BioSciences - Polysciences, Inc.

Electronic Adhesives & Encapsulants
Electronic Grade Potting and Encapsulation Materials
Our general potting and encapsulation materials are designed for a variety of applications that require
low cost solutions while still maintaining above average performance. One kit is approximately 1/2
gallon of potting compound.
Epoxy Potting Compounds
Specific
Gravity
Viscosity
@ 25°C
(CPS)
Tg
(°C)
Modulus
@ 25°C
(Mpa)
CTE a1
(ppm/°C)
CTE a2
(ppm/°C)
Cure
Schedule
(°C)
1.15** 8750** 140 10 55 200 120min @ 110+°C
30min @ 170°C
Comments: High adhesion to SS, other metals & excellent against H 2 0 exposure, sterilization. Designed for
medical and microelectronic applications.
1.76** 500k** 48 15 34 134 7 days @ RT or elevated
temps Gel