />
Prototype single <strong>VDF</strong> copper cold plate <strong>with</strong> copper convoluted fin brazed into cavity. (Test cold plate shown<br />
has a thicker plate to allow for insertion of thermocouples.) <strong>IGBT</strong> module attached.<br />
18 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Case E: Prototype <strong>VDF</strong> Liquid Cold Plate – Thermocouple Locations<br />
<strong>VDF</strong> Cold plate thermocouple locations under <strong>IGBT</strong> and diode die<br />
19 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Case E: Prototype <strong>VDF</strong> Copper Convoluted Fin/Copper Cold Plate – Internal View<br />
<strong>VDF</strong> prototype cold plate <strong>with</strong> a clear cover and convoluted copper fin<br />
pack. (Note: Case E1 and E2 test data reflect straight fin pack.)<br />
Convoluted copper fin pack for <strong>VDF</strong> cold plate<br />
used for test data for Case E1 and E2<br />
20 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Heat Sink/Cold Plate Performance Comparison Table<br />
Table 1<br />
Module Loss (W)<br />
for 120°C junction,<br />
Steady State<br />
Module Loss (W) for<br />
120°C junction,<br />
220% overload<br />
Heat Sink/Cold<br />
Plate Resistance +<br />
21 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France<br />
°C /W<br />
Equivalent rms output<br />
current* and ratio to air,<br />
Steady State<br />
Equivalent rms output<br />
current* and ratio to air,<br />
220% overload<br />
Case A: Air Cooled 600 405 0.094 194/1.0 120/1.0<br />
Case B: Water-cooled<br />
Aluminum Cold Plate<br />
(Press-fit Standard<br />
Copper Tubing)<br />
Case C: Water-Cooled<br />
Aluminum Cold Plate<br />
(Bonded Copper<br />
D-Shape Tubing)<br />
Case D: Water-Cooled<br />
Aluminum Cold Plate<br />
(Brazed Convoluted<br />
Fin, Machined Cavity)<br />
Case E1: <strong>VDF</strong> Copper<br />
Cold Plate<br />
(450A device)<br />
Case E2: <strong>VDF</strong> Copper<br />
Cold Plate<br />
(225A device)<br />
736 437 0.051 220/1.13 130/1.08<br />
1070 500 0.035 295/1.52 152/1.27<br />
1040 490 0.037 293/1.51 150/1.25<br />
1461 660 0.009 396/2.04 190/1.58<br />
1184 568 0.008 330/1.7 164/1.37<br />
+ Thermal resistance measured to heat sink base.<br />
* Equivalent rms current calculated at 60Hz output, switching at 2kHz <strong>with</strong> a 1000V DC bus.
Heat Sink/Cold Plate Performance Comparison: Additional Capacity Achieved<br />
22 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
<strong>Cooling</strong> Loop Comparison Table<br />
Table 2<br />
Fan/pump<br />
power to<br />
cool 1KW<br />
load (W)<br />
Cost ratio of<br />
complete<br />
cooling system,<br />
<strong>IGBT</strong> modules<br />
Ratio of cooling<br />
system and <strong>IGBT</strong><br />
module cost per amp<br />
Steady State<br />
Ratio of cooling<br />
system and <strong>IGBT</strong><br />
module cost per amp<br />
220% overload<br />
Heat Sink ΔT<br />
during 10s<br />
600W Overload<br />
(°C)<br />
23 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France<br />
Heat Sink ΔT<br />
under module<br />
Steady State<br />
(°C)<br />
Case A: Air Cooled 45 1.0 1.0 1.0 29 23<br />
Case B: Water-cooled<br />
Aluminum Cold Plate<br />
(Press-fit Standard<br />
Copper Tubing)<br />
Case C: Water-Cooled<br />
Aluminum Cold Plate<br />
(Bonded Copper<br />
D-Shape Tubing)<br />
Case D: Water-Cooled<br />
Aluminum Cold Plate<br />
(Brazed Convoluted<br />
Fin, Machined Cavity)<br />
Case E1: <strong>VDF</strong> Copper<br />
Cold Plate<br />
(450A device)<br />
Case E2: <strong>VDF</strong> Copper<br />
Cold Plate<br />
(225A device)<br />
295 1.3 0.87 0.83 18 18<br />
203 1.5 1.01 0.84 20 19<br />
209 1.7 0.94 0.74 19 23<br />
