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328 Electronic Adhesives & Encapsulants as thermal shock. Most thermal cycling is done for 1000 cycles. The temperature extremes to which the unit is cycled depends on the intended application as follows: The JEDEC definition for Thermal Cycling requires achievement of the temperature limit within 15 minutes. Realistic Representative Accelerated Use Environments Test Condition Application Low High Low High Temp Temp Temp Temp Consumer [ 0°C ] [ +60°C ] [ 0°C] [+100°C ] Automotive [ -40°C ] [+125°C ] [ -40°C] [+105°C ] Under Hood [ -55°C ] [+150°C ] [ -65°C] [+150°C ] Industrial [ -55°C] [ +95°C ] [ -50°C] [+150°C ] Telecomm [ -40°C ] [ +85°C ] [ -50°C] [+125°C ] Military [ -55°C] [ +95°C ] [ -65°C] [+150°C ] THERMAL SHOCK: Refers to rapidly moving a test unit from a chamber at high temperature to another chamber at low temperature. The chambers can be air to air, or liquid to liquid. Heat transfer, and stress on the unit, is much higher when the unit is dipped into a liquid. The liquid/liquid test is more severe than the air/air test even if the temperature range is the same. TGA (Thermogravimetric Analyzer): Measures the weight loss of a Polymer material experiences as it is exposed to increasing temperature. There are three characteristics of the material that are of interest: 1. How much weight loss is there as the material cures (since this loss is almost always a gas, it causes voids if it is high). 2. After curing, if the material is heated above the cure temperature, does it continue to lose weight (an indication that the cure was not complete)? 3. Heat the material to very high temperatures and see at what temperature it begins to deteriorate (when the polymer breaks down it will exhibit significant weight loss). TMA (Thermal Mechanical Analyzer): Instrument that measures the CTE of a material as a function of temperature. Unlike most common materials, polymer materials exhibit a relatively sharp change in their CTE as the temperature is increased. The temperature at which this change in CTE occurs is referred to as glass transition temperature. For more information please call (800) 523-2575 or visit: www.polysciences.com THERMOSET: Polymer material which, once cured remains a solid at all temperatures. Thermosetting materials will remain solid until they char (burn) if the temperature is raised high enough, but they will never become liquid again. THIXOTROPIC INDEX: Most liquids exhibit constant resistance to force regardless of how fast the force is applied, e.g.- if you stir a glass of water, no matter how fast you stir, the water will resist the force in the same amount (the viscosity does not change). Some materials (such as most polymers) show a decrease in resistance to force if the speed at which the force is applied increases. If you stir a polymer faster, it gets easier to stir (the viscosity decreases). This phenomenon is called Thixotropic behavior. In order to compare materials, a standard test is used which is called the Thixotropic Index. Viscosity is measured at 0.5 RPM and at 5.0 RPM. The ratio of these two measurements is the Thixotropic index. The Thixotropic Index of a material determines how well the material will perform in several key semiconductor packaging applications. When dispensing die attach adhesive, it is desirable for the material to flow easily from the syringe. The material should stay in place without reflow. This kind of behavior is achieved with a Thixotropic Index of above 5.0 UNDERFILL: When a die is Flip Chip attached, (turned upside down and it’s pads are attached with solder or conductive epoxy) the CTE mismatch of the substrate and die can create stress on the joints causing them to fail over time or extended thermal cycling. In order to reduce the stress, a polymer material is flowed or otherwise placed under the flipped die. This material is called underfill. Underfill that flows under the die after it is attached it is called conventional underfill. Underfill that is placed under the die before the die is attached it is called no-flow underfill. VISCOSITY: The speed of fluid flow and/or the resistance to shear. Usually measured in Centipoise (cps). Water is 1 cps, cooking oil is 200 cps, honey is 50,000 cps peanut butter is 1,000,000 cps. VOID: Any hole in the encapsulant, die attach adhesive or underfill is called a void. Voids can exist because air is trapped during the dispense and bond process (the hole is ‘surrounded’ by polymer and gets trapped) or can form because the polymer releases gas during curing. Voids reduce thermal conductivity and, if severe, can reduce adhesion strength. They can also trap moisture and reduce device reliability. VOLATILES: Any material that evaporates or boils rapidly at the temperatures at which it is used or processed is said to be volatile. Many organic materials which are used as solvents are volatile. If a polymer requires the use of such solvents (because it won’t flow without their help) it is said to contain volatile materials. When volatile materials escape, they can create voids and must be processed accordingly.
