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324 Electronic Adhesives & Encapsulants CONFORMAL COATING: Low viscosity polymer coating typically spun or sprayed onto a device or semiconductor. These coatings protect the devices from the environment or provide electrical insulation value. They do not protect well against physical shock as they are only a thin coating. CTE (Coefficient of Thermal Expansion): How much a material grows when heated (and shrinks when cooled). The unit of measure is parts per million/per degree centigrade. The CTE differences (CTE mismatch) among the materials in a semiconductor package will cause stresses as the part is exposed to temperature changes in its working life. In most cases, it is useful for an epoxy connecting two materials to have a CTE that falls between the CTE’s of the materials being joined. CTE’s of Common Materials ppm/C Silica 1 Silicon Die 2.5 to 4 Alumina 6.5 Gold 14 FR4 Substrate 14 Copper 17 BT Laminate 20 Solder Ball 25 Unfilled Polymer 60 or higher CURE: Non-specific term that is widely used to mean the solidification of a polymer. Curing can be accomplished by applying heat or UV light. Several intermediate steps take place during curing that also have non-specific definitions. When the outside layer of the liquid forms a rubbery coating this is called skinning. When the entire liquid material is solid, but has not yet achieved stable mechanical properties this is called gelling. When the material reaches its final mechanical properties it is said to be cured. CURING PROFILE: Sometimes referred to as cure cycle or cure schedule, defines the time and temperature required to change the state of a material to achieve its best-desired performance characteristics. DAM: A wall of material around the perimeter of a device. The dam is formed by dispensing a high viscosity material through a single nozzle that traces a pattern around the device. The dam’s main function is to contain a low viscosity fill material that is applied to encapsulate the device. DIE: A single semiconductor cut from a wafer. For more information please call (800) 523-2575 or visit: www.polysciences.com DIE ATTACH: Adhesive that bonds the semiconductor die to the substrate. Can be thermally conductive or nonthermally conductive. DIELECTRIC CONSTANT: Ratio of the capacitance of a material (materials that do not conduct electricity) to the capacitance of air. A measure of the insulating strength of a dielectric material. DIELECTRIC LOSS: Electric energy transformed into heat in a dielectric subjected to changing electric fields. The amount of electrical energy lost to the dielectric. DSC (DYNAMIC SCANNING CALORIMETER): Analytical instrument that measures the heat absorbed or released by a material as it’s temperature is raised at a controlled rate. A significant change in the graph of this measure indicates a chemical reaction is occurring. This measure is used to determine the temperature at which an epoxy material will change from liquid to solid. This instrument also measures the percentage cure of epoxy materials. DTA (DYNAMIC THERMAL ANALYSIS): DTA is an analytical instrument used to measure the effects of temperature on the performance of materials. It is key to determining the temperature at which a material changes phase, such as from a glass-like solid to a soft, rubbery condition. The temperature at which this transition occurs is referred to as the glass transition temperature, or Tg. This instrument can also measure modulus. It is an extension to the older means of using a TMA (Thermal Mechanical Analyzer) for some of these measurements. ENCAPSULANT: A material that seals or covers a semiconductor to provide mechanical and environmental protection. Typical materials are: molding compound, glob top, dam & fill and potting compound. EPOXY: Family of thermosetting resins that are used as the media for bonding and protecting semiconductor devices. The main advantages of epoxy are the ability to form strong bonds to many surfaces, low processing temperature and low cost. Epoxies come in many variations with many different properties. EPOXY ANHYDRIDE: Anhydride is the curing agent most commonly used in semiconductor materials such as die attach adhesive. As a curing agent, it not only causes the polymerization reaction to occur, it becomes a part of the finished compound. The nature of the anhydride reaction is such that it starts to cause the epoxy to change to a solid (gel) at room temperature without the addition of heat.
EXTRACTABLE IONS: Ions in a material that are released in the presence of moisture. Normally measured by placing a material in boiling water for a pre-determined period of time. Then measuring the concentration of the ions in the water. A typical specification will report the ion (K+, Na+, Cl- or F-) as
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Chemistry Beyond the Ordinary BioSc
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Table of Contents Using this Catalo
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17. Ratio of Mw/Mn where available
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Biochemicals Buffers Histology & Mi
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BioSciences BioSciences We are plea
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Certified Dyes BioSciences Product
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Biochemicals BioSciences AITC [6241
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Biochemicals BioSciences SAR-GEL ®
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Buffers BioSciences Tris-Borate-EDT
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Histology & Microscopy Certified Dy
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Histology & Microscopy BioSciences
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Histology & Microscopy Capsule Hold
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Histology & Microscopy Bouin’s Fi
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Immunohistochemistry (IHC) BioScien
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Histology & Microscopy Coverslips M
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Histology & Microscopy Plastic Embe
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Histology & Microscopy JB-4 ® Embe
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Histology & Microscopy Poly(ethylen
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Electron Microscopy BioSciences Cat
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Electron Microscopy Grids - Slot Bi
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Electron Microscopy EM Reagents Bio
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Electron Microscopy BioSciences Thi
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Electron Microscopy BioSciences Twe
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Electrophoresis Reagents BioScience
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Fluorescent Dyes & Stains Fluoresce
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Fluorescent Dyes & Stains BioScienc
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Fluorescent Dyes & Stains BioScienc
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Microbiology BioSciences Plastic Mi
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Microbiology BioSciences Microring
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Microbiology BioSciences Urease Str
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Molecular Biology BioSciences Filip
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Molecular Biology Molecular Labelin
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Molecular Biology BioSciences New!