12 1.3 1.57 1.22 5 6<br />
15 0.95 1.79 1.44 5 4
Forced Air <strong>Cooling</strong> System<br />
Pros<br />
• Low cost heatsinks and fans.<br />
• Large supplier base and range of options.<br />
• Air can cool other components such as bus bars,<br />
electronic circuits.<br />
• Low maintenance.<br />
• Very broad design knowledge base.<br />
Cons<br />
• Not very efficient for heat transfer.<br />
• Large volume of air requires ducting which can impose<br />
constraints on mechanical layout and design.<br />
• Space inefficient.<br />
• Air can contain water/contamination.<br />
• Acoustical noise.<br />
• Performance is affected by altitude.<br />
24 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Water-based <strong>Cooling</strong> System<br />
• Pros<br />
• Water is readily available.<br />
• Choice of liquid cold plate suppliers <strong>with</strong><br />
different price/performance ratios.<br />
• Small size and low weight of cold plates.<br />
• Heat exchanger can be placed remote to<br />
heat source.<br />
25 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Water-based <strong>Cooling</strong> System<br />
• Cons<br />
• Fluid leaks can cause serious damage and failure of equipment.<br />
• Water can be corrosive and has potential for biological contamination.<br />
• High flow rates require large pumps, power supply, pipe diameters and reservoir.<br />
• Protection required as a pressurized system.<br />
• If operated in series there is thermal stacking.<br />
• Potential for condensation.<br />
• Ethylene glycol is not environmentally friendly.<br />
26 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
<strong>VDF</strong>-Based <strong>Cooling</strong> System<br />
• Pros<br />
• Very good thermal performance/cost ratio.<br />
• Under cyclical load, reduced module baseplate ΔT.*<br />
• Low flow rates allow use of:<br />
• Small, low-power pump<br />
• Small reservoir<br />
• Reduced-diameter tubing.<br />
• Lower overall system weight.<br />
• Dielectric coolant reduces risk of short circuits or<br />
damage in case of a leak.<br />
• Heat exchanger location can be remote from heat sources.<br />
• Low thermal stacking for liquid cold plates operated in series.<br />
• Allows use of simple quick-disconnect system for coolant loop.<br />
* For module failure mode due to insulator-to-baseplate delamination, a 10°C reduction<br />
can increase life by a factor of three.<br />
27 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
<strong>VDF</strong>-Based <strong>Cooling</strong> System<br />
• Cons<br />
• Medium and pumps not as readily available.<br />
• Protection required as a pressurized system.<br />
• Very narrow design and application knowledge base.<br />
• Gravity feed requirement restricts large changes in operating orientation and places<br />
limits on mechanical design and system layout.<br />
• R134A is a greenhouse gas.<br />
28 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
750kW/1000hp Proof-of-Concept Inverter <strong>with</strong> <strong>VDF</strong> <strong>Cooling</strong> Loop and Air-based<br />
Heat Exchanger<br />
• Inverter and heat exchanger built into a 500mm wide, 600mm deep and 2000mm tall<br />
enclosure.<br />
• Five pluggable sections:<br />
• Pump module.<br />
• Three <strong>VDF</strong>-cooled inverter phases each <strong>with</strong> three 1700V 450A <strong>IGBT</strong> modules.<br />
• Additional capacitor module.<br />
• 150mm long 50mm diameter pump.<br />
• <strong>Cooling</strong> loop designed for 10kW of losses from <strong>IGBT</strong> modules operating in 50°C<br />
ambient air.<br />
29 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
750kW/1000HP Proof-of-Concept Drive <strong>with</strong> 10kW <strong>VDF</strong> <strong>Cooling</strong> Loop<br />