Index Terms and Conditions of Sale ...................................................... 330 Trademarks ..................................................................... 332 Technical Data Sheets ............................................................. 333 Alphabetical Index ............................................................... 336 Catalog Number Index ............................................................ 353 CAS Registery Number Index ....................................................... 363 For more information please call (800) 523-2575 or visit: polysciences.com 329
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Chemistry Beyond the Ordinary BioSc
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Table of Contents Using this Catalo
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17. Ratio of Mw/Mn where available
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Biochemicals Buffers Histology & Mi
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BioSciences BioSciences We are plea
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Certified Dyes BioSciences Product
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Biochemicals BioSciences AITC [6241
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Biochemicals BioSciences SAR-GEL ®
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Buffers BioSciences Tris-Borate-EDT
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Histology & Microscopy Certified Dy
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Histology & Microscopy BioSciences
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Histology & Microscopy Capsule Hold
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Histology & Microscopy Bouin’s Fi
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Immunohistochemistry (IHC) BioScien
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Histology & Microscopy Coverslips M
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Histology & Microscopy Plastic Embe
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Histology & Microscopy JB-4 ® Embe
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Histology & Microscopy Poly(ethylen
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Electron Microscopy BioSciences Cat
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Electron Microscopy Grids - Slot Bi
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Electron Microscopy EM Reagents Bio
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Electron Microscopy BioSciences Thi
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Electron Microscopy BioSciences Twe
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Electrophoresis Reagents BioScience
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Fluorescent Dyes & Stains Fluoresce
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Fluorescent Dyes & Stains BioScienc
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Fluorescent Dyes & Stains BioScienc
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Microbiology BioSciences Plastic Mi
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Microbiology BioSciences Microring
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Microbiology BioSciences Urease Str
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Molecular Biology BioSciences Filip
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Molecular Biology Molecular Labelin
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Molecular Biology BioSciences New!
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Molecular Biology BioSciences Estra
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Accessories Equipment Inverted Fluo
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Accessories Gloves BioSciences Glov
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Accessories BioSciences Stirrer, po
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Accessories Tape BioSciences Silver
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Anatomic Pathology Abraxis Diagnost
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Abraxis Diagnostic Kits BioSciences
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Monomers Polymers Adjuncts Polymer
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Monomers Monomers Polysciences stoc
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Monomers Catalog Size Page Acrylic
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Monomers Catalog Size Page Amine Co
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Monomers Catalog Size Page Crosslin
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Monomers Catalog Size Page Polymeri
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Polymerizable Sites Homopolymer Tg
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Monomers Catalog Size Page Styrenic
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Polymerizable Sites Add’l. Reacti
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Monomers New! 1-(Acryloyloxy)-3-(Me
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Monomers Beta-Carboxyethyl Acrylate
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Monomers 1,4-Butanediol dimethacryl
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Monomers 3-Chlorostyrene, 98% [2039
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Monomers Diallylamine, min. 98% [12
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Monomers N-[3-(N,N-Dimethylamino)pr
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Monomers Ethylene glycol diglycidyl
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Monomers 1H,1H,2H,2H-Heptadecafluor
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Monomers N-(2-Hydroxyethyl) Carbazo
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- M - Monomers Magnesium acrylate [
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Monomers Methacryloyl fluoride [381
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Monomers New! Nile Blue Methacrylam
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Monomers 2-Phenoxyethyl methacrylat
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Monomers N-iso-Propylacrylamide [22