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Molecular Biology BioSciences Estra
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Accessories Equipment Inverted Fluo
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Accessories Gloves BioSciences Glov
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Accessories BioSciences Stirrer, po
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Accessories Tape BioSciences Silver
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Anatomic Pathology Abraxis Diagnost
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Abraxis Diagnostic Kits BioSciences
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Monomers Polymers Adjuncts Polymer
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Monomers Monomers Polysciences stoc
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Monomers Catalog Size Page Acrylic
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Monomers Catalog Size Page Amine Co
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Monomers Catalog Size Page Crosslin
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Monomers Catalog Size Page Polymeri
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Polymerizable Sites Homopolymer Tg
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Monomers Catalog Size Page Styrenic
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Polymerizable Sites Add’l. Reacti
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Monomers New! 1-(Acryloyloxy)-3-(Me
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Monomers Beta-Carboxyethyl Acrylate
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Monomers 1,4-Butanediol dimethacryl
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Monomers 3-Chlorostyrene, 98% [2039
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Monomers Diallylamine, min. 98% [12
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Monomers N-[3-(N,N-Dimethylamino)pr
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Monomers Ethylene glycol diglycidyl
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Monomers 1H,1H,2H,2H-Heptadecafluor
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Monomers N-(2-Hydroxyethyl) Carbazo
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- M - Monomers Magnesium acrylate [
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Monomers Methacryloyl fluoride [381
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Monomers New! Nile Blue Methacrylam
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Monomers 2-Phenoxyethyl methacrylat
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Monomers N-iso-Propylacrylamide [22
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Monomers Triallyl cyanurate [101-37
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Monomers Vinyl azlactone [29513-26-
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Polymers Polymers Selection Guide P
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Acrylate & Methacrylate Polymers Po
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Polymers Catalog Size Page Mol. Wei
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Polylactic Acid & Polyethylene Glyc
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Phenol-functional Polymers Polymers
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Hydroxyl Functional Polymers Polyme
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Mol. Weight Form Comments Poly(2-di
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Alphabetical Listing of Polymers -
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Polymers Dextran, DEAE ether [9015-
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Polymers Halocarbon 700 Oil [Poly(c
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Poly(diallyldimethylammonium chlori
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Polymers Poly(tert-butyl methacryla
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Polymers Poly(2-dimethylaminoethyl
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Poly(ethylene glycol) (n) diacrylat
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Polymers Poly(ethylene glycol) / Po
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Poly(ethylene/vinyl alcohol) [25067
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Polymers Poly(1-glycerol methacryla
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Poly(l-lactide/glycolide) [70:30] [
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Polymers Poly(methyl methacrylate/n
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Polymers Poly(styrene/butadiene) 85
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Polymers Poly(vinyl chloride) [9002
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Polymers Poly(N-vinylpyrrolidone/2-
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Alphabetical Listing of Adjuncts -
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Adjuncts 2-(2’-Hydroxy-5’-methy
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- M•N•O•P - Adjuncts Methyl B
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Standards Polymer Standards & Kits
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Standards Catalog Size MW ~12,000 M
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Molecular Weight Standard Kits Stan
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Organic Intermediates & Specialties
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Stable Isotope Compounds Stable Iso
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Stable Isotope Compounds Biotin-[2H
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Stable Isotope Compounds Dehydroepi
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Stable Isotope Compounds Dihydrotes
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Stable Isotope Compounds L-3,3’-D
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Stable Isotope Compounds 17b-Estrad
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Stable Isotope Compounds 6b-Hydroxy
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Stable Isotope Compounds 25-Hydroxy
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Stable Isotope Compounds 2-Methoxy-
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Stable Isotope Compounds 7-Methylxa
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Stable Isotope Compounds Testostero
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Stable Isotope Compounds 1,3,7-Trim
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Stable Isotope Compounds Vitamin D3
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NIST Traceable Size Standards Polys
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Microspheres / Particles Microspher
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How Particles Measure Up Precision
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NIST Traceable Size Standards Micro
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Polystyrene Microspheres Polybead
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Intensity Standards Microspheres &
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Fluorescent Microspheres Microspher
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Fluorescent Microspheres Fluoresbri
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Protein Conjugated Microspheres Mic
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Microspheres & Particles Flow Cytom
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Flow Cytometry Bangs Flow Cytometry
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Flow Cytometry Microspheres & Parti
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Page 323 and 324: Electronic Adhesives & Encapsulants
Page 325 and 326: NoSWEEP Wire Bond Encapsulant Elec
Page 327 and 328: Encapsulants for Fragile Substrates
Page 335 and 336: JEDEC Reference Guide IPC/JEDEC J-S
Page 337: Electronic Adhesives & Encapsulants
Page 341 and 342: SHEAR STRENGTH: Key measure of adhe
Page 343 and 344: Index Terms and Conditions of Sale
Page 345 and 346: Terms and Conditions of Sale Custom
Page 347 and 348: Technical Data Sheets Current list
Page 349 and 350: Technical Data Sheets Potting Compo
Page 351 and 352: Alphabetical Index Product Name Pag
Page 367 and 368: Catalog Number Index Cat # Page Cat
Page 377 and 378: CAS Number Index CAS Number Index C
Page 379 and 380: CAS Number Index CAS # Page CAS # P
Page 381 and 382: NOTES For more information please c
Page 383 and 384: NOTES For more information please c
Page 385 and 386: For more information please call (8
Page 387 and 388: Australia BioScientific Pty. Ltd. 2
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