Fluid to air<br />
heat<br />
exchanger<br />
Vapor liquid<br />
separator<br />
Internal view from back of drive<br />
Scroll fan<br />
for heat<br />
exchanger<br />
Capacitor module<br />
Three inverter<br />
modules<br />
Pump module<br />
Front view of complete drive<br />
30 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
<strong>VDF</strong> <strong>Cooling</strong> Loop for Single Pluggable Phase Assembly<br />
Mechanical mounting frame<br />
<strong>IGBT</strong> module mounted<br />
on cold plate<br />
Exploded cold plate <strong>with</strong> fin pack<br />
Pluggable coolant<br />
inlet connector<br />
Pluggable coolant<br />
outlet connector<br />
31 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
The Future<br />
<strong>VDF</strong> cooling offers the design engineer another level of flexibility and performance<br />
but is not the solution for every application<br />
Arenas which lend themselves to this technology:<br />
• Where weight and size are important.<br />
• Applications which experience high cyclical loads.<br />
• Applications using “live” heatsinks for example <strong>with</strong> puck style devices or for EMC<br />
reduction.<br />
• Designs that require more power output from a given device package for example<br />
increased switching frequency or difficulty in paralleling devices.<br />
• Systems <strong>with</strong> multiple loads in the cooling loop connected in series which also require<br />
low thermal stacking.<br />
• Applications which already have a refrigerant loop.<br />
• Systems that require fast easy servicing and quick connect coolant connectors that can<br />
be used alongside high voltage.<br />
32 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Mérci!<br />
33 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Contact Information:<br />
<strong>Parker</strong> Hannifin Corporation Dale R. Thompson, Business Development Manager<br />
Climate Systems Division E: dale.thompson@parker.com<br />
10801 Rose Avenue www.microsystemscooling.com<br />
New Haven IN 46774 USA<br />
<strong>Parker</strong> SSD Drives Division Jeremy Howes, Senior Mechanical Engineer<br />
<strong>Parker</strong> Hannifin Corporation E: jchowes@parker.com<br />
9225 Forsyth Park Drive<br />
Charlotte NC 28273 USA David B. Levett PhD, R&D Engineer<br />
E: dblevett@parker.com<br />
DS&A LLC David L. Saums, Principal<br />
100 High Street E: dsaums@dsa-thermal.com<br />
Amesbury MA 01913 USA www.dsa-thermal.com<br />
34 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Appendix<br />
35 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Cross Section of a Complete Three-phase Inverter <strong>with</strong> a <strong>VDF</strong> <strong>Cooling</strong> System<br />
36 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France
Vaporizable Dielectric Fluids<br />
• Available fluids:<br />
• Dupont DP-1<br />
• 3M EMMD Fluoroketones (FK) and Hydrofluoroethers (HFEs):<br />
• Novec<br />
• Solvay Galden<br />
• Others (including other refrigerants in HFC family)<br />
• Certain vaporizable dielectric liquids address Greenhouse Gas (GHG) potential <strong>with</strong><br />
values less than 1.0<br />
• Selection of fluid for <strong>VDF</strong> systems requires consideration for system design:<br />
• Fluid heat capacity (as different from water)<br />
• Pump (type of pump, flow-through lubrication and selection of lubricants, and pump<br />
sizing)<br />
• Condenser (sizing)<br />
• Tubing diameter<br />
37 Levett, Howes, Saums – <strong>Cooling</strong> of <strong>IGBT</strong> <strong>Modules</strong> <strong>with</strong> Vaporizable Dielectric Fluid • IMAPS France ATW Thermal 2008 • La Rochelle, France