BioSciences - Polysciences, Inc.
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BioSciences - Polysciences, Inc.

BioSciences - Polysciences, Inc.

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314<br />

Electronic Adhesives & Encapsulants<br />

Epoxy Encapsulants, Adhesives and Potting Compounds for<br />

Microelectronics, Military and Medical Applications (continued)<br />

Specific<br />

Gravity<br />

1.2 10K 85.0 35 21 55 1.4 120 min @<br />

Comments: High temp product.<br />

150°C<br />

1.14* 400* 129 6.5 58 232 NA 7 days @ RT<br />

or elevated<br />

Comments: Low viscosity, cost effective potting compound. Quick gel time at RT. temps<br />

1.15* 8750* 140 10 55 200 NA 120min @ 110°C<br />

+30min @ 170°C<br />

Comments: High adhesion to SS & other metals. Excellent against H 2 0 exposure, sterilization. Designed for medical and<br />

microelectronic applications.<br />

NEW! High Performance Encapsulants and Adhesives<br />

Viscosity<br />

@ 25°C<br />

(CPS)<br />

150k 20mins @150°C 1 part paste<br />

50k<br />

4 hours @ RT or<br />

30mins @ 60°C<br />

2k 5mins @150°C<br />

* Mixed values of 2 part system.<br />

1 part paste<br />

2 part, low<br />

viscosity<br />

Gel 8hours @ RT 2 part gel<br />

1k 10sec. UV 1 part liquid<br />

1k 10sec. UV 1 part liquid<br />

For more information please call (800) 523-2575 or visit: www.polysciences.com<br />

240 2 part<br />

260 2 part<br />

260 2 part<br />

high strength metal adhesion. structural epoxy, hi-strength,<br />

high-impact, excellent adhesion.<br />

bonding of dissimilar surfaces, plastics and metals. tough<br />

cure, non-rigid versatile uses.<br />

bonding of metals and thermoset plastics. quick cure, rigid,<br />

high-strength.<br />

bonding of dissimilar surfaces, plastics and metals. quick<br />

setting, acrylic adhesive, versatile uses.<br />

excellent bonding and sealing properties, tough cure,<br />

versatile adhesion.<br />

bonding of engineering thermoplastics, adhesive for hard<br />

to bond substrates.<br />

5k 10sec. UV visible 1 part liquid high Tg UV product. high temp, high-strength cure.<br />

10k<br />

Viscosity<br />

@ 25°C<br />

(CPS)<br />

Tg<br />

(°C)<br />

Modulus<br />

@ 25°C<br />

(Mpa)<br />

2hours @ 80°C or<br />

24 hours @ RT<br />

CTE a1<br />

(ppm/°C)<br />

5k 24hours @ RT 2 part liquid<br />

CTE a2<br />

(ppm/°C)<br />

Cure Form Properties<br />

Thermal<br />

Cond.<br />

(W/m°K)<br />

Cure<br />

Schedule<br />

(°C)<br />

Reflow<br />

Temp<br />

(°C)<br />

2 part liquid high thermal conductivity, metal free, very flexible.<br />

Form<br />

fire retardant general use product. versatile encapsulant,<br />

adhesive.<br />

Catalog # Size<br />

PC620K-1 2 kg kit<br />

PC310K-1 2 kg kit<br />

PC300K-1 2 kg kit<br />

PC500 3x30cc<br />

PC550 3x50cc<br />

Dual syringe<br />

1kg kit<br />

PC570 1 kg kit<br />

PC800 10x50cc<br />

PC7010 3x30cc<br />

1kg<br />

PC7020 3x30cc<br />

1kg<br />

PC7030 3x30cc<br />

1kg<br />

PC440 1 kg<br />

PC200 2 kg

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