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Monomers Triallyl cyanurate [101-37
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Monomers Vinyl azlactone [29513-26-
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Polymers Polymers Selection Guide P
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Acrylate & Methacrylate Polymers Po
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Polymers Catalog Size Page Mol. Wei
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Polylactic Acid & Polyethylene Glyc
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Phenol-functional Polymers Polymers
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Hydroxyl Functional Polymers Polyme
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Mol. Weight Form Comments Poly(2-di
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Alphabetical Listing of Polymers -
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Polymers Dextran, DEAE ether [9015-
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Polymers Halocarbon 700 Oil [Poly(c
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Poly(diallyldimethylammonium chlori
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Polymers Poly(tert-butyl methacryla
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Polymers Poly(2-dimethylaminoethyl
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Poly(ethylene glycol) (n) diacrylat
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Polymers Poly(ethylene glycol) / Po
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Poly(ethylene/vinyl alcohol) [25067
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Polymers Poly(1-glycerol methacryla
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Poly(l-lactide/glycolide) [70:30] [
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Polymers Poly(methyl methacrylate/n
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Polymers Poly(styrene/butadiene) 85
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Polymers Poly(vinyl chloride) [9002
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Polymers Poly(N-vinylpyrrolidone/2-
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Alphabetical Listing of Adjuncts -
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Adjuncts 2-(2’-Hydroxy-5’-methy
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- M•N•O•P - Adjuncts Methyl B
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Standards Polymer Standards & Kits
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Standards Catalog Size MW ~12,000 M
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Molecular Weight Standard Kits Stan
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Organic Intermediates & Specialties
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Stable Isotope Compounds Stable Iso
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Stable Isotope Compounds Biotin-[2H
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Stable Isotope Compounds Cortisol-[
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Stable Isotope Compounds Dehydroepi
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Stable Isotope Compounds Dihydrotes
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Stable Isotope Compounds L-3,3’-D
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Stable Isotope Compounds 17b-Estrad
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Stable Isotope Compounds 6b-Hydroxy
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Stable Isotope Compounds 25-Hydroxy
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Stable Isotope Compounds 2-Methoxy-
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Stable Isotope Compounds 7-Methylxa
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Stable Isotope Compounds Pyridoxal-
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Stable Isotope Compounds Testostero
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Stable Isotope Compounds 1,3,7-Trim
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Stable Isotope Compounds Vitamin D3
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NIST Traceable Size Standards Polys
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Microspheres / Particles Microspher
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How Particles Measure Up Precision
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NIST Traceable Size Standards Micro
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Polystyrene Microspheres Polybead
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Intensity Standards Microspheres &
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Fluorescent Microspheres Microspher
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Fluorescent Microspheres Fluoresbri
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Protein Conjugated Microspheres Mic
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Microspheres & Particles Flow Cytom
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Flow Cytometry Bangs Flow Cytometry
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Flow Cytometry Microspheres & Parti
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Page 301 and 302: Silica & Glass Microspheres Silica
Page 303 and 304: Buffers and Solutions Microspheres
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Page 321 and 322: Wire Bond Encapsulants - NoSWEEP O
Page 323 and 324: Electronic Adhesives & Encapsulants
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Page 327 and 328: Encapsulants for Fragile Substrates
Page 335 and 336: JEDEC Reference Guide IPC/JEDEC J-S
Page 339 and 340: EXTRACTABLE IONS: Ions in a materia
Page 341: SHEAR STRENGTH: Key measure of adhe
Page 345 and 346: Terms and Conditions of Sale Custom
Page 347 and 348: Technical Data Sheets Current list
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Page 351 and 352: Alphabetical Index Product Name Pag
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Page 377 and 378: CAS Number Index CAS Number Index C
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Page 385 and 386: For more information please call (8
Page 387 and 388: Australia BioScientific Pty. Ltd. 2
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